JPS6284586A - Manufacture of flexible printed wiring substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of 44J] This invention relates to a method of manufacturing a flexible wiring board used for wiring of various ventilation equipment.

[Conventional technology]

The sixth diagram is a plan view of a conventional flexible wiring board.

FIG. 7 is a cross-sectional view taken along the line ■--■ in FIG. In the figure, (1) is a conductor, (2) and (3) is an insulator. Insulators (2) and (3) are usually polyester or polysolenoid films. Insulator (2) below
will be referred to as a base film, and the insulator (3) will simply be referred to as a film.

First, prepare a base film (2) and a copper plate (base IC) of the conductor (1) pasted with adhesive. After masking, the unnecessary parts are immersed in etching solution and removed.

Next, wash off the etching solution and cut the base film (2) such as the terminal (4) part. A layer (3) is glued to this soil, sandwiching the entire pattern of conductors (1).

This pattern 1-r differs greatly depending on the type of wiring used for electronic circuits 1. Conductor (1) +! 1 gap 1 <,
It becomes complicated.

The example shown in FIG. 6 is a relatively simple pattern r), i
This is not a pattern for W electronic circuit wiring, but a main circuit pattern for Till oranges. The wiring is soldered or screwed to the main body of the stirrer at the terminal portion (4).

The pattern formed in this way has a thickness of 0.05 to 0.
Conductor (1) sandwiched between 8 thin films
Since it is a thin copper plate, it is flammable and can withstand bending when wiring, vibration and bending movement after wiring.

[Problem that the invention seeks to solve]

The conventional manufacturing method for flexible wiring boards as described above requires a special etching solution, which results in high costs due to equipment costs such as cleaning drainage and time-consuming work processes. I didn't get it.

The present invention was made to solve the above-mentioned problems and aims to obtain an inexpensive flexible wiring board by manufacturing it by a method that does not require etching.

[Means for solving problems]

In the method for manufacturing a flexible wiring board according to the present invention, a flat ribbon-shaped conductor is arranged on a base material.

A wiring pattern is formed.

[For production]

In this invention, a flat ribbon-shaped conductor is placed on a base material to form a wiring pattern.

[Example of invention]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Diagrams showing one embodiment of the present invention will be described below. FIG. 1 shows the reason why the conventional flexible wiring board pattern shown in FIG. 6 was manufactured by the pattern forming method according to the present invention. First, a flat “1” electrically charged wire c is placed on the base film.
Hereafter, simply attach the ribbon line (5) using instant adhesive while folding it back and bending it according to the lower part of the required pattern. Especially ribbon wires (5a) and (51))H
As shown in FIG. 2, they are stacked one on top of the other and have a cross-sectional structure of cross section 1-1 in FIG. 1. An enamel layer with good electrical insulation is formed around the entire circumference of the conductor (1) by electrodeposition.
There is no problem as they can be overlapped.

Paste type EU of all patterns, X-Y? --It can also be carried out in an automatic machine with flV.

After these formations are completed, the entire surface of the pattern is covered with a film (3) and bonded in a sandwiched pattern as shown in FIG.

After the adhesive is completely cured, remove the base film (2) of the terminal (4) part.
) and peel off the film (3). Depending on the case, it may be possible to pre-drill holes in these areas.

As shown in FIG. 4, the part formed in this way is partially ribbon wire (
) is the same as the cross section of the conventional product shown in Fig. 7, except that there is an overlapping part.

As described above, the feature of this invention is that a flat ribbon-shaped conductor (1) is used to form the pattern, and therefore the wiring density can be higher than that of round wire wiring. .

Yet another feature is that the insulating layer of this flat ribbon-shaped conductor is formed by electrodeposition. It uses an electrodeposited insulated conductor. Electrodeposited insulation layers provide better insulation than other methods such as solvent coating and powder coating.

This is for forming an insulating layer on a ceripon-like conductor.

The insulation thickness at the ridge and ridge portions becomes thinner than at the pond, resulting in a decline in electrical properties, especially dielectric breakdown voltage. However, in the electrodeposition method A, the film thickness can be made uniform even at the edge portions due to the effect that the π field concentrates on the edge portions.

Figure 5 shows a conductor insulated with a layer of insulation by electrodeposition.
FIG. 8 shows a conductor coated with a conventional solvent, and in FIG. 1, (1) is the conductor and (6) is the insulating layer.

Attached Table shows a comparison of the characteristics of ribbon-shaped electric wires obtained by the IKtm method and the solvent coating method.

As is clear from Table 1, ribbon wires produced by electrodeposition have particularly few pinholes and have a comparable dielectric breakdown voltage.

In this invention, by using the above-mentioned insulating material as the ribbon-like conductor.

Overlapping and close placement of patterns can be performed with high reliability, leading to an improvement in wiring density.

The enamel layer of the ribbon wire (5) is usually made of acrylic, epoxy, AcryM epoxy, or polyester, but by selecting a solderable material such as polyurethane, the enamel layer of the terminal (4) can be Another method is to solder the enamel layer directly without removing it with chemicals.

Furthermore, depending on the application, even if the sandwich film (3) is omitted, the conductor is insulated and the insulation performance is sufficiently good.

Table 1 Comparison table of characteristics of ribbon-shaped electric wires obtained by electrodeposition method and solvent coating method (according to J Engineering SC aooa) Although the above example is an example of a relatively simple pattern, the ribbon wire (5) is arranged vertically and horizontally. It doesn't really matter if there are crossed patterns or parts that overlap or are close to each other.

Further, although the pattern is formed on a flexible base material here, the pattern can be formed in the same manner as described above even on a rigid base material such as an epoxy glass laminate.

〔Effect of the invention〕

As explained above, this invention is manufactured using a method for manufacturing a flexible wiring board in which a flat ribbon-shaped conductor is placed on a base material to form a wiring pattern. There is an effect that a flexible wiring board can be obtained.

[Brief explanation of drawings]

FIG. 1 is a plan view of forming a wiring pattern of a flexible &A11Ia& board manufactured by a method according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line 1-1 in FIG.
Figures 4 and 3 are plan views of a flexible wiring board manufactured by the method according to an embodiment of the present invention. /-M
5 is a sectional view showing a state insulated by a conductor by a method according to an embodiment of the present invention, FIG. 6 is a plan view of a flexible hunting board manufactured by a conventional method, and FIG. The figure is a cross-sectional view taken along the line M-Vl in Figure 6, and Figure 8 is a conductor made using the conventional method. FIG. In the figure, (1) is a conductor, (2) is a μ base film (insulator), (3) is a film (insulator), and (5) is a ribbon wire. In the figures, the same reference numerals indicate the same or corresponding parts.

Claims (3)

[Claims] (1) A method for manufacturing a flexible wiring board, which comprises arranging flat ribbon-shaped conductors on a board to form a wiring pattern. (2) The method for manufacturing a flexible wiring board according to claim 1, wherein an insulating coating is applied to the entire circumference of the ribbon-shaped conductor. (3) Claim 1, characterized in that the entire circumference of the ribbon-shaped conductor is coated with an insulating coating by electrodeposition.
A method for manufacturing a flexible wiring board as described in .