JPS6284600A - Apparatus for inspecting mounting of chip part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting inspection device for chip-shaped components 1-1. This relates to a device for testing.

[Conventional technology]

One stage of mounting inspection of this type of chip-shaped component according to a conventional example is shown in FIGS. 4 to 6.

That is, in FIGS. 4 to 6, reference numeral 1 indicates a chip-shaped component such as a semiconductor chip, 2 indicates an external terminal electrode provided on both end surfaces of the chip-shaped component, and 3 indicates a chip-shaped component such as a semiconductor chip.
is the display symbol written on the chip-like part l, and 4
5 is a bare board such as a printed circuit board on which the chip-shaped component 1 is mounted, 5 is a circuit conductor formed on this bare board 4, and 6 is an adhesive placed between the circuit conductors 5 for mounting the chip-shaped component 1. It is a drug.

However, in the case of this conventional example, the chip-shaped component l connects its external terminal electrode 2 to the circuit conductor 5 on the bare board 4J:
Temporarily fix the chip-like part 1 of the bracket to the circuit conductor 5 by manually fixing it with tweezers or using an adhesive 6 using a mounting machine so that it matches the corresponding part of the bracket. Compatibility with mounting conditions, such as whether there is any positional shift or tilt, or whether the polarity is different, is particularly checked in the direction 9 of the display symbol 3 in the mounting mode.
After inspecting and confirming the position etc., the adhesive 6 is cured again to fix the mounting.

[Problem that the invention seeks to solve]

However, when confirming the mounting conditions using such conventional means, the display symbol 3 is not necessarily written on the part suitable for inspection for all types of chip-shaped parts I, and for this reason, the above-mentioned It is impossible to rely solely on inspections using the display symbol 3 as a guide;
Because the color tones are often very similar, for example, the application of recognition using binary signals captured by a camera lacks accuracy. There is no reliable method other than visual inspection and confirmation, and there is a risk that mounting defects may be overlooked due to fatigue in the inspection groove, and most inspection methods are There was a sense of regret that it was not serving a purposeful purpose.

This invention was made in order to solve these conventional problems, and its purpose is to accurately and quickly inspect the mounting state of chip-shaped components on a printed circuit board. It is an object of the present invention to provide a mounting inspection device for this type of chip-shaped component that can be checked.

[Means for solving problems]

In order to achieve the above object, the chip-like component mounting inspection device according to the present invention displays a specific bar code on the surface of the chip-like component that is perpendicular or parallel to the external terminal electrodes on both end surfaces, and Compares the camera that images the mounting mode of chip-shaped components on the printed circuit board and the image output signal including the barcode from the camera with the mounting control data from the main controller to determine the suitability of the mounting mode. It is provided with a comparison circuit and a monitor display section that displays the judgment result from the comparison circuit.

[For production]

Therefore, in the present invention, a camera captures an image of the mounting state of a chip-shaped component on a printed circuit board, and the imaging signal including a barcode obtained from the camera is sent to the mounting control data from the main controller using a comparison circuit. The compatibility of the implementation mode can be inspected and displayed on the monitor display.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the chip component mounting inspection apparatus according to the present invention will be described in detail below with reference to FIGS. 1 to 3.

Fig. 1 is a perspective view showing a chip-shaped component to which this embodiment is applied, Fig. 2 is an explanatory diagram schematically showing the general configuration of the same embodiment device, and Fig. 3 is a control circuit of the same embodiment device. In each figure of these embodiments, the same reference numerals as in each figure of the conventional example indicate the same or corresponding parts.

As shown in FIG. -So, what type of chip-shaped part 1 is it? lf The barcode 11 representing the emotional and poetic characteristic value is displayed, for example, by marking or printing, and the second
As shown in the figure and FIG. 3, a configuration is prepared in which an XY table 12 is provided on a pedestal 137, and a camera 14 is placed above the XY table 12 using a frame +3a.

Next, as described above, the bare board 4 on which the chip-shaped component l is temporarily fixed and mounted using the adhesive 6 is positioned and installed at a predetermined position on the XY table 12.
2 is selectively scanned and moved in two directions, X and Y, and in this state, the mounting state of the chip-shaped component 1 is imaged by the camera 14,
On the third side, it is displayed on the monitor display section 15, and on the other hand, the image pickup output signal including the barcode information from the camera 14 is outputted to the comparison circuit 16.

Then, the comparison circuit 16 compares this imaging output signal with the mounting control data set and stored in advance in the storage section 18 of the main controller 17, determines the suitability of the mounting mode, and then restarts the main controller 17 again. The quality of the chip-shaped component 1 is displayed on the monitor display section 15 through the chip-shaped component 15, and if the mounting mode is defective, a signal is output to the outside as necessary.
It is possible to mark the product to indicate that it is defective.

That is, in this way, the monitor display unit 15 can easily detect the positional deviation, tilt amount, polarity difference, etc. of the chip-like component l after being imaged by the camera 14 and compared with the intended mounting control data. It can be inspected and confirmed.

In the above embodiment, the bare board 4 side on which the chip-like component 1 is temporarily fixed and mounted with the adhesive 6 is
Although the Y table 12 is used to scan and move, it is of course possible to scan and move the camera 14 side instead.

〔Effect of the invention〕

As detailed above, according to the present invention, a specific bar code that is perpendicular or parallel to the external terminal electrodes on both end surfaces is displayed on the surface of the chip-shaped component, and the mounting mode of the chip-shaped component on the printed circuit board is controlled. is imaged by a camera, and the imaging output signal including the barcode obtained from the camera is compared with the mounting control data from the main control device by a comparison circuit to check the compatibility of the mounting mode and display it on the monitor display section. Because of this, it is possible to automatically, quickly, and accurately check the quality of the mounting of chip-shaped parts on a printed circuit board, such as the 1η deviation of the chip-shaped parts, the tilt of 1.1, and the difference in polarity, without contact. It has the advantage of being suitable for large-scale testing.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a chip-like component to which an embodiment of the present invention is applied, FIG. FIG. 4 and FIG. 5 are perspective views respectively showing a chip-shaped component and a bare board for mounting it in the conventional example, and FIG. FIG. 1... Chip-shaped component, 2... External terminal electrodes on both end surfaces of the chip-shaped component, 4... Bare board, 5...
...Circuit conductor, 6..Adhesive, 11..8-code written on chip-shaped component, 12..XY table, 14.. Mounting mode imaging camera, 15.・・・
・Monitor display section, 16... Comparison circuit, 17...
- Main controller, 18... Storage section of the main controller. Agent: Masuo Oiwa Procedural amendment (voluntary), Showa year, month, day 2, Title of invention: Chip-shaped component mounting inspection device 3, Representative of the person making the amendment: Moriya Shiki 5, Details of the invention in the specification to be amended Explanation column 6, details of correction (1) r13aJ on page 6, line 5 of the specification is corrected to "19". (2) Correct "this" in lines 9-10 of page 6 to "this". that's all

Claims (1)

[Claims] A chip-shaped component having external terminal electrodes is provided on both end surfaces,
This is an inspection device for mounting this chip-shaped component on a printed circuit board, and displays a specific bar code on the surface of the chip-shaped component that is perpendicular or parallel to the external terminal electrode, and a camera that captures an image of the mounting mode; a comparison circuit that compares the imaging output signal including the barcode from the camera with mounting control data from the main controller to determine the suitability of the mounting mode; 1. A mounting inspection device for chip-shaped components, comprising: a monitor display section for displaying judgment results.