JPS628657U - - Google Patents

Info

Publication number
JPS628657U
JPS628657U JP7401986U JP7401986U JPS628657U JP S628657 U JPS628657 U JP S628657U JP 7401986 U JP7401986 U JP 7401986U JP 7401986 U JP7401986 U JP 7401986U JP S628657 U JPS628657 U JP S628657U
Authority
JP
Japan
Prior art keywords
light emitting
covered
insulating film
emitting device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7401986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7401986U priority Critical patent/JPS628657U/ja
Publication of JPS628657U publication Critical patent/JPS628657U/ja
Pending legal-status Critical Current

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  • Formation Of Insulating Films (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の方法で作られたGaP発光ダイ
オードチツプ途中工程の断面図、第2図は従来の
方法で作られたGaP発光ダイオードチツプの斜
視図、第3図a,bは本考案の一実施例であるG
aP発光ダイオードの製造方法を工程順に示す断
面図、図cは発光ダイオードチツプの斜視図であ
る。 1…高不純物濃度n型GaP単結晶基板、2…
n型GaPエピタキシアル成長層、3…P型Ga
Pエピタキシアル成長層、4…p―n接合、5…
P型非整流性接触電極、6…n型非整流性接触電
極、7…シリコン酸化膜、8…溝、9…低融点ガ
ラス被着層。
Fig. 1 is a cross-sectional view of a GaP light emitting diode chip made by a conventional method, and Fig. 2 is a perspective view of a GaP light emitting diode chip made by a conventional method. An example of G
FIG. 3 is a cross-sectional view showing the manufacturing method of an aP light emitting diode in the order of steps, and FIG. 3C is a perspective view of a light emitting diode chip. 1...High impurity concentration n-type GaP single crystal substrate, 2...
n-type GaP epitaxial growth layer, 3...P-type Ga
P epitaxial growth layer, 4... pn junction, 5...
P-type non-rectifying contact electrode, 6... N-type non-rectifying contact electrode, 7... Silicon oxide film, 8... Groove, 9... Low melting point glass adhesion layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプの側面に露出するp―n接合線が
、電気泳動法を用いて選択的に被着されたガラス
微粒を熱処理して得る透明な絶縁性被膜で被覆さ
れていることを特徴とする半導体発光装置。
A semiconductor characterized in that p-n junction lines exposed on the side surfaces of a semiconductor chip are covered with a transparent insulating film obtained by heat-treating glass particles selectively deposited using an electrophoresis method. Light emitting device.
JP7401986U 1986-05-16 1986-05-16 Pending JPS628657U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7401986U JPS628657U (en) 1986-05-16 1986-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7401986U JPS628657U (en) 1986-05-16 1986-05-16

Publications (1)

Publication Number Publication Date
JPS628657U true JPS628657U (en) 1987-01-19

Family

ID=30918857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7401986U Pending JPS628657U (en) 1986-05-16 1986-05-16

Country Status (1)

Country Link
JP (1) JPS628657U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5011383A (en) * 1973-05-30 1975-02-05
JPS5279775A (en) * 1975-12-26 1977-07-05 Toshiba Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5011383A (en) * 1973-05-30 1975-02-05
JPS5279775A (en) * 1975-12-26 1977-07-05 Toshiba Corp Semiconductor device

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