JPS6310552U - - Google Patents

Info

Publication number: JPS6310552U
Authority: JP; Japan
Prior art keywords: conductive layer; resin plate; bonding; electronic circuit; circuit device
Prior art date: 1986-07-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP1986104810U

Other languages

English (en)

Japanese (ja)

Other versions

JPH0310670Y2 (cs

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-07-08

Filing date

1986-07-08

Publication date

1988-01-23

1986-07-08 Application filed filed Critical

1986-07-08 Priority to JP1986104810U priority Critical patent/JPH0310670Y2/ja

1988-01-23 Publication of JPS6310552U publication Critical patent/JPS6310552U/ja

1991-03-15 Application granted granted Critical

1991-03-15 Publication of JPH0310670Y2 publication Critical patent/JPH0310670Y2/ja

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)

JP1986104810U 1986-07-08 1986-07-08 Expired JPH0310670Y2 (cs)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1986104810U JPH0310670Y2 (cs)	1986-07-08	1986-07-08

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1986104810U JPH0310670Y2 (cs)	1986-07-08	1986-07-08

Publications (2)

Publication Number	Publication Date
JPS6310552U true JPS6310552U (cs)	1988-01-23
JPH0310670Y2 JPH0310670Y2 (cs)	1991-03-15

Family

ID=30978646

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1986104810U Expired JPH0310670Y2 (cs)	1986-07-08	1986-07-08

Country Status (1)

Country	Link
JP (1)	JPH0310670Y2 (cs)

1986
- 1986-07-08 JP JP1986104810U patent/JPH0310670Y2/ja not_active Expired

Also Published As

Publication number	Publication date
JPH0310670Y2 (cs)	1991-03-15

Publication	Publication Date	Title
JPS6316444U (cs)	1988-02-03
JPH0328742U (cs)	1991-03-22
JPS6316443U (cs)	1988-02-03
JPS6413144U (cs)	1989-01-24
JPS63121444U (cs)	1988-08-05
JPH0270436U (cs)	1990-05-29
JPS63188961U (cs)	1988-12-05
JPS62114772U (cs)	1987-07-21
JPS635647U (cs)	1988-01-14
JPH0270459U (cs)	1990-05-29
JPH0343732U (cs)	1991-04-24
JPH0310670Y2 (cs)	1991-03-15
JPS63185250U (cs)	1988-11-29
JPH0226261U (cs)	1990-02-21
JPH01125544U (cs)	1989-08-28
JPS62188144U (cs)	1987-11-30
JPS62145337U (cs)	1987-09-12
JPS63112354U (cs)	1988-07-19
JPH03101529U (cs)	1991-10-23
JPH0359639U (cs)	1991-06-12
JPH01154411U (cs)	1989-10-24
JPH038449U (cs)	1991-01-28
JPH03120052U (cs)	1991-12-10
JPH0392038U (cs)	1991-09-19
JPH0247062U (cs)	1990-03-30