JPS63131069U - - Google Patents
Info
- Publication number
- JPS63131069U JPS63131069U JP2305287U JP2305287U JPS63131069U JP S63131069 U JPS63131069 U JP S63131069U JP 2305287 U JP2305287 U JP 2305287U JP 2305287 U JP2305287 U JP 2305287U JP S63131069 U JPS63131069 U JP S63131069U
- Authority
- JP
- Japan
- Prior art keywords
- damper
- electronic device
- mounting plate
- plate
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案のアース機構の側面図、第２図
は従来のアース機構の側面図である。
図に於いて、１は電子装置、２はダンパー、２
ａ，８ａは貫通孔、２ｂは溝、３は取付け板、３
ａ，７ａは凸部、３ｂは凹部、４，７は取付け金
具、５はアース板、６はアースばねである。
FIG. 1 is a side view of the grounding mechanism of the present invention, and FIG. 2 is a side view of a conventional grounding mechanism. In the figure, 1 is an electronic device, 2 is a damper, 2
a, 8a are through holes, 2b are grooves, 3 are mounting plates, 3
Numerals a and 7a are convex portions, 3b is a concave portion, 4 and 7 are mounting fittings, 5 is a grounding plate, and 6 is a grounding spring.
Claims (1)
置１を支持した防振取付け構造に於いて、 アース板５を前記ダンパー８と前記電子装置１
との間に介挿したことを特徴とするアース機構。[Claims for Utility Model Registration] In a vibration-proof mounting structure in which an electronic device 1 is supported via a damper 8 on the mounting plate 3 and the mounting plate 3, a ground plate 5 is connected to the damper 8 and the electronic device 1.
A grounding mechanism characterized by being inserted between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2305287U JPS63131069U (en) | 1987-02-19 | 1987-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2305287U JPS63131069U (en) | 1987-02-19 | 1987-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131069U true JPS63131069U (en) | 1988-08-26 |
Family
ID=30821011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2305287U Pending JPS63131069U (en) | 1987-02-19 | 1987-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131069U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04112463U (en) * | 1991-03-20 | 1992-09-30 | 株式会社ピーエフユー | Earthing device in buffer connection structure |
-
1987
- 1987-02-19 JP JP2305287U patent/JPS63131069U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04112463U (en) * | 1991-03-20 | 1992-09-30 | 株式会社ピーエフユー | Earthing device in buffer connection structure |
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