JPS6310566U - - Google Patents
Info
- Publication number
- JPS6310566U JPS6310566U JP1986104310U JP10431086U JPS6310566U JP S6310566 U JPS6310566 U JP S6310566U JP 1986104310 U JP1986104310 U JP 1986104310U JP 10431086 U JP10431086 U JP 10431086U JP S6310566 U JPS6310566 U JP S6310566U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- groove
- external terminal
- semiconductor substrate
- solder pool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104310U JPS6310566U (it) | 1986-07-09 | 1986-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104310U JPS6310566U (it) | 1986-07-09 | 1986-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310566U true JPS6310566U (it) | 1988-01-23 |
Family
ID=30977686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104310U Pending JPS6310566U (it) | 1986-07-09 | 1986-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310566U (it) |
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1986
- 1986-07-09 JP JP1986104310U patent/JPS6310566U/ja active Pending