JPS6284933U - - Google Patents
Info
- Publication number
- JPS6284933U JPS6284933U JP17696585U JP17696585U JPS6284933U JP S6284933 U JPS6284933 U JP S6284933U JP 17696585 U JP17696585 U JP 17696585U JP 17696585 U JP17696585 U JP 17696585U JP S6284933 U JPS6284933 U JP S6284933U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- ventilation holes
- board
- cover
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案を実施した電子機器の概略分解
斜視図、第２図は同部分破断要部分解斜視図、第
３図は同更に要部を拡大した部分破断分解斜視図
、第４図は同取り付け状態の要部縦断面図、第５
図は従来例を示す部分斜視図、第６図は別の従来
例を示す斜視図である。
２２……筐体、２３……カバー、２４……ヒー
トシンク、２５……筒状孔、２６，３０，３２…
…通気孔、２７……基板、２８……三端子レギユ
レータ、３１，３３……連通孔。
Fig. 1 is a schematic exploded perspective view of an electronic device implementing the present invention, Fig. 2 is a partially broken exploded perspective view of the same, Fig. 3 is a partially broken exploded perspective view with the main parts enlarged, and Fig. 4. is a vertical sectional view of the main part in the same installed state, No. 5
The figure is a partial perspective view showing a conventional example, and FIG. 6 is a perspective view showing another conventional example. 22... Housing, 23... Cover, 24... Heat sink, 25... Cylindrical hole, 26, 30, 32...
...Vent hole, 27... Board, 28... Three-terminal regulator, 31, 33... Communication hole.
Claims (1)
を密着固定したヒートシンクを備え、そのヒート
シンクを備えた基板を各々複数個の通気孔が穿設
された筐体とカバー間に介在させたヒートシンク
の取付構造において、前記ヒートシンクは上下に
吹き抜けの筒状としたものを枠状に形成し、その
ヒートシンクの上下の開口を、前記筐体及びカバ
ーに、前記通気孔とは別途に穿設された連通孔と
直線的に連通してあることを特徴とするヒートシ
ンクの取付構造。 A heat sink with electronic components closely fixed to a board with multiple ventilation holes is provided, and the board with the heat sink is interposed between a case and a cover, each with a plurality of ventilation holes. In the heat sink mounting structure, the heat sink has a cylindrical frame shape with open upper and lower sides, and the upper and lower openings of the heat sink are formed separately from the ventilation holes in the casing and the cover. A heat sink mounting structure characterized by linear communication with a communication hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17696585U JPS6284933U (en) | 1985-11-18 | 1985-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17696585U JPS6284933U (en) | 1985-11-18 | 1985-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284933U true JPS6284933U (en) | 1987-05-30 |
Family
ID=31117718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17696585U Pending JPS6284933U (en) | 1985-11-18 | 1985-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284933U (en) |
-
1985
- 1985-11-18 JP JP17696585U patent/JPS6284933U/ja active Pending
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