JPS63128018A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS63128018A JPS63128018A JP27610486A JP27610486A JPS63128018A JP S63128018 A JPS63128018 A JP S63128018A JP 27610486 A JP27610486 A JP 27610486A JP 27610486 A JP27610486 A JP 27610486A JP S63128018 A JPS63128018 A JP S63128018A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- component
- resin composition
- agent component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 25
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 10
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 7
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- 150000004665 fatty acids Chemical class 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000003405 preventing effect Effects 0.000 abstract 2
- 150000008431 aliphatic amides Chemical class 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910002012 Aerosil® Inorganic materials 0.000 description 4
- 238000007665 sagging Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052925 anhydrite Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- -1 urethane modified bisphenol A Chemical class 0.000 description 2
- SDOKZHJGUZWCDY-WRBBJXAJSA-N (9z,29z)-octatriaconta-9,29-dienedioic acid Chemical compound OC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(O)=O SDOKZHJGUZWCDY-WRBBJXAJSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- VLHZUYUOEGBBJB-UHFFFAOYSA-N hydroxy stearic acid Natural products OCCCCCCCCCCCCCCCCCC(O)=O VLHZUYUOEGBBJB-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- NJNNJTZOZPHSRA-UHFFFAOYSA-N octatriacontanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O NJNNJTZOZPHSRA-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はエポキシ樹脂組成物、更に詳しくは、二液型の
エポキシ樹脂組成物において、その反応硬化過程におけ
るタレを防止、いわゆる揺変性を改良したエポキシ樹脂
組成物に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an epoxy resin composition, more specifically, to an epoxy resin composition with improved so-called thixotropy, which prevents sagging during the reaction curing process in a two-component epoxy resin composition. The present invention relates to a resin composition.
従来技術と解決すべき問題点
通常、経年後の建築構造物にあってタイルまたはモルタ
ル等が下地のコンクリートから剥離したり、亀裂が起っ
たりするが、この場合、その接着不良の浮いた部分や亀
裂部分に、主剤と硬化剤からなる二液型のエポキシ樹脂
組成物を注入乃至充填して修復する方法かとられている
。Conventional technology and problems to be solved Usually, tiles or mortar in building structures after aging will peel off or crack from the underlying concrete. A method of repairing cracks and cracks by injecting or filling them with a two-component epoxy resin composition consisting of a base resin and a curing agent has been proposed.
この用途に使用するエポキシ樹脂組成物は反応硬化過程
において、発熱反応により組成物温度が４０〜８０℃の
如き高温となり、その結果、エポキシ樹脂がタレ落ちた
り、また壁面等の垂直面を流れ出すことがあり、浮き部
分への注入または亀裂の修復作業において、注入、充填
が不充分となったり、また修復部分近傍にエポキシ樹脂
が付着したりするなどの問題が起る。During the reaction curing process, the epoxy resin composition used for this purpose reaches a high temperature of 40 to 80°C due to an exothermic reaction, and as a result, the epoxy resin may drip or flow down vertical surfaces such as walls. When injecting into floating areas or repairing cracks, problems may occur, such as insufficient injection or filling, or adhesion of epoxy resin near the repaired areas.
本発明者らは、かかる問題を解決するため鋭意検討を進
めた結果、硬化剤成分に両末端カルボキシル基を持つポ
リブタジェンを少量添加すれば、組成物の揺変性を所望
程度に改良しうることを見出し、本発明を完成するに至
った。As a result of intensive studies to solve this problem, the present inventors found that the thixotropy of the composition can be improved to the desired degree by adding a small amount of polybutadiene having carboxyl groups at both ends to the curing agent component. This discovery led to the completion of the present invention.
すなわち、本発明は、エポキシ樹脂を主剤成分、ポリア
ミド樹脂を硬化剤成分とする二液型のエポキシ樹脂組成
物において、硬化剤成分に対して０．５〜５％（重量悌
、以下同様〕のカルボキシル基末端ポリブタジェンを添
加したことを特徴とするエポキシ樹脂組成物を提供する
ものである。That is, the present invention provides a two-component epoxy resin composition containing an epoxy resin as a main component and a polyamide resin as a curing agent component. The present invention provides an epoxy resin composition characterized in that a carboxyl group-terminated polybutadiene is added.
本発明におけるエポキシ樹脂としては、通常のビスフェ
ノールＡ型、ウレタン変性ビスフェノールＡ型、臭素化
ビスフェノールＡ型、ノボラック型、脂肪族型、脂環族
型のエポキシ樹脂が使用されてよく、常温液状が好まし
い。固形のものについては液状のものと併用すればよい
。As the epoxy resin in the present invention, normal bisphenol A type, urethane modified bisphenol A type, brominated bisphenol A type, novolak type, aliphatic type, and alicyclic type epoxy resin may be used, and a liquid state at room temperature is preferable. . Solid ones may be used in combination with liquid ones.
本発明におけるポリアミド樹脂とは、ダイマー酸に脂肪
族アミンを反応させたもので、従来よりエポキシ樹脂用
常温硬化剤として使用されているものを指称する。また
かかる硬化剤成分に加えて、公卸の脂肪族アミン、脂環
式ポリアミン、芳香族ポリアミン、アミンアダクト等を
併用してもよい。The polyamide resin in the present invention refers to a resin obtained by reacting a dimer acid with an aliphatic amine, which has been conventionally used as a room temperature curing agent for epoxy resins. In addition to such curing agent components, publicly available aliphatic amines, alicyclic polyamines, aromatic polyamines, amine adducts, etc. may be used in combination.
本発明における硬化剤成分に添加するカルボキシル基末
端ポリブタジェンとは、式：
％式％
で示される１、２−結合からなるアタクチック１，２ポ
リブタジエンの両末端にカルボキシル基を持ったものを
指称し、数平均分子量１０００．２０００゜３０００（
好ましくは１０００）の市販品が使用されてよい。たと
えば、日本曹達社製のｒ Ｐｏ１ｙＰｄＣ１０００Ｊ、
ｒ同２０００Ｊ、「同３０００Ｊがある。添加着は硬化
剤成分に対して、０．５〜５％、好ましくは１．０〜３
．０％の範囲で選定する。０．５多未満では、所望の改
質効果が得られず、また５％を越えてもそれ以上の効果
は期待できず、逆に粘度が高くなり、主剤と硬化剤の混
合作業上難点となる。The carboxyl group-terminated polybutadiene added to the curing agent component in the present invention refers to an atactic 1,2 polybutadiene consisting of 1,2-bonds represented by the formula: % formula % having carboxyl groups at both ends, Number average molecular weight 1000.2000゜3000 (
Preferably 1000) commercially available products may be used. For example, rPolyPdC1000J manufactured by Nippon Soda Co., Ltd.
There are 2000J and 3000J.The additive amount is 0.5 to 5%, preferably 1.0 to 3%, based on the curing agent component.
．． Select within the range of 0%. If it is less than 0.5%, the desired modification effect cannot be obtained, and if it exceeds 5%, no further effect can be expected; on the contrary, the viscosity increases, which is a problem in mixing the base resin and curing agent. Become.
本発明に係るエポキシ樹脂組成物は、上述の主剤
ポキシ樹脂を主成分とし、ポリアミド樹脂および△
要すれば他の硬化剤からなる硬化剤成分に所定量のカル
ボキシル基末端ポリブタジェンを添加したことで構成さ
れ、注入、充填における発熱時のタレが効率的に防止さ
れる。なお、主剤成分と硬化剤成分のいずれか一方また
は両方へ、そのグリース形状を維持せしめてタレ防止を
より高めるために、無水硅酸粉末や脂肪酸アマイドを適
量添加することができる。The epoxy resin composition according to the present invention is composed of the above-mentioned main poxy resin as a main component, and a predetermined amount of carboxyl group-terminated polybutadiene added to a curing agent component consisting of a polyamide resin and, if necessary, other curing agents. This effectively prevents sagging during heat generation during pouring and filling. In addition, an appropriate amount of silicic anhydride powder or fatty acid amide can be added to either or both of the base agent component and the curing agent component in order to maintain the shape of the grease and further enhance prevention of sagging.
上記無水硫酸粉末とは、四塩化縫累の高温気相加水分解
で製造された超微粒子状の無水シリカであり、その表面
には適量のシラノールグループが存在しているものであ
って、通常、主剤と硬化剤成分のそれぞれに１〜１０％
の範囲で用いる。望ましくは３〜８％である。かかる無
水ｉｔ酸粉末は、日本アエロジル（株］からアエロジル
として市販されている。The above-mentioned anhydrous sulfuric acid powder is ultrafine anhydrous silica produced by high-temperature gas-phase hydrolysis of tetrachloride, and has an appropriate amount of silanol groups on its surface. , 1 to 10% for each of the base agent and curing agent components.
Used within the range of. It is preferably 3 to 8%. Such an it acid anhydride powder is commercially available as Aerosil from Nippon Aerosil Co., Ltd.
上記脂肪酸アマイドとは、脂肪酸（ステアリン酸、リシ
ノール酸、オレイン酸、オキシステアリン酸、エルカ酸
、ラウリン酸、エチレンビスステアリン酸、エチレンビ
スオレイン酸、アルカン酸△
ントリアミン、トリエチレンテトラミン、ポリエチレン
ポリアミンなど）との反応物を指称し、特にステアリン
酸またはアルカン酸とジエチレンジアミンを反応させた
分子量５００〜１５００のものが好ましい。使用量は通
常、主剤と硬化剤成分のそれぞれに１〜６％の範囲で選
定する。The above fatty acid amide refers to fatty acids (stearic acid, ricinoleic acid, oleic acid, oxystearic acid, erucic acid, lauric acid, ethylenebisstearic acid, ethylenebisoleic acid, triamine alkanoic acid, triethylenetetramine, polyethylenepolyamine, etc.) It refers to a reaction product with stearic acid or an alkanoic acid and diethylenediamine, and a product having a molecular weight of 500 to 1500 is particularly preferred. The amounts used are usually selected within the range of 1 to 6% for each of the base agent and curing agent components.
上記無水石を酸粉末および／または脂肪酸アマイドは、
本発明のエポキシ樹脂組成物の揺変性を改良することが
できるが、カルボキシル基末端ポリブタジェンを添加す
ると、その反応温度の上昇に伴う該組成物のタレを抑制
するのに望ましい。The above anhydrite is mixed with acid powder and/or fatty acid amide.
Although the thixotropy of the epoxy resin composition of the present invention can be improved, the addition of carboxyl-terminated polybutadiene is desirable for suppressing sag of the composition as the reaction temperature increases.
更に、必要に応じて通常の可塑剤、希釈剤、増量剤等を
加えてもよい。Furthermore, if necessary, ordinary plasticizers, diluents, fillers, etc. may be added.
次に実施例および比較例を挙げて本発明をより具体的に
説明する。Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples.
実施例１
ビスフェノールＡ型エポキシ樹脂（シェル化学社製、エ
ピコート８２８） ・・団・１００無水鈍酸粉
末（日本アエロジル社製、アエロジルン
・・壷・・・ ５脂肪酸アマイド（補
水化成社製、デスバロン６９００−２０Ｘ）
・・・・・・ 、 ２を混合後、ペ
イントロールを通してグリース状の主剤成分を調製する
。Example 1 Bisphenol A type epoxy resin (manufactured by Shell Chemical Co., Ltd., Epicoat 828) ... Group 100 anhydrous blunt acid powder (manufactured by Nippon Aerosil Co., Ltd., Aerosiln)
・Bottle... 5 fatty acid amide (manufactured by Hosui Kasei Co., Ltd., Desbaron 6900-20X)
...... After mixing 2, pass it through a paint roll to prepare a grease-like base ingredient.
硬化剤成分 重量部ポリアミ
ド樹脂（富士化成工業社製、トーマイド２４５ＬＰ）
・・・・・・ ８８脂肪族変性
ポリアミン（大日本インキ化学工業社製、ラッカマイト
ＷＨ１０８） ’・・・・・・ １２無水石↓酸粉
末（アエロジル〕 ・・・・・・ ６脂肪酸アマ
イド（デスバロン６９００−２０ｘ〕
・・・・・・ ２カルボキシル基末
端ポリブタジエン（日本曹達社製、Ｐｏ１ｙ ＰｄＣ
１０００） ・−＝ ２を混合後、ペイン
トロールを通してグリース状の硬化剤成分を調製する。Hardening agent component Weight part Polyamide resin (manufactured by Fuji Kasei Kogyo Co., Ltd., Tomide 245LP)
・・・・・・ 88 Aliphatic modified polyamine (manufactured by Dainippon Ink and Chemicals Co., Ltd., Laccamite WH108) '・・・・・・ 12 Anhydrite ↓ acid powder (Aerosil) ・・・・・・ 6 Fatty acid amide (Desbaron) 6900-20x]
・・・・・・ 2 carboxyl group-terminated polybutadiene (manufactured by Nippon Soda Co., Ltd., Po1y PdC
1000) ·-= After mixing 2, pass through a paint roll to prepare a grease-like curing agent component.
実施例２ 主剤成分：実施例１と同じ。Example 2 Main ingredient: Same as Example 1.
硬化剤成分：実施例１の硬化剤成分において、脂肪酸ア
マイド２部を省略する以外は同様にして調製。Curing agent component: Prepared in the same manner as in Example 1 except that 2 parts of fatty acid amide was omitted.
比較例１ 主剤成分：実施例１と同じ。Comparative example 1 Main ingredient: Same as Example 1.
硬化剤成分：実施例１の硬化剤成分において、カルボキ
シル基末端ポリブタジェン２部の代わりにモンモリロナ
イトの有機塩基複合体（白石カルシウム社製、オルベン
）２部を用いる以外は同様にして調製。Curing agent component: Prepared in the same manner as in Example 1 except that 2 parts of an organic base complex of montmorillonite (manufactured by Shiraishi Calcium Co., Ltd., Olben) was used instead of 2 parts of the carboxyl group-terminated polybutadiene.
くタレ試験評価〉
主剤成分６６０Ａ’と硬化剤成分３３０ｇを混合してエ
ポキシ樹脂組成物を得、これを２０℃で４０分放置後グ
リースガンに充填する。スレート板と透明アクリル板を
間隔５ｆｌとなるように重ね合せ、これらを垂直に立て
た状態に保持し、アクリル板に設けた５ｆｆφの穴から
グリースガンよりエポキシ樹脂組成物５０ｇを注入する
。１日放置して硬化させた後、透明なアクリル板を通し
て中の硬化物形状を観察する。垂直面において注入穴を
中心にその上下に硬化物が延びた距離の割合（上／下）
をもって評価した。結果を表１に示す。Sagging test evaluation> 660 A' of the base component and 330 g of the curing agent component were mixed to obtain an epoxy resin composition, which was left to stand at 20° C. for 40 minutes and then filled into a grease gun. A slate board and a transparent acrylic board were placed one on top of the other with a spacing of 5fl, held vertically, and 50g of an epoxy resin composition was injected from a grease gun through a 5ffφ hole provided in the acrylic board. After being left to cure for one day, the shape of the cured product inside was observed through a transparent acrylic plate. Ratio of the distance that the cured material extends above and below the injection hole in the vertical plane (top/bottom)
It was evaluated using The results are shown in Table 1.
表１
実施例１，２では、注入穴を中心としてはｙ同心円状に
注入されており、これは反応硬化過程において樹脂のタ
レ落ちが良好に防止されていることを示している。Table 1 In Examples 1 and 2, the resin was injected in a y-concentric circle with the injection hole at the center, which indicates that dripping of the resin was well prevented during the reaction curing process.
Claims (1)
成分とする二液型のエポキシ樹脂組成物において、硬化
剤成分に対して０．５〜５重量％のカルボキシル基末端
ポリブタジエンを添加したことを特徴とするエポキシ樹
脂組成物。 ２、主剤成分と硬化剤成分のいずれか一方または両方に
、無水硅酸粉末および／または脂肪酸アマイドを添加し
た前記第１項記載の組成物。[Scope of Claims] 1. In a two-component epoxy resin composition containing an epoxy resin as a main component and a polyamide resin as a curing agent component, 0.5 to 5% by weight of carboxyl group-terminated polybutadiene based on the curing agent component. An epoxy resin composition characterized by adding. 2. The composition according to item 1 above, wherein silicic anhydride powder and/or fatty acid amide is added to either or both of the base component and the curing agent component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27610486A JPS63128018A (en) | 1986-11-19 | 1986-11-19 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27610486A JPS63128018A (en) | 1986-11-19 | 1986-11-19 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128018A true JPS63128018A (en) | 1988-05-31 |
| JPH0518324B2 JPH0518324B2 (en) | 1993-03-11 |
Family
ID=17564855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27610486A Granted JPS63128018A (en) | 1986-11-19 | 1986-11-19 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128018A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03172343A (en) * | 1989-11-30 | 1991-07-25 | Sumitomo Rubber Ind Ltd | Epoxy resin composition |
| JPH05156127A (en) * | 1991-05-15 | 1993-06-22 | Somar Corp | Thixotropic epoxy resin composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56166225A (en) * | 1980-05-27 | 1981-12-21 | Hitachi Ltd | Epoxy resin composition |
-
1986
- 1986-11-19 JP JP27610486A patent/JPS63128018A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56166225A (en) * | 1980-05-27 | 1981-12-21 | Hitachi Ltd | Epoxy resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03172343A (en) * | 1989-11-30 | 1991-07-25 | Sumitomo Rubber Ind Ltd | Epoxy resin composition |
| JPH05156127A (en) * | 1991-05-15 | 1993-06-22 | Somar Corp | Thixotropic epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0518324B2 (en) | 1993-03-11 |
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