JPS63100845U - - Google Patents

Info

Publication number
JPS63100845U
JPS63100845U JP19637486U JP19637486U JPS63100845U JP S63100845 U JPS63100845 U JP S63100845U JP 19637486 U JP19637486 U JP 19637486U JP 19637486 U JP19637486 U JP 19637486U JP S63100845 U JPS63100845 U JP S63100845U
Authority
JP
Japan
Prior art keywords
semiconductor device
interposed
conductive agent
heat
iron plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19637486U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19637486U priority Critical patent/JPS63100845U/ja
Publication of JPS63100845U publication Critical patent/JPS63100845U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の半導体素子の取付構造を示す
図、第2図は従来の半導体素子の取付構造を示す
図である。 1……半導体素子、2……放熱板、3……シリ
コングリス、4……ビス、5……ナツト、6……
鉄板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と貫通穴を設けた放熱板の一方の面
    との間に導熱剤を介在させて互いに密着させ、こ
    の放熱板の他方の面とタツプ穴を設けた鉄板との
    間に導熱剤を介在させ、半導体素子、放熱板、鉄
    板を共締めしたことを特徴とする半導体素子の取
    付構造。
JP19637486U 1986-12-19 1986-12-19 Pending JPS63100845U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19637486U JPS63100845U (ja) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19637486U JPS63100845U (ja) 1986-12-19 1986-12-19

Publications (1)

Publication Number Publication Date
JPS63100845U true JPS63100845U (ja) 1988-06-30

Family

ID=31155133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19637486U Pending JPS63100845U (ja) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPS63100845U (ja)

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