JPS63140625U - - Google Patents
Info
- Publication number
- JPS63140625U JPS63140625U JP1987032702U JP3270287U JPS63140625U JP S63140625 U JPS63140625 U JP S63140625U JP 1987032702 U JP1987032702 U JP 1987032702U JP 3270287 U JP3270287 U JP 3270287U JP S63140625 U JPS63140625 U JP S63140625U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor integrated
- metal
- metal conductor
- external connection
- lead electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987032702U JPS63140625U (fr) | 1987-03-06 | 1987-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987032702U JPS63140625U (fr) | 1987-03-06 | 1987-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63140625U true JPS63140625U (fr) | 1988-09-16 |
Family
ID=30839634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987032702U Pending JPS63140625U (fr) | 1987-03-06 | 1987-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63140625U (fr) |
-
1987
- 1987-03-06 JP JP1987032702U patent/JPS63140625U/ja active Pending
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