JPS6310552U - - Google Patents
Info
- Publication number
- JPS6310552U JPS6310552U JP1986104810U JP10481086U JPS6310552U JP S6310552 U JPS6310552 U JP S6310552U JP 1986104810 U JP1986104810 U JP 1986104810U JP 10481086 U JP10481086 U JP 10481086U JP S6310552 U JPS6310552 U JP S6310552U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- resin plate
- bonding
- electronic circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案に係る電子回路装置の要部の
み示す縦断面図、第２図は、従来の電子回路装置
の縦断面図である。 ２１……樹脂板、２２，２２′……導電層、２
３……貫通孔、２４……素子取付部、２５……素
子、２７……金属細線、３１……バンプ部。
み示す縦断面図、第２図は、従来の電子回路装置
の縦断面図である。 ２１……樹脂板、２２，２２′……導電層、２
３……貫通孔、２４……素子取付部、２５……素
子、２７……金属細線、３１……バンプ部。
Claims (1)
- 樹脂板の表裏両面に導電層を形成するとともに
、裏面導電層を樹脂板に穿設した貫通孔を介して
表面に導出し、これら導電層と樹脂板表面の素子
取付部に固着した素子の電極とをポンデイング結
線するようにした電子回路装置において、前記導
電層のボンデイング位置に金線をボンデイングし
てプレスすることにより形成したバンプ部を設け
たことを特徴とする電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104810U JPH0310670Y2 (ja) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104810U JPH0310670Y2 (ja) | 1986-07-08 | 1986-07-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6310552U true JPS6310552U (ja) | 1988-01-23 |
| JPH0310670Y2 JPH0310670Y2 (ja) | 1991-03-15 |
Family
ID=30978646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104810U Expired JPH0310670Y2 (ja) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310670Y2 (ja) |
-
1986
- 1986-07-08 JP JP1986104810U patent/JPH0310670Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0310670Y2 (ja) | 1991-03-15 |