JPS63118238U - - Google Patents
Info
- Publication number
- JPS63118238U JPS63118238U JP903687U JP903687U JPS63118238U JP S63118238 U JPS63118238 U JP S63118238U JP 903687 U JP903687 U JP 903687U JP 903687 U JP903687 U JP 903687U JP S63118238 U JPS63118238 U JP S63118238U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- thickness
- terminal
- thermocompression
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903687U JPS63118238U (2) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903687U JPS63118238U (2) | 1987-01-23 | 1987-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118238U true JPS63118238U (2) | 1988-07-30 |
Family
ID=30793969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP903687U Pending JPS63118238U (2) | 1987-01-23 | 1987-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118238U (2) |
-
1987
- 1987-01-23 JP JP903687U patent/JPS63118238U/ja active Pending
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