JPS631335U - - Google Patents

Info

Publication number: JPS631335U
Authority: JP; Japan
Prior art keywords: ground; lead; semiconductor element; electrode; level
Prior art date: 1986-06-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1986095148U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-06-20

Filing date

1986-06-20

Publication date

1988-01-07

1986-06-20 Application filed filed Critical

1986-06-20 Priority to JP1986095148U priority Critical patent/JPS631335U/ja

1988-01-07 Publication of JPS631335U publication Critical patent/JPS631335U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Wire Bonding (AREA)
Lead Frames For Integrated Circuits (AREA)

JP1986095148U 1986-06-20 1986-06-20 Pending JPS631335U (fr)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1986095148U JPS631335U (fr)	1986-06-20	1986-06-20

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1986095148U JPS631335U (fr)	1986-06-20	1986-06-20

Publications (1)

Publication Number	Publication Date
JPS631335U true JPS631335U (fr)	1988-01-07

Family

ID=30959364

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1986095148U Pending JPS631335U (fr)	1986-06-20	1986-06-20

Country Status (1)

Country	Link
JP (1)	JPS631335U (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006032989A (ja) *	2005-10-07	2006-02-02	Yamaha Corp	半導体パッケージ及び半導体パッケージの製造方法

1986
- 1986-06-20 JP JP1986095148U patent/JPS631335U/ja active Pending

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006032989A (ja) *	2005-10-07	2006-02-02	Yamaha Corp	半導体パッケージ及び半導体パッケージの製造方法

Publication	Publication Date	Title
JPH0369248U (fr)	1991-07-09
JPS62140742U (fr)	1987-09-05
JPH03104755U (fr)	1991-10-30
JPS6359325U (fr)	1988-04-20
JPH01145140U (fr)	1989-10-05
JPH0381641U (fr)	1991-08-21
JPS63200355U (fr)	1988-12-23
JPH03124653U (fr)	1991-12-17
JPS63119241U (fr)	1988-08-02
JPH0252452U (fr)	1990-04-16
JPS63165846U (fr)	1988-10-28
JPH0336151U (fr)	1991-04-09
JPS62112142U (fr)	1987-07-17
JPS63121456U (fr)	1988-08-05
JPH0272558U (fr)	1990-06-01
JPS6183041U (fr)	1986-06-02
JPS645448U (fr)	1989-01-12
JPS62147360U (fr)	1987-09-17
JPS6221549U (fr)	1987-02-09
JPH042052U (fr)	1992-01-09
JPS636748U (fr)	1988-01-18
JPH0367450U (fr)	1991-07-01
JPH0456337U (fr)	1992-05-14
JPS6426851U (fr)	1989-02-15
JPS6181155U (fr)	1986-05-29

JPS631335U - - Google Patents

Info

Links

Classifications

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=30959364

Family Applications (1)

Country Status (1)

Cited By (1)

Cited By (1)

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