JPS6285285A - Electrode connection structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention is applicable to flat display devices such as liquid crystal display devices, plasma display devices, or EL display devices;
The present invention relates to an electrode connection structure that connects an external lead-out electrode group of a flat device and an output electrode group of a film carrier carrying a semiconductor device for driving the flat device in a flat sensor array such as an ED array.

(Prior Art) In order to drive a flat plate device, it is necessary to connect the external lead-out electrode group of the device and the output electrode group of the circuit board on which the driving device is mounted, and several methods are available for this purpose. It is taken.

For example, as shown in FIG. 2, the output @ electrode group formed at the end of the circuit board 2 on which a plurality of driving semiconductor devices 1 are mounted on the same substrate and the external lead-out electrode group 4 of the flat device 3 are placed relative to each other. In this method, conductive parts and non-conductive parts are arranged mutually, and the anisotropic conductive rubber 5 is sandwiched between electrodes and compressed to connect them.

Further, as shown in FIG. 3, using a flexible circuit board 6 for connection, the output electrode group of the circuit board 2 and the external electrode group 4 of the flat device 3 are soldered on the flexible circuit board 6 for connection. Heat-seal using something like. Alternatively, there is a method of thermocompression bonding using an anisotropic conductive film formed from an adhesive and a conductive material dispersed.

As another example, as shown in FIG. 4, a driving semiconductor device 1 is mounted on a flexible substrate 7, and an output electrode group and an external lead-out electrode group 4 of a flat device 3 are formed at one end. There is a way to connect them using the above method.

(Problem that the invention attempts to solve) The above method has the following drawbacks.

(1) The method using anisotropic conductive rubber has a high internal resistance (several tens of ohms or more) and therefore has a large electrical loss.

(2) Heat fusion methods using solder etc. require treatment steps (plating, vapor deposition, etc.) for the device electrode surface, which not only complicates the process, but also only allows the use of electrode materials; Connected items cannot be replaced.

(3) Since the anisotropic conductive film uses resin as an adhesive, it has poor heat resistance and moisture resistance, and its reliability is significantly reduced.

(4) In flexible circuit boards, the film that is the material of the board undergoes heat shrinkage, so when used for narrow pitch, large devices, pitch deviations are likely to occur! +1゜The purpose of the present invention is to eliminate the conventional drawbacks, integrate the film carrier carrying the semiconductor device and the connection part, make the package compact, and improve the reliability and low resistance of the connection part. An object of the present invention is to provide an electrode connection structure that enables ground detection of a circuit board.

(Means for Solving the Problems) The electrode-connected m-adic body of the present invention is equipped with a flat device having a group of external lead-out electrodes on the periphery and a semiconductor device for driving this flat device, and is cut into predetermined dimensions. A first cushioning material is installed near a group of film carriers having leads at at least two ends, a group of external lead-out electrodes of the flat device, and a second cushioning material is provided near a group of input electrodes of the circuit board.
A connecting frame body on which a cushioning material of
and a support frame for coupling and fixing at a portion provided with a second cushion material, the film carrier group is installed on the support frame, and one surface of the lead at one end is connected to the external lead-out electrode. The other surface is in contact with the first cushion material, the lead at the other end is in contact with the input electrode group of the circuit board on the support frame, and the other surface is in contact with the first cushion material.
The bonding process is performed so that the second cushion material comes into contact with the second cushion material.

(Function) According to the above configuration, since the semiconductor device is mounted on the support frame, it becomes compact, and since the connection is made by mechanical pressing force, the reliability is high and the process is simplified. .

(Example) An embodiment of the present invention will be described based on FIG.

FIG. 1 is a perspective view of essential parts of a flat plate device according to the present invention. In this figure, the same parts as those in the conventional example shown in FIGS. 2 to 4 are designated by the same numbers, and the explanation thereof will be omitted.

In FIG. 151, a circuit board 9 is fixed to a support frame 8, and a film carrier 10 on which a semiconductor device 1 is mounted is placed on the support frame 8.

One lead 11 is in contact with the external lead-out electrode group 4, the other lead 12 is in contact with the input electrode group of the circuit board 9, and the other surface of each lead is in contact with the first and second cushioning materials of the connection frame 13. 14. In contact with 15, the support frame 8 and the connection frame 13
has a fixed structure.

Next, a specific example will be explained.

A case will be explained in which the planar device 3 is an EL display having an external lead-out electrode group 4 of 256 scanning electrodes and 1024 signal electrodes at a pitch of 0.32 mm. The electrode material is C
r or ITO.

The support frame 8 and the connection frame 13 were each made from At'. On the support frame 8, Cu is placed on the Gala Evo substrate.
A circuit board 9 formed with a foil pattern and subjected to solder plating or Au plating was fixed, and a groove was formed in the connection frame 13 and a piton rod (2 mtrhφ) was inserted as a cushion material 14.15.

The film carrier 10 has Cu on a polyimide film.
A pattern is formed using foil, and Sn plating or Au plating is applied to the semiconductor device.
A bump having a structure of -Pd-Au was formed, connected to the film carrier 10 by Au-5n alloy or Au-Au, and cut into a predetermined size.

40 film carriers (8 on the scanning side and 32 on the signal side) are installed on the support frame 8, 11 groups of leads are placed on the external lead electrode group 4, and 12 groups of leads are placed on the input electrode group of the circuit board 9. Cushion material 1 placed on top and fixed to connection frame 13
4.15, the support frame 8 and the connection frame 13 were fixed with screws so as to be in pressure contact with the external lead-out electrode group 4 of the lead 11 group, the lead 12 group, and the input electrode group of the circuit board 9, respectively.

The EL display mounted in this way has a driving voltage of 1
Good results were obtained when driving at 00V and a maximum current of 80mA. At this time, the connection resistance value was 1Ω or less regardless of the electrode material, and was less than twice the initial value even after 1000 hours of constant temperature storage at 125°C and 85% constant temperature storage at 85°C. 6. Support frame of film carrier 10 8. 1: The method of installing the film carrier 10 is to make a positioning groove in the support frame 8 and drop it in to fix it, or to form a protrusion in the support frame 8 and make a hole in the film carrier 10 that matches the protrusion. The film carrier 10 can also be fixed by passing a hole in the film carrier 10 through a protrusion of the support frame 8.

Further, in the embodiment, the support frame 8 and the connection frame 13 are fixed by screws, but the frames may be fitted into each other, or a separate fixing jig may be provided.

Although the support frame 8 and the connection frame I3 have been described as AIm, they are not limited to this, and may be made of Cu, CuS, iron, ceramic, resin, etc. Also, the cushioning materials 14 and 15 are made of silicon. An elastic material having relatively heat resistance such as rubber can also be used.6 (Effects of the Invention) According to the present invention, a film carrier on which a driving semiconductor device is mounted can be installed on a support frame, which is different from the conventional one. Since there is no need to use a flexible circuit board, the number of man-hours is reduced, the number of connection points is reduced, the connection resistance is low, the reliability is high, and the cost is low, which has great practical effects.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a main part of a flat plate type electrode connection structure according to an embodiment of the present invention, and FIGS. 2 to 4 are perspective views of a conventional flat plate type electrode connection structure. 1... Drive semiconductor device, 2, 9... Circuit board, 3
... Flat plate device, 4... External lead-out electrode group, 5.
... Anisotropic conductive rubber, 6... Flexible circuit board for connection,
7... Flexible circuit board, 8... Support frame, 10...
・ Film carrier, 11.12... Riichido, 1
3...Connection frame body, 14.15...Cushion material. Distortion) Figure 1 10 Hui? IA also rear figure 2 figure 4

Claims (1)

[Claims] A film carrier group, which is equipped with a flat device having a group of external lead-out electrodes on its periphery and a semiconductor device for driving the flat device, and which is cut into a predetermined size and has leads at at least two ends, is attached to the flat device. A connection frame body in which a first cushioning material is installed near the external lead-out electrode group and a second cushioning material is installed near the input electrode portion of the circuit board, the circuit board is fixed, and the flat device is connected to the connection frame body. a support frame for connecting and fixing a connecting frame at a portion where the first and second cushioning materials are provided, and a film carrier group is installed on the support frame and has a lead at one end. one surface is in contact with the external lead-out electrode group, the other surface is in contact with the first cushion material, and the lead at the other end is in contact with the input electrode group of the circuit board on the support frame, An electrode connection structure characterized in that the other surface is bonded and fixed to the second cushion material so as to be in contact with the second cushion material.