JPS6310565U - - Google Patents
Info
- Publication number
- JPS6310565U JPS6310565U JP1986104091U JP10409186U JPS6310565U JP S6310565 U JPS6310565 U JP S6310565U JP 1986104091 U JP1986104091 U JP 1986104091U JP 10409186 U JP10409186 U JP 10409186U JP S6310565 U JPS6310565 U JP S6310565U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- support plate
- lead frame
- lead
- nickel plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104091U JPS6310565U (2) | 1986-07-07 | 1986-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104091U JPS6310565U (2) | 1986-07-07 | 1986-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310565U true JPS6310565U (2) | 1988-01-23 |
Family
ID=30977266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104091U Pending JPS6310565U (2) | 1986-07-07 | 1986-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310565U (2) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513742U (2) * | 1974-06-25 | 1976-01-12 | ||
| JPS5596662A (en) * | 1979-01-17 | 1980-07-23 | Toshiba Corp | Electronic component member |
| JPS57147259A (en) * | 1981-03-05 | 1982-09-11 | Toshiba Corp | Semiconductor device using lead frame |
| JPS57166058A (en) * | 1981-04-07 | 1982-10-13 | Hitachi Cable Ltd | Lead frame for semiconductor |
| JPS60117761A (ja) * | 1983-11-30 | 1985-06-25 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS6290954A (ja) * | 1985-10-16 | 1987-04-25 | Kobe Steel Ltd | リ−ドフレ−ム |
-
1986
- 1986-07-07 JP JP1986104091U patent/JPS6310565U/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513742U (2) * | 1974-06-25 | 1976-01-12 | ||
| JPS5596662A (en) * | 1979-01-17 | 1980-07-23 | Toshiba Corp | Electronic component member |
| JPS57147259A (en) * | 1981-03-05 | 1982-09-11 | Toshiba Corp | Semiconductor device using lead frame |
| JPS57166058A (en) * | 1981-04-07 | 1982-10-13 | Hitachi Cable Ltd | Lead frame for semiconductor |
| JPS60117761A (ja) * | 1983-11-30 | 1985-06-25 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS6290954A (ja) * | 1985-10-16 | 1987-04-25 | Kobe Steel Ltd | リ−ドフレ−ム |