JPS6295251A - Thermal printing head apparatus - Google Patents
Thermal printing head apparatusInfo
- Publication number
- JPS6295251A JPS6295251A JP23687785A JP23687785A JPS6295251A JP S6295251 A JPS6295251 A JP S6295251A JP 23687785 A JP23687785 A JP 23687785A JP 23687785 A JP23687785 A JP 23687785A JP S6295251 A JPS6295251 A JP S6295251A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- head
- heat generating
- wiring board
- common lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007651 thermal printing Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） この発明はサーマルプリントヘッド装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a thermal print head device.
（従来の技術）
周知のようにこの種サーマルプリントヘッド装置は、セ
ラミック製の基板の表面に設けられた発熱部と、これか
ら導出されであるリードとよりなるヘッドと、フレキシ
ブルプリント配線板（以下単にＦＰ配線板）とによって
構成される。そしてヘッドのリードをＦＰ配線板のリー
ドとを接続することによって、前記リードを外部に導出
するようにしている。(Prior Art) As is well known, this type of thermal print head device consists of a head consisting of a heat generating part provided on the surface of a ceramic substrate, leads derived from the heat generating part, and a flexible printed wiring board (hereinafter simply referred to as FP wiring board). By connecting the leads of the head to the leads of the FP wiring board, the leads are led to the outside.
第３図は一般のこの種ヘッドを示し、１はセラミックな
どからなる基板、２はその表面に設けられた発熱部で１
図では例として６箇の発熱部を備えたものを示している
。３は各発熱部２の一方の端部に接続されである個別リ
ード、４は他方の各端部に共通に接続されである統一共
通リードである。５はＦＰ配線板で、その樹脂製のベー
ス６の一方の面に、前記各個別リード３に接続される個
別リード７と、統一共通り−ド４に接続される統一共通
り−ド８とを備えている。Figure 3 shows a general head of this type, where 1 is a substrate made of ceramic or the like, 2 is a heat generating part provided on its surface, and 1
The figure shows an example with six heat generating parts. 3 is an individual lead connected to one end of each heat generating part 2, and 4 is a unified common lead commonly connected to each other end. Reference numeral 5 denotes an FP wiring board, and on one side of its resin base 6, individual leads 7 are connected to the respective individual leads 3, and a unified common lead 8 is connected to the unified common lead 4. It is equipped with
実際にはヘッド１上のリードとＦＰ配線板５上のリード
とは互いに重ね合せてから、半田によって接続されるの
が一般的である。そのためにＦＰ配線板５にはヘッド１
の表面と向い合う面、すなわち図では裏側の面に各リー
ド７．８が現れるようにし、これをそのままヘッド１の
表面に重ね合わすようにしている。In practice, the leads on the head 1 and the leads on the FP wiring board 5 are generally overlapped with each other and then connected by soldering. For this purpose, the head 1 is mounted on the FP wiring board 5.
The leads 7 and 8 are made to appear on the surface facing the surface of the head 1, that is, on the back side in the figure, and are overlapped directly on the surface of the head 1.
ところでこのような構成は発熱部２の列がヘッド１のほ
ぼ中央あるいは端部からある程度能れたところに設置さ
れてあって、その列の一方の側に統一共通り−ド４が設
置できる余裕のある空間が存在しているときに限って製
作できる。しかしヘッドの種類によっては発熱部をヘッ
ドの一方の側縁に近接して設置することが要求されるこ
とがある。このような場合は発熱部の列の一方の側とヘ
ッドの側縁との間の空間が狭くなりすぎてしまい、そこ
に前記したような統一共通リードを設置することができ
ないようになる。Incidentally, in such a configuration, the row of heat generating parts 2 is installed approximately at the center of the head 1 or at a certain distance from the end, and there is enough room to install the unified common board 4 on one side of the row. It can only be produced when a certain space exists. However, depending on the type of head, it may be necessary to install the heat generating part close to one side edge of the head. In such a case, the space between one side of the row of heat generating parts and the side edge of the head becomes too narrow, making it impossible to install the unified common lead as described above there.
これを解決しようとしたのが第４図に示す構成である。The configuration shown in FIG. 4 is an attempt to solve this problem.
これは各発熱部の２箇を１群としその各群に属する２個
の発熱部２Ａ、２Ｂの一方の端部を短絡導体９によって
短絡しておき、またひとつの群のひとつの発熱部２Ａと
、これに隣接する他の群に属する他のひとつの発熱部２
Ｂとに共通する共通リード１０を設けたものである。This is done by arranging two of each heat generating part into a group, one end of each of the two heat generating parts 2A and 2B belonging to each group is short-circuited by a shorting conductor 9, and one heat generating part 2A of one group is short-circuited. and another heat generating part 2 belonging to another group adjacent to this
A common lead 10 common to B is provided.
これによれば発熱部の列の一方の側とヘッドの側縁との
間には１幅が狭くてよい短絡導体９を設置するだけの空
間が確保されるだけでよいので、発熱部をヘッドの側縁
に可及的に接近して設置できるようになって都合がよい
。なおこの構成ではひとつの個別リードとこれに隣合う
共通リードとの間に電圧を印加すれば、両リード間にあ
る２箇の発熱部が同時に発熱するようになっている。According to this, it is only necessary to secure a space between one side of the row of heat generating parts and the side edge of the head to install the shorting conductor 9, which may be narrow in width by one width. It is convenient because it can be installed as close as possible to the side edge of the In this configuration, if a voltage is applied between one individual lead and the adjacent common lead, the two heat generating parts between the leads simultaneously generate heat.
しかしこのような構成のヘッドに連なるＦＰ配線板のリ
ードは、ヘッドのリードパターンと合致させなければな
らない。そのためＦＰ配線板の共通リードは個別リード
の間に点在するようになり。However, the leads of the FP wiring board connected to the head with such a configuration must match the lead pattern of the head. Therefore, the common leads of FP wiring boards are now scattered among the individual leads.
第３図に示すようにすべてを一括したものにはならない
。したがってこのＦＰ配線板に接続される他の回路との
接続作業が極めて煩雑とならざるを得ない。As shown in Figure 3, it is not possible to put everything together. Therefore, the connection work with other circuits connected to this FP wiring board becomes extremely complicated.
（発明が解決しようとする問題点）
この発明は発熱部の列をヘッドの側縁に接近して設置し
ても、ＦＰ配線板では全ての共通リードを統一して一括
することを目的とする。(Problems to be Solved by the Invention) The purpose of this invention is to unify all the common leads on the FP wiring board even if the row of heat generating parts is installed close to the side edge of the head. .
（問題点を解決するための手段）
この発明はヘッドの個別リードの端部に並設されるよう
に統一共通リードを設け、各共通リードと前記統一共通
リードとをワイヤボンディングによって接続し、一方Ｆ
Ｐ配線板には前記ヘッドの個別リードおよび統一共通リ
ードのそれぞれに接続される個別リードとその群の少な
くとも一方の側に統一共通リードを設け、このＦＰ配線
板をヘッドに重ねてそれぞれの個別リード同志を、並び
に統一共通リード同志を互いに接続したことを特徴とす
る。(Means for Solving the Problems) The present invention provides a unified common lead so as to be arranged in parallel at the ends of individual leads of a head, and connects each common lead to the unified common lead by wire bonding. F
The P wiring board is provided with individual leads connected to each of the individual leads and unified common leads of the head, and a unified common lead on at least one side of the group, and this FP wiring board is stacked on the head to connect each individual lead. It is characterized by connecting the comrades and the unified common lead comrades to each other.
（実施例）
この発明の実施例を第１図乃至第２図によって説明する
。ここに使用するヘッドは第４図に示したものとほぼ同
じであるが、その表面に統一共通り−ド１１を個別リー
ド３の端部に並設しておく。(Example) An example of the present invention will be described with reference to FIGS. 1 and 2. The head used here is almost the same as that shown in FIG. 4, but on its surface a unified common lead 11 is arranged parallel to the ends of the individual leads 3.
そして各共通リード１０と統一共通り−ド１１とをワイ
ヤ１２によるワイヤボンディングによって互いに接続す
る。Each common lead 10 and the unified common lead 11 are connected to each other by wire bonding using a wire 12.
一方ＦＰ配線板５は第３図に示すものと同じようにその
表面（図では裏側）に、ヘッド１の個別リード３に接続
される個別リード７と、統一共通リード１３に接続され
る統一共通リード８が設けである。１３は各リード７．
８を覆う絶縁性のカバーレイである。On the other hand, the FP wiring board 5 has individual leads 7 connected to the individual leads 3 of the head 1 and a unified common lead 13 connected to the unified common lead 13 on its surface (the back side in the figure) as shown in FIG. Lead 8 is provided. 13 is each lead 7.
This is an insulating coverlay covering 8.
以上の構成において、ヘッド１の端部にＦＰ配線板５の
端部を重ね合せ、ヘッド１の統一共通リード１１とＦＰ
配線板５の統一共通リード８とが重ね合わされるように
し、またヘッド１の個別す−ド３とＦＰ配線板５の個別
リード７同志とが重ね合わされるようにし、各重ね合わ
されたリードを半田などで接続する。In the above configuration, the end of the FP wiring board 5 is overlapped with the end of the head 1, and the unified common lead 11 of the head 1 and the FP
The unified common leads 8 of the wiring board 5 are overlapped, and the individual leads 3 of the head 1 and the individual leads 7 of the FP wiring board 5 are overlapped, and each overlapped lead is soldered. Connect with etc.
このようにすれば、ヘッド１の表面において個別リード
３、共通リード１ｏが入り乱れて存在していても、共通
リード１０はワイヤ１２を介して統一共通リード１１に
一括接続されているので。In this way, even if the individual leads 3 and the common leads 1o are present in a jumbled manner on the surface of the head 1, the common leads 10 are all connected to the unified common lead 11 via the wire 12.
この統一共通り−ド１１を介してＦＰ配線板５の統一共
通リード８に一括接続されるようになる。Through this unified common lead 11, they are collectively connected to the unified common lead 8 of the FP wiring board 5.
したがってＦＰ配線板としては第３図に示したと同様に
１個別リードの一括された群と、その一方の側に並設さ
れる統一共通リードとによって構成することができるよ
うになる。Therefore, as shown in FIG. 3, the FP wiring board can be constructed of a group of individual leads and a unified common lead arranged in parallel on one side of the group.
なお図ではヘッド１の表面において、統一共通リード１
１を個別リード３の群の一方の側のみに設けているが、
その両側に設けるようにしてもよ（発明の効果）
以上詳述したようにこの発明によれば、発熱部の列をヘ
ッドの側縁に接近して設置しても、ＦＰ配線板では全て
の共通リードを統一して一括することができるとともに
、統一共通リードを個別リードの群のいずれかの側に並
設することができるといった効果を奏する。In addition, in the figure, on the surface of the head 1, the unified common lead 1
1 is provided only on one side of the group of individual leads 3,
They may be provided on both sides of the head (effects of the invention) As detailed above, according to the present invention, even if the row of heat generating parts is installed close to the side edge of the head, all of the The common leads can be unified and put together, and the unified common leads can be arranged in parallel on either side of the group of individual leads.
第１図はこの発明の実施例を示す平面図、第２図はＦＰ
配線板の一部の断面図、第３図は従来例の平面図、第４
図はヘッドの平面図である。
１・・・ヘッド、２Ａ、２Ｂ・・・発熱部、３・・・個
別リード、５・・・ＦＰ配線板、７・・・個別リード、
８・・・統一共通リード、９・・・短絡導体、１０・・
・共通リード、１１・・・統一共通リード、１２・・・
ワイヤ。
治／図
→ ウ ７
篩２１゜Fig. 1 is a plan view showing an embodiment of this invention, Fig. 2 is a FP
A cross-sectional view of a part of the wiring board, Figure 3 is a plan view of the conventional example, Figure 4 is a cross-sectional view of a part of the wiring board.
The figure is a plan view of the head. DESCRIPTION OF SYMBOLS 1... Head, 2A, 2B... Heat generating part, 3... Individual lead, 5... FP wiring board, 7... Individual lead,
8... Unified common lead, 9... Short circuit conductor, 10...
・Common lead, 11...Unified common lead, 12...
wire. Ji/Figure → U 7 Sieve 21゜
Claims (1)
部につき、その各２箇を１群とし、その各群に属する２
個の発熱部の一方の端部を短絡導体によって短絡し、ま
たひとつの群のひとつの発熱部と、これに隣接する他の
群に属しかつ前記ひとつの発熱部に隣接する発熱部とに
共通する共通リードを、また隣合わない発熱部に個別リ
ードを設け、前記ヘッドに更に前記個別リードの端部に
並設されるように統一共通リードを設け、前記各共通リ
ードを直接に前記統一共通リードにワイヤボンディング
によって接続し、一方フレキシブルプリント配線板には
、前記ヘッドの個別リードおよび統一共通リードのそれ
ぞれに接続される個別リードおよびその個別リードの群
の少なくとも一方の側に統一共通リードを設け、このフ
レキシブルプリント配線板を前記ヘッドに重ねてそれぞ
れの個別リード同志を、並びに統一共通リード同志を互
いに接続してなるサーマルプリントヘッド装置。Regarding the plurality of heat generating parts for printing provided on the surface of the head, each two of them are considered as one group, and the two parts belonging to each group are
One end of each heat generating part is short-circuited by a shorting conductor, and one heat generating part of one group is common to the heat generating part belonging to another group adjacent to said heat generating part and adjacent to said one heat generating part. A common lead is provided for the heat generating parts that are not adjacent to each other, and individual leads are provided for heat generating parts that are not adjacent to each other, and a unified common lead is further provided for the head so as to be arranged in parallel with the ends of the individual leads, and each of the common leads is directly connected to the unified common lead. The flexible printed wiring board is connected to the leads by wire bonding, and the flexible printed wiring board is provided with a unified common lead on at least one side of the individual leads and the group of individual leads connected to each of the individual leads and the unified common lead of the head. , a thermal print head device in which this flexible printed wiring board is stacked on the head and the respective individual leads are connected to each other and the unified common leads are connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23687785A JPH0712701B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23687785A JPH0712701B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6295251A true JPS6295251A (en) | 1987-05-01 |
| JPH0712701B2 JPH0712701B2 (en) | 1995-02-15 |
Family
ID=17007113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23687785A Expired - Fee Related JPH0712701B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712701B2 (en) |
-
1985
- 1985-10-22 JP JP23687785A patent/JPH0712701B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0712701B2 (en) | 1995-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |