JPS6312837U - - Google Patents
Info
- Publication number
- JPS6312837U JPS6312837U JP1986074847U JP7484786U JPS6312837U JP S6312837 U JPS6312837 U JP S6312837U JP 1986074847 U JP1986074847 U JP 1986074847U JP 7484786 U JP7484786 U JP 7484786U JP S6312837 U JPS6312837 U JP S6312837U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- metal wiring
- internal metal
- insulating layer
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/981—Auxiliary members, e.g. spacers
- H10W72/983—Reinforcing structures, e.g. collars
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は第２図の―線断面図、第２図は本
考案の実施例の上面図である。また第３図は第４
図の―線断面図、第４図は従来例の上面図で
ある。 １……半導体基板、２……第１の絶縁層、３…
…ボンデイグパツド、４……内部金属配線層、５
……第２の絶縁層、６……ボンデイグワイヤ、７
……不純物領域、８，９……開口部。
考案の実施例の上面図である。また第３図は第４
図の―線断面図、第４図は従来例の上面図で
ある。 １……半導体基板、２……第１の絶縁層、３…
…ボンデイグパツド、４……内部金属配線層、５
……第２の絶縁層、６……ボンデイグワイヤ、７
……不純物領域、８，９……開口部。
Claims (1)
- 【実用新案登録請求の範囲】 半導体基板上の第１の絶縁層上に形成されたボ
ンデイングパツドと、該ボンデイングパツドに接
続する内部金属配線層と、該内部金属配線と該ボ
ンデイグパツドの周縁部を被覆する第２の絶縁層
を有する半導体装置の電極構造において、 前記半導体基板表面に不純物領域を形成し、か
つ前記内部金属配線層の下の前記第１の絶縁層お
よび前記ボンデイグパツドの中央部付近の下の前
記第１の絶縁層に開口部を設けることにより該内
部金属配線層と該ボンデイグパツドを前記不純物
領域にオーミツクコンタクさせ、さらに前記ボン
デイグパツドの中央部付近に形成した開口部が被
覆されるようにボンデイグワイヤを固着すること
を特徴とする半導体装置の電極構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074847U JPS6312837U (ja) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074847U JPS6312837U (ja) | 1986-05-19 | 1986-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312837U true JPS6312837U (ja) | 1988-01-27 |
Family
ID=30920444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986074847U Pending JPS6312837U (ja) | 1986-05-19 | 1986-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312837U (ja) |
-
1986
- 1986-05-19 JP JP1986074847U patent/JPS6312837U/ja active Pending