JPH028036U - - Google Patents
Info
- Publication number
- JPH028036U JPH028036U JP1988084623U JP8462388U JPH028036U JP H028036 U JPH028036 U JP H028036U JP 1988084623 U JP1988084623 U JP 1988084623U JP 8462388 U JP8462388 U JP 8462388U JP H028036 U JPH028036 U JP H028036U
- Authority
- JP
- Japan
- Prior art keywords
- package
- inclination
- electrodes
- wire
- wire bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例１におけるＸ方向の断
面図、第２図は本考案の実施例２を示す縦断面図
、第３図は従来のワイヤーボンダーを示す断面図
である。
１……発光部、２……受光部、３……キヤピラ
リ、４……ワイヤー、５……素子、６……素子の
電極、７……パツケージ、８……外部リード接続
部、９……傾斜を補正する機構を有するステージ
。
FIG. 1 is a cross-sectional view in the X direction of a first embodiment of the present invention, FIG. 2 is a longitudinal cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional wire bonder. DESCRIPTION OF SYMBOLS 1... Light emitting part, 2... Light receiving part, 3... Capillary, 4... Wire, 5... Element, 6... Element electrode, 7... Package, 8... External lead connection part, 9... A stage with a mechanism to correct tilt.
Claims (1)
外部リード接続部とをワイヤーで接続するワイヤ
ーボンダーにおいて、パツケージ及び素子の電極
の傾斜を検出する機構と、該検出機構に連動して
その傾斜を補正するために素子の角度を調整する
機構とを有することを特徴とするワイヤーボンダ
ー。 A wire bonder that connects the electrodes of an element attached inside a package and an external lead connection part with a wire has a mechanism for detecting the inclination of the electrodes of the package and the element, and a mechanism for correcting the inclination in conjunction with the detection mechanism. A wire bonder characterized by having a mechanism for adjusting the angle of an element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084623U JPH028036U (en) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084623U JPH028036U (en) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028036U true JPH028036U (en) | 1990-01-18 |
Family
ID=31309304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988084623U Pending JPH028036U (en) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028036U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294710A (en) * | 2005-04-06 | 2006-10-26 | Nec Corp | Tilt correction method, wire bonding method, and wire bonding apparatus |
-
1988
- 1988-06-27 JP JP1988084623U patent/JPH028036U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006294710A (en) * | 2005-04-06 | 2006-10-26 | Nec Corp | Tilt correction method, wire bonding method, and wire bonding apparatus |