JPS628402A - Lamp apparatus for vehicle - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a vehicle lamp that uses a light emitting diode as a light source, and is improved in particular to prevent a decrease in the amount of light due to heat generation during lighting.

[Conventional technology]

In recent years, with the development of semiconductor technology, high-brightness light-emitting diodes have been developed, and they have become available at low prices.As a result, vehicle lights, such as brake lights, taillights, and even brake lights installed on the outside of the rear of the car body have become popular. It is being considered as a light source for lighting devices called high-makund stop lamps. The main reason for this is that in addition to the fact that high-brightness lamps are now available at low prices, they also have a semi-permanent lifespan because they do not have a filament unlike ordinary lamps.

There is no need to replace the filament because there is no breakage, and there are fewer restrictions on the lamp itself and its mounting location.The lamp can be made thinner and installation is easier.Compared to light bulbs, it generates significantly less heat and can be made smaller. This is due to its excellent characteristics, and can be said to point to the direction of future lighting equipment.

[Problem that the invention seeks to solve]

However, although light emitting diodes generate significantly less heat than ordinary light bulbs, in lamps incorporating light emitting diodes of several hundred valences, heat generation from the diodes themselves and the resistors for lighting the diodes poses a problem. That is, when the temperature inside the lamp body, which generates a large amount of heat, rises, there is a problem that the luminous efficiency decreases and the lamp becomes dark, so it is necessary to take some kind of heat dissipation measure.

[Means for solving problems]

The vehicle lamp according to the present invention was made to solve the above-mentioned problems, and in the vehicle lamp which uses a plurality of light emitting diodes as a light source, each of the light emitting diodes is connected to a semiconductor chip and a lead wire. IC used for connection
They are connected in series by an IJ-shaped frame, and the frame also functions as a heat sink.

[Effect]

In the present invention, since the ICl7-de frame has a heat dissipation function, it effectively dissipates the heat generated by the light emitting diode and prevents a decrease in luminous efficiency.

〔Example〕

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

FIG. 1 is a sectional view showing an embodiment of a vehicle lamp according to the present invention, and FIG. 2 is an enlarged sectional view of a group of light emitting diodes. In these figures, reference numeral 1 denotes a vehicle lamp installed at the rear of a car, and this lamp 1 has a box-shaped lamp body 2 that opens toward the rear of the car body, and a box-shaped lamp body 2 that extends from the body so as to close the opening of the lamp body 2. A lens 3 is attached to the lamp body 2, a printed circuit board 6 is mounted on the surface thereof, a large number of light emitting diodes 4, and a resistor 5 for lighting the diodes are mounted. It is firmly fixed to the vehicle body 8 by bolts 7.

The lamp body 2 is made of a material with excellent heat dissipation properties, such as aluminum, and has a pair of upper and lower holes on its back side, forming an exhaust hole 10 and a ventilation hole 11.

The lens 3 is made of a red-colored translucent resin or glass, and on its inner surface, a diffusion lens 13 consisting of a large number of small convex lenses is densely formed.

Each of the light emitting diodes 4 is composed of a semiconductor chip 15, an envelope 16 made of transparent resin such as epoxy resin, a pair of IC lead frames 17 which essentially constitute lead wires, wires 18, etc. 6 are arranged in an m x n matrix, and each column is connected in series through the IC lead frame 17t and ta18.
The series-connected diodes in each row are connected in parallel to a power supply (not shown). The IC lead frame 17 is used for manufacturing mold type 1 IC.
It is used when connecting a chip to a lead wire, and is formed into a substantially U-shape by a good electrical conductor, and has a pair of legs 17a and 17b.

Connecting portion 17c that connects one end of 17b to each other and a ratchet υ
, the other end portions of the pair of leg portions 17a and 1yb are molded onto the respective envelopes 16 of the light emitting diodes 4, 4 adjacent in the column direction to form lead wires, respectively, and the connecting portions 17
Since e is formed into a wide thin plate shape, it functions as a heat sink. The semiconductor chip 15 of each light emitting diode 4 is fixed to the tip of one leg 17°0, and the semiconductor chip 15 and the other leg 17b are connected by the entire line 18. In addition, the top of Figure 1! A pair of IC lead frames 1 for light emitting diodes 4 (left end in Figure 2)
One of the wires 7 is formed straight and constitutes a lead wire, is inserted into a through hole of the printed board 6, and is connected to the electric circuit of the board 6 by soldering. One of the pair of IC lead frames 17 of the light emitting diode 4 located at the lowest position in the turn section is also formed straight to constitute a lead wire and inserted into the through hole of the printed circuit board 6. The printed circuit board 6 has an opening 20 formed in the center to form a frame shape, and each light emitting diode 4 is connected to the electrical circuit by soldering.
A substantially U-shaped IC lead frame 17 is inserted which connects the two in series.

According to the lamp 1 having such a configuration, the heat generated by each light emitting diode 4 during lighting is transmitted to the connecting portion 17c of the IC lead frame 17.

Since heat is dissipated from the entire surface, the heat dissipation effect is greater than that of a conventional lamp in which the light emitting diode 4 is simply mounted on a printed circuit board, thus preventing a decrease in the light amount of the light emitting diode 4 and improving the illumination effect. Furthermore, air that has entered the lamp body 2 from the ventilation hole 11 passes through the opening 20 of the printed circuit board 6 and enters the space between the printed circuit board 6 and the lens 3, and then passes through the opening 20 again and exits from the exhaust hole 10. Since the air is discharged to the outside, the convection of this air prevents the temperature rise within the lamp 1 by Ffp and improves the skin heat dissipation effect.

FIG. 3 is a sectional view showing another embodiment of the present invention, and FIG. 4 is a perspective view of the inner lens. This embodiment differs from the above embodiment only in that an inner lens 30 is disposed in the space between the lens 3 and the light emitting diode 4, and all other configurations are the same.

The inner lens 30 is formed of a transparent or light-transmitting resin or the like, and has each light emitting diode 4 on its surface.
A large number of fisheye condensing lenses 31 corresponding to the above are integrally formed in a dense manner. The fisheye condensing lens 31 refracts the light emitted from the light emitting diode 4 and controls it so that it becomes a substantially parallel light beam, and is a substantially hemispherical spherical lens having a rectangular outline with substantially equal sides on the bottom. It is composed of

It will be obvious that even in such a configuration, the same effects as those of the above embodiment can be obtained.

〔Effect of the invention〕

As explained above, in the vehicle lamp according to the present invention, each light emitting diode is connected in series by an IC lead frame, and the IC lead frame has a function as a heat sink, so that the structure is simple and the light emitting diodes can be connected in series. It is possible to effectively dissipate heat, prevent adverse effects caused by heat generation, that is, decrease in light intensity, and improve lighting effects.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing one embodiment of the present invention, Fig. 2 is an enlarged sectional view of a group of light emitting diodes, Fig. 3 is a sectional view showing another embodiment of the invention, and Fig. 4 is a sectional view of an inner lens. FIG. 2...Lighting body, 3...Lens, 4...
Light emitting diode, 5... Resistor for diode lighting,
6...Printed circuit board, 15...Cow conductor chip,
16...Envelope, 17...IC lead frame, 18...All lines, 20...Opening.

Claims (1)

[Claims] In a vehicle lamp that uses a plurality of light emitting diodes as a light source, each of the light emitting diodes is connected in series by an IC lead frame used to connect a semiconductor chip and a lead wire, and the IC lead frame is connected to a heat sink. A vehicle lamp characterized by having the functions of: