JPS6310566U - - Google Patents
Info
- Publication number
- JPS6310566U JPS6310566U JP1986104310U JP10431086U JPS6310566U JP S6310566 U JPS6310566 U JP S6310566U JP 1986104310 U JP1986104310 U JP 1986104310U JP 10431086 U JP10431086 U JP 10431086U JP S6310566 U JPS6310566 U JP S6310566U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- groove
- external terminal
- semiconductor substrate
- solder pool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の要部を示す上面図、第２図は
その一部の断面図、第３図は本考案の他の例を示
す上面図、第４図は第３図の断面図、第５図は本
考案に係る装置の概略を示す断面図、第６図は本
考案に係る装置の概要を示す上面図、第７図は従
来装置の一部を示す上面図、第８図乃至第１０図
はその製造課程を示す断面図である。
その一部の断面図、第３図は本考案の他の例を示
す上面図、第４図は第３図の断面図、第５図は本
考案に係る装置の概略を示す断面図、第６図は本
考案に係る装置の概要を示す上面図、第７図は従
来装置の一部を示す上面図、第８図乃至第１０図
はその製造課程を示す断面図である。
Claims (1)
- Ｆｅ製のヒートシンクに固着する半導体基板周
囲に環状の溝を設け、この溝を囲む前記Ｆｅ製ヒ
ーシンクに前記半導体基板と電気的に接続するＣ
ｕ製の外部端子を機械的に固定し、この外部端子
を固着する半田の溜り部を前記Ｆｅ製ヒートシン
クに設け、この半田溜り部と前記溝間を不連続に
する前記Ｆｅ製ヒートシンク露出部を形成し、こ
の露出部に近接する前記Ｆｅ製ヒートシンクに第
２の溝部を設置し、このＦｅ製ヒートシンクを被
覆する封止樹脂部を具備することを特徴とする樹
脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104310U JPS6310566U (ja) | 1986-07-09 | 1986-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986104310U JPS6310566U (ja) | 1986-07-09 | 1986-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310566U true JPS6310566U (ja) | 1988-01-23 |
Family
ID=30977686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986104310U Pending JPS6310566U (ja) | 1986-07-09 | 1986-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310566U (ja) |
-
1986
- 1986-07-09 JP JP1986104310U patent/JPS6310566U/ja active Pending