JPS6284517A - Treating apparatus for photosensitizer application - Google Patents

Treating apparatus for photosensitizer application

Info

Publication number
JPS6284517A
JPS6284517A JP60225508A JP22550885A JPS6284517A JP S6284517 A JPS6284517 A JP S6284517A JP 60225508 A JP60225508 A JP 60225508A JP 22550885 A JP22550885 A JP 22550885A JP S6284517 A JPS6284517 A JP S6284517A
Authority
JP
Japan
Prior art keywords
substrates
vessel
unit
processing
post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60225508A
Other languages
Japanese (ja)
Inventor
Masaaki Sato
雅昭 佐藤
Tsuyoshi Hidehira
秀平 強
Ryohei Senda
良平 千田
Yoshiyuki Ooyama
桂之 大山
Katsushi Sato
佐藤 勝志
Hideaki Hirofuji
広藤 英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KURETSUKU SYST KK
Original Assignee
KURETSUKU SYST KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KURETSUKU SYST KK filed Critical KURETSUKU SYST KK
Priority to JP60225508A priority Critical patent/JPS6284517A/en
Publication of JPS6284517A publication Critical patent/JPS6284517A/en
Pending legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE:To reduce the generation of contamination and damage of substrates as far as possible and to improve the efficiency of treatment for application of a photosensitizer, by applying preliminary and additional treatments to each vessel in which prescribed numbers of substrates are held in one unit. CONSTITUTION:Prescribed numbers of substrates 3 are held in one unit in a vessel 2a. When preliminary treatment of the substrates is finished in a preliminary treatment chamber 6 of a preliminary treatment box 4, a partition plate 5 lowers, and the vessel is conveyed automatically to a cooling chamber 7. A vessel 2b in which one unit of the substrates having been subjected to the preliminary treatment is held is put on an elevator 9. A takeout device 10 takes the substrates one by one out of the vessel 2b and sets the same on a photosensitizer applying device 11. A device 12 for holding puts sensitizer-coated substrate one after another into a vessel 2c set on an elevator 13. The vessel in which one unit of the sensitizer-coated substrates is held is held in an additional treatment chamber 16 of an additional treatment box 14. When additional treatment is ended, a partition plate 15 lowers, and a vessel 2d being conveyed is cooled in a cooling chamber 17 partitioned by a partition plate having risen. The vessel after cooled is taken out by opening a front door 19.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、半導体ウェハー、ガラスマスク等の基板に
、感光剤(レジスト)を塗布処理する装置に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for applying a photosensitive agent (resist) to a substrate such as a semiconductor wafer or a glass mask.

(従来の技術) 基板上に感光剤を塗布するためには、基IJiHo基除
去、又は感光剤に対する基板表面への密着性向上等の目
的から、前処理として、オーブン又はヘキサメチルディ
シラザン(HMDS)気相塗布装置等の前処理装置によ
る加熱、又はヘキサメチルディシラザン気相塗布が必要
である。
(Prior Art) In order to apply a photosensitizer onto a substrate, pretreatment in an oven or hexamethyldisilazane (HMDS) is performed for the purpose of removing the IJiHo group or improving the adhesion of the photosensitizer to the substrate surface. ) Heating using a pretreatment device such as a vapor phase coating device or vapor phase coating of hexamethyldisilazane is required.

感光剤塗布後は、感光剤溶剤成分の揮発、又は感光剤の
基板表面への密着性向上の目的から、後処理として、オ
ーブン等の後処理装置による加熱が必要である。 。
After coating the photosensitive agent, heating with a post-processing device such as an oven is required as a post-treatment for the purpose of volatilizing the photosensitive agent solvent component or improving the adhesion of the photosensitive agent to the substrate surface. .

このような前処理、後処理を含む一連の工程を処理する
感光剤塗布処理装置には、従来、全枚葉塗布装置と、塗
布部のみを自動化した半自動塗布装置とが実用化されて
いる。
Photosensitive agent coating apparatuses that process a series of steps including such pre-treatment and post-treatment have conventionally been put into practical use, including full-sheet wafer coating apparatuses and semi-automatic coating apparatuses in which only the coating section is automated.

前者は、第2図に示すように、機枠1′上に前処理装置
4′、塗布装置5′、後処理装置6′が配設されていて
、キャリヤと呼ばれる容器2′に、所定枚数を1単位と
して収納されている基板3′を、図外搬送装置により1
枚ずつ前処理装置4′に送って前処理を行ったのち、塗
布装置5′で基板に感光剤を塗布し、感光剤塗布後、後
処理装置6′で後処理を行い、ついで容器7′へ収納す
るよう構成されている。
In the former, as shown in FIG. 2, a pre-processing device 4', a coating device 5', and a post-processing device 6' are arranged on a machine frame 1', and a predetermined number of sheets are placed in a container 2' called a carrier. The board 3', which is stored as one unit, is transported by a transport device (not shown).
After the substrates are sent one by one to the pre-processing device 4' for pre-processing, a photosensitive agent is applied to the substrates in the coating device 5'. It is configured to be stored in.

又、後者は、前処理装置、塗布装置、後処理装置が同一
ライン上に配設されず、それぞれ独立して配置されてい
る。そこで、オーブン等の前処理装置で、容器に収納し
て前処理した1単位の基板を、人手または簡単な搬送装
置により容器ごと塗布装置に送り、塗布後は1単位の基
板を収納した容器を、オーブン等の後処理装置に人手又
は簡単な搬送装置で送って、容器ごと後処理する。
Furthermore, in the latter case, the pre-processing device, the coating device, and the post-processing device are not arranged on the same line, but are arranged independently. Therefore, one unit of substrate is stored in a container and pretreated using a pretreatment device such as an oven, and then sent to the coating device along with the container by hand or using a simple transport device.After coating, the container containing one unit of substrate is transferred to the coating device. The container is then sent to a post-processing device such as an oven manually or by a simple transport device, and the entire container is post-processed.

(発明が解決しようとする従来技術の問題点)感光剤塗
布処理工程では、半導体ウェハー等の基板にゴミ等の異
物の付着を最も嫌うものである。
(Problems of the Prior Art to be Solved by the Invention) In the photosensitive agent coating process, adhesion of foreign matter such as dust to a substrate such as a semiconductor wafer is most disliked.

又、高価な基板に、僅かな傷さえ与えることをおそれる
ものである。
Furthermore, there is a fear that even a slight scratch may be caused to the expensive substrate.

しかるに、前者では、容器への基板枚葉の出し入れ、前
処理工程、後処理工程は、基板を無塵雰囲気中露出して
行うため、各装置及び人体の発塵による汚染を免れない
However, in the former case, the loading and unloading of the substrate into and out of the container, the pre-processing process, and the post-processing process are performed with the substrate exposed in a dust-free atmosphere, so that contamination by dust from each device and the human body is inevitable.

又、枚葉毎に行われる基板の出し入れ、搬送等の際、基
板が損傷を受ける頻度が増大する欠点がある。
Further, there is a drawback that the frequency of damage to the substrates increases when the substrates are loaded/unloaded and transported one by one.

さらに、各装置、とくに前後処理装置を水平面に展開し
た構成であるため、とくに、近時基板大型化に伴う無塵
室占有床面積増大によるコスト上昇も無視し得ない。
Furthermore, since each device, especially the pre-processing device and the pre-processing device, are arranged in a horizontal plane, an increase in cost cannot be ignored, especially due to an increase in the floor area occupied by the dust-free chamber due to the recent increase in the size of substrates.

次ぎに、後者では、各装置が独立に配置されていて、各
装置への容器の出し入れを人手にたよる結果、作業錯誤
、及び工数の増大を招いている。
Next, in the latter case, each device is arranged independently, and the loading and unloading of containers into and out of each device must be done manually, resulting in operational errors and increased man-hours.

そのうえ、人の動線をも含めた無塵室占有床面積の増大
も無視できない。
Furthermore, the increase in floor space occupied by dust-free rooms, including the flow of people, cannot be ignored.

この発明は、上記欠点を解消して、基板の汚染、損傷の
発生頻度の可及的減少、感光剤塗布処理装置の無塵室占
有床面積の減少、及び可能な限りの自動化による処理能
率の向上を目的とするものである。
The present invention solves the above-mentioned drawbacks, reduces the frequency of substrate contamination and damage as much as possible, reduces the floor space occupied by a dust-free chamber of a photosensitive agent coating processing device, and improves processing efficiency by as much automation as possible. The purpose is to improve.

(問題点を解決するための手段) そこでこの発明は、以下のように構成されている。(Means for solving problems) Therefore, the present invention is configured as follows.

即ち、基板の所定枚数を1単位として収納した容器を収
容して、容器ごと前処理を行う前処理箱と、前処理した
基板上に感光剤を塗布する塗布装置と、感光剤塗布ずみ
の1単位の基板を収納して、容器ごと後処理を行う後処
理箱とを同一処理ライン上に配設する。前処理箱には、
オーブン等の加熱装置、又は、ヘキサメチルディシラザ
ン気相塗布装置等の前処理装置が内蔵されている。後処
理箱には、オーブン等の後処理装置が内蔵されている。
That is, there is a pre-processing box that stores containers containing a predetermined number of substrates as one unit and pre-processes each container, a coating device that applies a photosensitizer onto the pre-processed substrates, and a container that has been coated with the photosensitizer. A post-processing box that stores unit substrates and performs post-processing together with the container is placed on the same processing line. In the pretreatment box,
A heating device such as an oven or a pretreatment device such as a hexamethyldisilazane vapor phase coating device is built-in. The post-processing box has a built-in post-processing device such as an oven.

又、前処理ずみの基板を塗布装置に送るため、前処理ず
みの1単位の基板を収納して、前処理箱から送られた容
器を載置して昇降する取り出し用エレベータ、この容器
から基板を1枚ずつ塗布装置へ送る取り出し装置、塗布
ずみの1単位の基板を収納して後処理箱へ送られる容器
を載置して昇降する収納用エレベータ、収納用エレベー
タへ載置した容器へ塗、布ずみの基板を1枚ずつ送る収
納装置とを設ける。
In addition, in order to send the pretreated substrates to the coating device, there is a take-out elevator that stores one unit of pretreated substrates and lifts and lowers the container sent from the preprocessing box. There is a take-out device that sends coated substrates one by one to the coating device, a storage elevator that lifts and lowers containers that store each unit of coated substrates and is sent to a post-processing box, and a container that is placed in the storage elevator that is coated. , and a storage device for feeding cloth-filled substrates one by one.

(作用) 1単位の基板を収納した容器ごと前処理箱に収容する。(effect) A container containing one unit of substrate is placed in a pretreatment box.

前処理は、基板を露出させることなく前処理箱で行われ
た後、取り出し用エレベータへ送られる。
Pretreatment is performed in a pretreatment box without exposing the substrate, and then the substrate is sent to an unloading elevator.

取り出し用エレベータは、取り出し装置が基板を1枚ず
つ取り出すごとに1段ずつ、即ち、基板1枚分ずつ降下
(又は上昇)するよう構成されている。取り出し装置は
、容器から基板を1枚ずつ取り出して塗布装置にセット
する。
The take-out elevator is configured to descend (or rise) one stage at a time, that is, one board at a time, each time the take-out device takes out a board one by one. The take-out device takes out the substrates one by one from the container and sets them in the coating device.

塗布装置は基板に感光剤を回転塗布する。塗布装置で塗
布ずみの基板は、収納装置により収納用エレベータに載
置されている容器に1枚ずつ収納される。この収納用エ
レベータも、基板を容器に1枚ずつ収納するごとに1段
ずつ上昇(又は降下)するよう構成されている。
The coating device spins and coats the photosensitive agent onto the substrate. The substrates coated by the coating device are stored one by one in a container placed on a storage elevator by a storage device. This storage elevator is also configured to ascend (or descend) one stage each time one board is stored in a container.

塗布ずみの1本位の基板を収納した容器は、容器ごと後
処理箱に送られて、基板を露出させることなく後処理が
行われる。
A container containing about one coated substrate is sent to a post-processing box, where post-processing is performed without exposing the substrate.

(実施例) 第1図に於いて、1は機枠、2aは一般にキャリヤと呼
ばれている容器で、所定枚数を1本位とする基板3が収
納されている。
(Embodiment) In FIG. 1, 1 is a machine frame, and 2a is a container generally called a carrier, in which a predetermined number of substrates 3, about one, is stored.

4は前処理箱で、仕切り板5によって前処理室6と冷却
室7とに二分されている。いずれも図示しないが、前処
理室にはオーブン等の加熱装置、又はヘキサメチルディ
シラザン気相塗布装置などが、冷却室には冷却装置が取
付けられている。前処理室6には容器を入れるための前
扉8が、又冷却室7には冷却ずみの容器を取り出すため
の後扉(図示せず)が取付けられていて、前後の扉を閉
めると前処理箱4は密閉される。又、基板の前処理が終
われば、仕切り板5が降下して、容器は図外搬送手段に
より自動的に冷却室7へ送られ、上昇した仕切り板で仕
切られて冷却されるよう構成されている。
A pretreatment box 4 is divided into a pretreatment chamber 6 and a cooling chamber 7 by a partition plate 5. Although not shown in the drawings, the pretreatment chamber is equipped with a heating device such as an oven, a hexamethyldisilazane vapor phase coating device, and the like, and the cooling chamber is equipped with a cooling device. The pretreatment chamber 6 is equipped with a front door 8 for putting containers in, and the cooling chamber 7 is equipped with a rear door (not shown) for taking out the cooled containers. The processing box 4 is sealed. Furthermore, when the pretreatment of the substrate is completed, the partition plate 5 is lowered, and the container is automatically sent to the cooling chamber 7 by a transport means (not shown), where it is partitioned by the raised partition plate and cooled. There is.

前処理箱4の後扉を開けて取り出された、前処理ずみの
1本位の基板を収納した容器2bは、取り出し用エレベ
ータ9に載置される。取り出し用エレベータ9は、後述
の取り出し装置が基板を最下段から1枚ずつ取り出せば
、1段ずつ降下するよう構成されている。
The container 2b containing about one pretreated substrate, which is taken out by opening the rear door of the preprocessing box 4, is placed on the takeout elevator 9. The take-out elevator 9 is configured to descend one step at a time when a take-out device, which will be described later, takes out substrates one by one from the lowest step.

10は取り出し装置で、取り出し用エレベータ9上の容
器2bから、基板を1枚ずつ取り出して公知の感光剤塗
布装置1)ヘセントするものである。実施例では、回動
する2本のアームで容器中の基板をすくいだすように構
成したが、2本のアームを開閉することによって、基板
を挟んで取り出すなど構成することも可能である。
Reference numeral 10 denotes a take-out device which takes out the substrates one by one from the container 2b on the take-out elevator 9 and places them in a known photosensitive agent coating device 1). In the embodiment, the substrate in the container is scooped out using two rotating arms, but it is also possible to sandwich the substrate and take it out by opening and closing the two arms.

12は、取り出し装置lOと同様の構成の収納装置で、
収納用エレベータ13に載置された容器2cへ、塗布ず
みの基板を1枚ずつ収納するものである。
12 is a storage device having the same configuration as the take-out device IO;
The coated substrates are stored one by one in a container 2c placed on a storage elevator 13.

収納用エレベータ13は、前記の取り出し用エレベータ
9とは反対に、収納装置12が容器の最上段から基板を
収納するごとに1段ずつ上昇する。
Contrary to the aforementioned take-out elevator 9, the storage elevator 13 rises one step each time the storage device 12 stores a substrate from the top of the container.

14は後処理箱で、前処理箱4と同様に、仕切り板15
により、後処理室16、冷却室17に二分されている。
14 is a post-processing box, which, like the pre-processing box 4, has a partition plate 15.
It is divided into a post-processing chamber 16 and a cooling chamber 17.

後処理室16には後扉18が、又、冷却室17には前扉
19が設けられている。感光剤塗布ずみの1本位の基板
を収納した容器は、後扉を開けて後処理室16に収容し
、図外オーブン等の後処理装置で後処理を行う。後処理
が終わると仕切り板15が降下して、図外搬送装置によ
り送られた容器2dは、上昇した仕切り板で仕切られた
冷却室17で冷却される。冷却後の容器は前扉19を開
けて取り出される。勿論、前後の扉を閉めれば、後処理
室も密閉される。
The post-processing chamber 16 is provided with a rear door 18, and the cooling chamber 17 is provided with a front door 19. The container containing about one substrate coated with the photosensitive agent is placed in the post-processing chamber 16 with the rear door opened, and post-processed using a post-processing device such as an oven (not shown). When the post-processing is finished, the partition plate 15 is lowered, and the container 2d sent by the transport device (not shown) is cooled in the cooling chamber 17 partitioned by the raised partition plate. The cooled container is taken out by opening the front door 19. Of course, if you close the front and rear doors, the post-processing chamber will also be sealed.

なお、前後処理室を二分せず、1室で加熱、ヘキサメチ
ルディシザン気相塗布、冷却を行うようすることもでき
る。又、取り出し用、収納用エレベータをともに上昇又
は降下させる、或いは実施例と反対に昇降させるなど任
意である。
Note that the pre- and post-treatment chambers may not be divided into two, but heating, hexamethyldisisan vapor phase coating, and cooling may be performed in one chamber. Furthermore, it is optional to raise or lower both the take-out and storage elevators, or to raise and lower them in the opposite manner to the embodiment.

(効果) この発明の効果を列挙すれば、次のとおりである。(effect) The effects of this invention are listed below.

(1)  感光剤塗布処理で必須である前処理、後処理
を、無塵室に露出しないで気密に行えるので、汚染の機
会を極力おさえることができる。
(1) Since the pre-treatment and post-treatment that are essential in the photosensitive agent coating process can be performed airtight without exposure to a dust-free room, chances of contamination can be minimized.

(2)  基板の前後処理、塗布装置へのセット、塗布
後の容器への収納等を人手によらないため、基板損傷が
少なくなる。
(2) Since pre-processing of the substrate, setting it in the coating device, storing it in a container after coating, etc. do not require manual labor, damage to the substrate is reduced.

(3)前後処理室を水平面に展開しないので、無塵室占
有床面積を小さくできる。
(3) Since the pre- and post-processing chambers are not developed on a horizontal plane, the floor area occupied by the dust-free chamber can be reduced.

(4)所定枚数を1本位とする基板を収納した容器ごと
前後処理ができるので、感光剤塗布処理を能率的に行え
る。
(4) Since pre- and post-processing can be performed for each container containing a predetermined number of substrates, the photosensitive agent coating process can be performed efficiently.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は実施例の斜i図、第2図は従来の全枚葉塗布装
置の斜視図である。 2a〜2d・・・・容器 3・・・・基板 4・・・・前処理箱 9・・・・取り出し用エレベータ 10・・・・取り出し装置 1)・・・・塗布装置 12・・・・収納装置 13・・・・収納用エレベータ 14・・・・後処理箱
FIG. 1 is a perspective view of the embodiment, and FIG. 2 is a perspective view of a conventional all-sheet wafer coating apparatus. 2a to 2d...Container 3...Substrate 4...Pre-treatment box 9...Take-out elevator 10...Take-out device 1)...Coating device 12... Storage device 13...Storage elevator 14...Post-processing box

Claims (1)

【特許請求の範囲】[Claims] (1)半導体ウェハー、ガラスマスク等の基板の所定枚
数を1単位として収納した容器を収容して、加熱又はヘ
キサメチルディシラザン気相塗布等の前処理を行う前処
理箱と、前処理した基板に感光剤を塗布する塗布装置と
、感光剤塗布ずみの1単位の基板を収納した容器を収容
して加熱等の後処理を行う後処理箱とを同一処理ライン
上に配設するとともに、昇降する取り出し用エレベータ
へ前処理箱から送られた、前処理ずみの1単位の基板を
収納した容器から、基板を1枚ずつ塗布装置へ送る取り
出し装置と、昇降する収納用エレベータに載置されて、
1単位の基板を収納した後に後処理箱へ送られる容器に
、感光剤塗布ずみの基板を1枚ずつ収納する収納装置と
を設けてなる感光剤塗布処理装置。
(1) A pretreatment box that houses a container containing a predetermined number of substrates such as semiconductor wafers and glass masks as one unit, and performs pretreatment such as heating or vapor phase coating of hexamethyldisilazane, and the pretreated substrates. A coating device that applies a photosensitizer to a substrate and a post-processing box that houses a container containing one unit of a substrate coated with a photosensitizer and performs post-processing such as heating are installed on the same processing line, and the equipment is installed on the same processing line. A take-out device sends the substrates one by one from a container containing one unit of pre-processed substrates sent from a pre-processing box to a take-out elevator to a coating device, and a take-out device places the substrates on a storage elevator that goes up and down. ,
A photosensitive agent coating processing apparatus is provided with a storage device that stores substrates coated with a photosensitive agent one by one in a container that is sent to a post-processing box after storing one unit of substrates.
JP60225508A 1985-10-08 1985-10-08 Treating apparatus for photosensitizer application Pending JPS6284517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60225508A JPS6284517A (en) 1985-10-08 1985-10-08 Treating apparatus for photosensitizer application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60225508A JPS6284517A (en) 1985-10-08 1985-10-08 Treating apparatus for photosensitizer application

Publications (1)

Publication Number Publication Date
JPS6284517A true JPS6284517A (en) 1987-04-18

Family

ID=16830413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60225508A Pending JPS6284517A (en) 1985-10-08 1985-10-08 Treating apparatus for photosensitizer application

Country Status (1)

Country Link
JP (1) JPS6284517A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513743U (en) * 1974-06-25 1976-01-12
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element
JPS5844721A (en) * 1982-08-31 1983-03-15 Toshiba Corp Baking device for semiconductor wafer
JPS58199349A (en) * 1982-05-17 1983-11-19 Toshiba Corp In-line device of photoetching
JPS59117218A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Application of agent

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513743U (en) * 1974-06-25 1976-01-12
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element
JPS58199349A (en) * 1982-05-17 1983-11-19 Toshiba Corp In-line device of photoetching
JPS5844721A (en) * 1982-08-31 1983-03-15 Toshiba Corp Baking device for semiconductor wafer
JPS59117218A (en) * 1982-12-24 1984-07-06 Hitachi Ltd Application of agent

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