JPS63128012U - - Google Patents
Info
- Publication number
- JPS63128012U JPS63128012U JP2047087U JP2047087U JPS63128012U JP S63128012 U JPS63128012 U JP S63128012U JP 2047087 U JP2047087 U JP 2047087U JP 2047087 U JP2047087 U JP 2047087U JP S63128012 U JPS63128012 U JP S63128012U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- guide pin
- gate
- thin workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Insulating Of Coils (AREA)
Description
第１図は本考案に係る封止成形金型の一実施例
を示す要部断面図、第２図は本考案に係る封止成
形金型の下型の一実施例を示す平面図、第３図は
従来の封止成形金型を示す要部断面図、第４図は
従来の封止成形金型の下型を示す平面図である。
第１図及び第２図において、１は下型、２は凹
部、３はガイドピン、２１は上型、２２はゲート
、６は薄物加工材、７は熱硬化性樹脂材、１１は
可塑化具、１２は可塑化室、１３は加圧具、２３
は切欠きをそれぞれ示す。
FIG. 1 is a sectional view of essential parts showing an embodiment of the sealing mold according to the present invention, FIG. 2 is a plan view showing an embodiment of the lower mold of the sealing mold according to the present invention, and FIG. FIG. 3 is a sectional view of a main part showing a conventional sealing mold, and FIG. 4 is a plan view showing a lower mold of the conventional sealing mold. In Figures 1 and 2, 1 is a lower mold, 2 is a recess, 3 is a guide pin, 21 is an upper mold, 22 is a gate, 6 is a thin processed material, 7 is a thermosetting resin material, and 11 is a plasticized material. 12 is a plasticizing chamber, 13 is a pressurizing tool, 23
indicate notches.
Claims (1)
形する凹部２内に該薄物加工材６を保持するガイ
ドピン３を植設した下型１と、樹脂材流入用のゲ
ート２２を備えた上型２１とからなる成形金型構
造において、 上記上型２１の樹脂材流入用ゲート２２を下型
１のガイドピン３と対向する位置に設け、かつ該
ガイドピン３の頭部に前記ゲート５より流入する
樹脂材７の方向を制御する切欠き２３を設けたこ
とを特徴とする封止成形金型。[Claims for Utility Model Registration] A lower mold 1 in which a guide pin 3 for holding a thin workpiece 6 is implanted in a recess 2 in which a thin workpiece 6 is sealed and molded with a thermosetting resin material 7, and a resin material. In a mold structure including an upper mold 21 having an inflow gate 22, the resin material inflow gate 22 of the upper mold 21 is provided at a position facing the guide pin 3 of the lower mold 1, and the guide pin 3. A sealing mold characterized in that a notch 23 is provided in the head portion of the mold 3 for controlling the direction of the resin material 7 flowing through the gate 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047087U JPS63128012U (en) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2047087U JPS63128012U (en) | 1987-02-13 | 1987-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128012U true JPS63128012U (en) | 1988-08-22 |
Family
ID=30816011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2047087U Pending JPS63128012U (en) | 1987-02-13 | 1987-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128012U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010147272A (en) * | 2008-12-19 | 2010-07-01 | Toko Inc | Method for manufacturing molded coil |
| JP2015095565A (en) * | 2013-11-12 | 2015-05-18 | 株式会社タムラ製作所 | Reactor |
-
1987
- 1987-02-13 JP JP2047087U patent/JPS63128012U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010147272A (en) * | 2008-12-19 | 2010-07-01 | Toko Inc | Method for manufacturing molded coil |
| JP2015095565A (en) * | 2013-11-12 | 2015-05-18 | 株式会社タムラ製作所 | Reactor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63128012U (en) | ||
| JPH0357018U (en) | ||
| JPS62203013U (en) | ||
| JPH0195736U (en) | ||
| JPH031535U (en) | ||
| JPH043770Y2 (en) | ||
| JPH0415854U (en) | ||
| JPS62109922U (en) | ||
| JPS6233418U (en) | ||
| JPS6442113U (en) | ||
| JPH0313737U (en) | ||
| JPH02104636U (en) | ||
| JPS5842938U (en) | Mold for resin-sealed semiconductor devices | |
| JPS6377721U (en) | ||
| JPH0331527U (en) | ||
| JPH0289834U (en) | ||
| JPS6294015U (en) | ||
| JPS62150117U (en) | ||
| JPH0454821U (en) | ||
| JPS61119674U (en) | ||
| JPS645447U (en) | ||
| JPS61200220U (en) | ||
| JPS62166637U (en) | ||
| JPH01104730U (en) | ||
| JPS62166017U (en) |