JPS6284942U - - Google Patents
Info
- Publication number
- JPS6284942U JPS6284942U JP1985177590U JP17759085U JPS6284942U JP S6284942 U JPS6284942 U JP S6284942U JP 1985177590 U JP1985177590 U JP 1985177590U JP 17759085 U JP17759085 U JP 17759085U JP S6284942 U JPS6284942 U JP S6284942U
- Authority
- JP
- Japan
- Prior art keywords
- led
- enamel
- substrate
- led lamp
- lamp according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Description
図は本考案によるＬＥＤランプの実施例を示す
もので、第１図は第２図のＡ―Ａ線断面図、第２
図は平面図、第３図は電気回路図、第４図は本考
案の他の実施例の平面図、第５図は第４図のスル
ーホール部分の断面図、第６図、第７図および第
８図はそれぞれ基板の他の例の断面図である。
１……ほうろう基板、２……ＬＥＤチツプ、３
……大きな凹み、５……凹部、７……厚膜配線、
９……金線。
The figures show an embodiment of the LED lamp according to the present invention.
3 is a plan view, FIG. 3 is an electric circuit diagram, FIG. 4 is a plan view of another embodiment of the present invention, FIG. 5 is a cross-sectional view of the through-hole portion of FIG. 4, and FIGS. 6 and 7. and FIG. 8 are sectional views of other examples of the substrate. 1... Enamel board, 2... LED chip, 3
... large dent, 5 ... recess, 7 ... thick film wiring,
9...Gold wire.
Claims (1)
相互に接続してなるＬＥＤランプにおいて、前記
基板をほうろうびきとし、このほうろう基板にＬ
ＥＤチツプ取付け部を形成するとともに、厚膜配
線を施こし、前記ほうろう基板上に形成したＬＥ
Ｄチツプ取付け部毎に、各ＬＥＤチツプを配置し
、すべてのＬＥＤチツプを被覆するようにレンズ
効果のための樹脂ポツテイングを施こしてなるこ
とを特徴とするＬＥＤランプ。 (2) ＬＥＤチツプ取付け部は凹部からなる実用
新案登録請求の範囲第１項記載のＬＥＤランプ。 (3) ほうろう基板は鉄板にほうろうを施こした
ものからなる実用新案登録請求の範囲第１項記載
のＬＥＤランプ。 (4) ほうろう基板はすべてのＬＥＤチツプを含
んだ大きな凹みを有し、この大きな凹みに樹脂ポ
ツテイングを施こすようにした実用新案登録請求
の範囲第１項記載のＬＥＤランプ。[Claims for utility model registration] (1) Arranging a plurality of LED chips on a board,
In the LED lamps that are connected to each other, the substrate is made of enamel, and the enamel substrate is provided with L.
In addition to forming the ED chip mounting portion, thick film wiring was applied to the LE formed on the enamel substrate.
An LED lamp characterized in that each LED chip is arranged in each D-chip mounting part, and resin potting is applied for a lens effect so as to cover all the LED chips. (2) The LED lamp according to claim 1, wherein the LED chip mounting portion is a recessed portion. (3) The LED lamp according to claim 1, wherein the enamel substrate is made of an iron plate coated with enamel. (4) The LED lamp according to claim 1, wherein the enamel substrate has a large recess containing all the LED chips, and resin potting is applied to this large recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177590U JPS6284942U (en) | 1985-11-19 | 1985-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985177590U JPS6284942U (en) | 1985-11-19 | 1985-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6284942U true JPS6284942U (en) | 1987-05-30 |
Family
ID=31118931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985177590U Pending JPS6284942U (en) | 1985-11-19 | 1985-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284942U (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230586A (en) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Led module |
| JP2001332769A (en) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | Light-emitting diode lighting |
| JP2006269758A (en) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | Light emitting device mounting enamel substrate, light emitting device module, display device, lighting device, and traffic signal device |
| WO2006132147A1 (en) | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Porcelain enameled substrate for light-emitting device mounting, method for producing same, light-emitting device module, illuminating device, display and traffic signal device |
| WO2006132222A1 (en) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device |
| WO2006132150A1 (en) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Substrate for light-emitting device mounting and light-emitting device module |
| WO2006134839A1 (en) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| JP2007013027A (en) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | Light-emitting element mounting enamel substrate, light-emitting element module, lighting device, display device, and traffic signal device |
| JP2007013026A (en) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | Light emitting element module, sterilizing lamp device, ultraviolet curable resin curing lamp device, lighting device, display device, and traffic signal device |
| JP2007165735A (en) * | 2005-12-16 | 2007-06-28 | Drill Center:Kk | LED mounting substrate and manufacturing method thereof |
| WO2007138695A1 (en) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system |
| WO2007138696A1 (en) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | Light-emitting device mounting substrate, light-emitting device package body, display and illuminating device |
| JP2008091952A (en) * | 2005-06-07 | 2008-04-17 | Fujikura Ltd | Method for manufacturing light-emitting element mounting enamel substrate and method for manufacturing light-emitting element module |
| JP2009038202A (en) * | 2007-08-01 | 2009-02-19 | Fujikura Ltd | Light-emitting element mounting substrate, light-emitting element module, lighting device, display device, and traffic signal device |
| JP2010500779A (en) * | 2006-08-11 | 2010-01-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Device chip carrier, module and manufacturing method thereof |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| US7980731B2 (en) | 2006-05-30 | 2011-07-19 | Fujikura Ltd. | Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
-
1985
- 1985-11-19 JP JP1985177590U patent/JPS6284942U/ja active Pending
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230586A (en) * | 1990-02-05 | 1991-10-14 | Mitsubishi Cable Ind Ltd | Led module |
| JP2001332769A (en) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | Light-emitting diode lighting |
| US7866853B2 (en) | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| JP2006269758A (en) * | 2005-03-24 | 2006-10-05 | Fujikura Ltd | Light emitting device mounting enamel substrate, light emitting device module, display device, lighting device, and traffic signal device |
| US8382345B2 (en) | 2005-06-07 | 2013-02-26 | Fujikara Ltd. | Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal |
| WO2006132150A1 (en) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Substrate for light-emitting device mounting and light-emitting device module |
| WO2006132222A1 (en) * | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device |
| US7699500B2 (en) | 2005-06-07 | 2010-04-20 | Fujikura Ltd. | Light-emitting element mounting board, light-emitting element module, lighting device, display device, and traffic signal equipment |
| KR101132421B1 (en) | 2005-06-07 | 2012-04-03 | 가부시키가이샤후지쿠라 | Substrate for light-emitting device mounting and light-emitting device module |
| JP2008091952A (en) * | 2005-06-07 | 2008-04-17 | Fujikura Ltd | Method for manufacturing light-emitting element mounting enamel substrate and method for manufacturing light-emitting element module |
| WO2006132147A1 (en) | 2005-06-07 | 2006-12-14 | Fujikura Ltd. | Porcelain enameled substrate for light-emitting device mounting, method for producing same, light-emitting device module, illuminating device, display and traffic signal device |
| US7537359B2 (en) | 2005-06-07 | 2009-05-26 | Fujikura Ltd. | Substrate for mounting light-emitting element and light-emitting element module |
| US7572039B2 (en) | 2005-06-07 | 2009-08-11 | Fujikura, Ltd. | Porcelain enamel substrate for mounting light emitting device and method of manufacturing the same, light emitting device module, illumination device, display unit and traffic signal |
| WO2006134839A1 (en) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | Light emitting element mounting board, light emitting module and lighting equipment |
| US7982230B2 (en) | 2005-06-13 | 2011-07-19 | Fujikura Ltd. | Substrate for mounting light emitting element, light emitting module and lighting apparatus |
| KR101017921B1 (en) * | 2005-06-13 | 2011-03-08 | 가부시키가이샤후지쿠라 | Board for mounting light emitting device, light emitting module and lighting device |
| JP2007013027A (en) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | Light-emitting element mounting enamel substrate, light-emitting element module, lighting device, display device, and traffic signal device |
| JP2007013026A (en) * | 2005-07-04 | 2007-01-18 | Fujikura Ltd | Light emitting element module, sterilizing lamp device, ultraviolet curable resin curing lamp device, lighting device, display device, and traffic signal device |
| JP2007165735A (en) * | 2005-12-16 | 2007-06-28 | Drill Center:Kk | LED mounting substrate and manufacturing method thereof |
| US7980731B2 (en) | 2006-05-30 | 2011-07-19 | Fujikura Ltd. | Light-emitting element mounting substrate, light source, lighting device, display device, traffic signal, and method of manufacturing light-emitting element mounting substrate |
| WO2007138696A1 (en) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | Light-emitting device mounting substrate, light-emitting device package body, display and illuminating device |
| US7977696B2 (en) | 2006-05-31 | 2011-07-12 | Fujikura Ltd. | Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device |
| WO2007138695A1 (en) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | Light-emitting device mounting substrate and method for producing same, light-emitting device module and method for manufacturing same, display, illuminating device, and traffic signal system |
| CN101501870B (en) | 2006-05-31 | 2012-10-31 | 株式会社藤仓 | Light-emitting device mounting substrate, light-emitting device module and display |
| EP2023407A4 (en) * | 2006-05-31 | 2014-01-15 | Fujikura Ltd | LIGHT-EMITTING DEVICE MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME, LIGHT-EMITTING DEVICE MODULE AND METHOD FOR MANUFACTURING SAME, DISPLAY, LIGHTING DEVICE, AND CIRCULATION SIGNALING SYSTEM |
| JP2010500779A (en) * | 2006-08-11 | 2010-01-07 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Device chip carrier, module and manufacturing method thereof |
| US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| JP2009038202A (en) * | 2007-08-01 | 2009-02-19 | Fujikura Ltd | Light-emitting element mounting substrate, light-emitting element module, lighting device, display device, and traffic signal device |