JPS6287438U - - Google Patents
Info
- Publication number
- JPS6287438U JPS6287438U JP1985179233U JP17923385U JPS6287438U JP S6287438 U JPS6287438 U JP S6287438U JP 1985179233 U JP1985179233 U JP 1985179233U JP 17923385 U JP17923385 U JP 17923385U JP S6287438 U JPS6287438 U JP S6287438U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- workpiece
- reflection point
- bonding head
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は本考案における光反射点及びキヤピラリ先端
部の移動順序を説明するためのリードフレームの
部分的拡大平面図、第３図は従来例を示す正面図
、第４図は従来例における光反射点及びキヤピラ
リ先端部の移動順序を説明するためのリードフレ
ームの部分的拡大平面図である。
２……ボンデイングヘツド、６……投光部、８
……検出用テレビカメラ、３１……キヤピラリ。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is a partially enlarged plan view of the lead frame to explain the movement order of the light reflection point and the tip of the capillary in the present invention, Figure 3 is a front view showing the conventional example, and Figure 4 is the light reflection point in the conventional example. and FIG. 6 is a partially enlarged plan view of the lead frame for explaining the movement order of the capillary tips. 2...Bonding head, 6...Light projection part, 8
...Detection TV camera, 31...Capillary.
Claims (1)
ングヘツド２と、このボンデイングヘツド２に、
上下動可能に取付けられかつワイヤが挿通される
キヤピラリ３１とを有し、該キヤピラリの中心軸
線がワークの面に対して垂直に設定されたワイヤ
ボンデイング装置において、前記キヤピラリの中
心軸線と、ワークの面との交点を反射点とし、上
記キヤピラリに妨げられることなく上記反射点に
投光する投光部６及び上記反射点の反射光を受光
する検出用テレビカメラ８を、前記ボンデイング
ヘツド２に設けたことを特徴とするワイヤボンデ
イング装置。 A bonding head 2 that is movable relative to the workpiece, and a bonding head 2 that is movable relative to the workpiece.
In a wire bonding device, the capillary 31 is attached to be movable up and down and through which a wire is inserted, and the center axis of the capillary is set perpendicular to the surface of the workpiece. The bonding head 2 is provided with a light projecting unit 6 that uses the intersection with the surface as a reflection point and projects light onto the reflection point without being obstructed by the capillary, and a detection television camera 8 that receives the reflected light from the reflection point. A wire bonding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985179233U JPS6287438U (en) | 1985-11-21 | 1985-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985179233U JPS6287438U (en) | 1985-11-21 | 1985-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6287438U true JPS6287438U (en) | 1987-06-04 |
Family
ID=31122111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985179233U Pending JPS6287438U (en) | 1985-11-21 | 1985-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287438U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519374A (en) * | 1974-07-12 | 1976-01-26 | Hitachi Ltd | KAKUDAIGAZOOR YOSHITA BONDEINGUHOHO |
| JPS5412668A (en) * | 1977-06-30 | 1979-01-30 | Toshiba Corp | Position deciding method for semiconductor component and wire bonding device the said method |
-
1985
- 1985-11-21 JP JP1985179233U patent/JPS6287438U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519374A (en) * | 1974-07-12 | 1976-01-26 | Hitachi Ltd | KAKUDAIGAZOOR YOSHITA BONDEINGUHOHO |
| JPS5412668A (en) * | 1977-06-30 | 1979-01-30 | Toshiba Corp | Position deciding method for semiconductor component and wire bonding device the said method |