JPS6292858A - thermal head - Google Patents

thermal head

Info

Publication number
JPS6292858A
JPS6292858A JP23116785A JP23116785A JPS6292858A JP S6292858 A JPS6292858 A JP S6292858A JP 23116785 A JP23116785 A JP 23116785A JP 23116785 A JP23116785 A JP 23116785A JP S6292858 A JPS6292858 A JP S6292858A
Authority
JP
Japan
Prior art keywords
thermal head
dummy
fpc
soldering
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23116785A
Other languages
Japanese (ja)
Inventor
Takehiko Yamada
山田　武彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP23116785A priority Critical patent/JPS6292858A/en
Publication of JPS6292858A publication Critical patent/JPS6292858A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Electronic Switches (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は感熱記録用のサーマルヘッドに係り、特に基板
とＦＰＣ（フレキシブル、ブリンテド、サーキット）の
はんだ接続に好適な＋ｔＩｔ造を有するサーマルヘッド
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thermal head for thermosensitive recording, and particularly to a thermal head having a +tIt structure suitable for solder connection between a substrate and an FPC (flexible, printed, circuit).

〔発明の背景〕[Background of the invention]

従来のサーマルヘッドの記録幅が大きくな、ると必然的
に基板とＦＰＣの接続幅も大きくなる。As the recording width of a conventional thermal head increases, the connection width between the substrate and the FPC inevitably increases.

このため基板を構成するセラミックとＦＰＣｉ構成する
ポリイミドと熱膨張差により、はんだ付け接続部に加わ
る熱応力も大きくなって、接接部のはがれが発生する恐
れがあった。このため従来からサーマルヘッドの長尺化
に対し、基板とＦＰＣのはんだ付け接続部に加わる応力
低減対策がなされていて、たとえば特公昭５２−９５４
２　号公報に記載のＦＦＣのフィルムに切込。Therefore, due to the difference in thermal expansion between the ceramic constituting the board and the polyimide constituting the FPCi, the thermal stress applied to the soldered joint increases, and there is a risk that the joint will peel off. For this reason, countermeasures have been taken to reduce the stress applied to the soldered joints between the board and FPC in response to the increase in the length of the thermal head.
2. Cut into the FFC film described in Publication No. 2.

み部を設ける構造などが知られている。しかしながらこ
のような従来のサーマルヘッドにはＦＰＣの幅が大きく
なるなどの問題があった。A structure in which a groove is provided is known. However, such conventional thermal heads have problems such as an increase in the width of the FPC.

〔発明の目的〕[Purpose of the invention]

本発明の目的は上記した従来技術の問題点号解決し、基
板とＦＰＣのはんだ付け接続部の信頼性を向上できるサ
ーマルヘッドを提供するにある０ 〔発明の概要〕 本発明は上記目的を達成するため、基板とＦＰＣのはん
だ付け接続部の一部に好ましくは３個所以上のダミー接
続部ご設け、このダミー接続部に熱応力を受けさせて各
信号端子はんだ付け部に加わる熱応力分緩和するように
したサーマルヘッドである。An object of the present invention is to provide a thermal head that solves the problems of the prior art described above and improves the reliability of the soldered connection between a board and an FPC. Therefore, preferably three or more dummy connections are provided in a part of the soldered connection between the board and the FPC, and the dummy connections are subjected to thermal stress to alleviate the thermal stress applied to each signal terminal soldered area. This is a thermal head designed to

〔発明の実施例〕[Embodiments of the invention]

以下に本発明の一実施例を第１図および第２図により説
明する。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第１図は本発明によるサーマルヘッドの一実施例を示す
斜視図である。丁た第２図は第１図のＦＰＣの平面図で
ある。第１図および第２図において、１は基板、２はＦ
ＰＣ，３はヒートシンク、４は駆動ＩＣ，５は発熱抵抗
体列、６は外部接続コネクタ、７は基板１とＦＰＣ２の
接続部、８は本発明によるダミーはんだ付け部（ダミー
接続部）９は制御信号端子はんだ付け都テする。本サー
マルヘッドはセラミック等の基板１上に発熱抵抗体列５
と、図示しない電極配線と、制御信号配線と、ＦＰＣ２
とのはんだ付け接続パッド等を形成し、この基板１上に
駆動ＩＣ４を搭載し、ＦＰＣ２と接続部３でダミーはん
だ付け部８と制御信号端子はんだ付け部９のはんだ付け
？し１さらに外部接続コネクタ６等をはんだけけし、ヒ
ートシンク上に固着してなる。ここでＦＰＣ２にはんだ
付け接続部の。FIG. 1 is a perspective view showing an embodiment of a thermal head according to the present invention. FIG. 2 is a plan view of the FPC shown in FIG. 1. 1 and 2, 1 is the substrate, 2 is the F
PC, 3 is a heat sink, 4 is a drive IC, 5 is a heat generating resistor array, 6 is an external connection connector, 7 is a connection part between the board 1 and FPC 2, 8 is a dummy soldering part (dummy connection part) according to the present invention, and 9 is Solder the control signal terminals. This thermal head has a heating resistor array 5 on a substrate 1 made of ceramic or the like.
, electrode wiring (not shown), control signal wiring, and FPC2
Form soldering connection pads, etc. with the substrate 1, mount the drive IC 4 on this board 1, and solder the dummy soldering part 8 and the control signal terminal soldering part 9 with the FPC 2 and the connection part 3. 1. Furthermore, the external connection connector 6 and the like are soldered and fixed on the heat sink. Here, the soldered connection part to FPC2.

一部に好ましくは５個所以上（図の場合は５（御所）の
ダミーはんだ付け部８を設け）このダミーはんだ付け部
８は各制御信号端子はんだ付け部ゾに比べて大きな面積
に形成される。Preferably, 5 or more dummy soldering parts 8 (in the case of the figure, 5 (Gose) dummy soldering parts 8 are provided in one part.The dummy soldering parts 8 are formed to have a larger area than the soldering parts of each control signal terminal. .

このようにして本実施例によれば、サーマルヘッドの基
板１とＦＰＣ２のはんだ付け接続部の一部に好ましくは
３個所以上のダミー接続部８ご設け、好ましくはダミー
接続部８の面積を信号端子はんだ付け部９よりも大きく
して、これに熱応力牙かけさせることにより各信号端子
はんだ付け部９の接続信頼性を向上できる。In this way, according to this embodiment, preferably three or more dummy connection parts 8 are provided in a part of the solder connection part between the substrate 1 and the FPC 2 of the thermal head, and preferably the area of the dummy connection part 8 is signaled. The connection reliability of each signal terminal soldering part 9 can be improved by making it larger than the terminal soldering part 9 and subjecting it to thermal stress.

〔発明の効果〕〔Effect of the invention〕

以上に説明したように本発明によれば、サーマルヘッド
の基板とＦＰＣの熱膨張差により発生するはんだ付け接
続部の熱応力をダミー接続部で受け・各信号端子はんだ
付け部に加わる熱力企低減することが可能となり、基板
とＦＰＣのはんだ付け接続部のはがれをなくして信頼性
向上に寄与できる。As explained above, according to the present invention, the thermal stress of the soldered joint caused by the difference in thermal expansion between the substrate of the thermal head and the FPC is received by the dummy joint, and the thermal stress applied to the soldered part of each signal terminal is reduced. This makes it possible to eliminate peeling of the soldered joint between the board and FPC, contributing to improved reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明によるサーマルヘッド（７）　一実施例
を示す斜視図、第２図は第１図のＦＰＣの平面図である
。 １・・・基板 ２・・・ＦＰＣ ８・・・ダミーはんだ付け部（ダミー接続部）９・・・
信号端子はんだ付け部 、、”′−・ 代理人弁理＋　　小　　川　　勝　　用第　１　区 第　２　ＺFIG. 1 is a perspective view showing an embodiment of a thermal head (7) according to the present invention, and FIG. 2 is a plan view of the FPC shown in FIG. 1. 1... Board 2... FPC 8... Dummy soldering part (dummy connection part) 9...
Signal terminal soldering part, ``'-・ Attorney + Masaru Ogawa 1st Ward 2nd Z

Claims (1)

【特許請求の範囲】 １、表面に少なくとも発熱抵抗体列と配線パターンを形
成した基板と、信号接続端子を有するＦＰＣとの間のは
んだ付け接続部に、信号接続端子はんだ付け部のほかに
ダミー接続部を設けてなるサーマルヘッド。 ２、上記ダミー接続部は３個所以上に設けた特許請求の
範囲第１項記載のサーマルヘッド。 ３、上記ダミー接続部は他の信号接続端子はんだ付け部
よりも大きな面積に形成した特許請求の範囲第１項また
は第２項記載のサーマルヘッド。 ４、上記基板は駆動ＩＣを塔載した特許請求の範囲第１
項または第２項または第３項記載のサーマルヘッド。[Claims] 1. In addition to the signal connection terminal soldering portion, a dummy is provided at the soldering connection portion between the substrate on which at least a heating resistor array and wiring pattern are formed and the FPC having the signal connection terminal. A thermal head with a connecting part. 2. The thermal head according to claim 1, wherein the dummy connection portions are provided at three or more locations. 3. The thermal head according to claim 1 or 2, wherein the dummy connection portion is formed to have a larger area than the other signal connection terminal soldering portions. 4. Claim 1, in which the substrate has a drive IC mounted thereon.
The thermal head according to item 1 or 2 or 3.
JP23116785A 1985-10-18 1985-10-18 thermal head Pending JPS6292858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23116785A JPS6292858A (en) 1985-10-18 1985-10-18 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23116785A JPS6292858A (en) 1985-10-18 1985-10-18 thermal head

Publications (1)

Publication Number Publication Date
JPS6292858A true JPS6292858A (en) 1987-04-28

Family

ID=16919363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23116785A Pending JPS6292858A (en) 1985-10-18 1985-10-18 thermal head

Country Status (1)

Country Link
JP (1) JPS6292858A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127750U (en) * 1988-02-19 1989-08-31
JPH04130850U (en) * 1991-05-24 1992-12-01 アルプス電気株式会社 thermal head
JPH05177862A (en) * 1992-06-22 1993-07-20 Rohm Co Ltd Line thermal head
WO2000078111A1 (en) * 1999-06-15 2000-12-21 Matsushita Refrigeration Company Power controller and compressor for refrigeration system
JP2001334696A (en) * 2000-05-29 2001-12-04 Kyocera Corp Thermal head

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127750U (en) * 1988-02-19 1989-08-31
JPH04130850U (en) * 1991-05-24 1992-12-01 アルプス電気株式会社 thermal head
JPH05177862A (en) * 1992-06-22 1993-07-20 Rohm Co Ltd Line thermal head
WO2000078111A1 (en) * 1999-06-15 2000-12-21 Matsushita Refrigeration Company Power controller and compressor for refrigeration system
US6704202B1 (en) 1999-06-15 2004-03-09 Matsushita Refrigeration Company Power controller and compressor for refrigeration system
JP2001334696A (en) * 2000-05-29 2001-12-04 Kyocera Corp Thermal head

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