JPS6314574U - - Google Patents
Info
- Publication number
- JPS6314574U JPS6314574U JP10908286U JP10908286U JPS6314574U JP S6314574 U JPS6314574 U JP S6314574U JP 10908286 U JP10908286 U JP 10908286U JP 10908286 U JP10908286 U JP 10908286U JP S6314574 U JPS6314574 U JP S6314574U
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- pressure chamber
- static pressure
- metal ion
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 150000007514 bases Chemical class 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 6
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Description
第１図は本考案実施例の補給装置を示す断面図
、第２図Ａ，Ｂはいずれも本考案のめつき液噴射
口の噴射方向を示す模式平面図でＡは放射線状、
Ｂは接線状である。第３図は従来の電気めつき装
置を示す断面図、第４図は第３図の一部拡大断面
図である。
２……鋼帯、４……不溶性陽極、６……めつき
槽、１０……めつき液、１４……溶解槽、１６…
…塩基性化合物、１８……ホツパー、２０……コ
ンベヤー、２２……計量槽、２６……スクリユー
フイーダー、２８……投入筒、３２……めつき液
溢流装置、４８……めつき液静圧室、５０……め
つき液噴射口。
FIG. 1 is a sectional view showing a replenishment device according to an embodiment of the present invention, and FIGS. 2A and 2B are schematic plan views showing the injection direction of the plating liquid jet nozzle of the present invention, where A is a radial,
B is tangential. FIG. 3 is a sectional view showing a conventional electroplating apparatus, and FIG. 4 is a partially enlarged sectional view of FIG. 3. 2... Steel strip, 4... Insoluble anode, 6... Plating tank, 10... Plating liquid, 14... Dissolving tank, 16...
... Basic compound, 18 ... Hopper, 20 ... Conveyor, 22 ... Measuring tank, 26 ... Screw feeder, 28 ... Input tube, 32 ... Plating liquid overflow device, 48 ... Plating Liquid static pressure chamber, 50... plating liquid injection port.
Claims (1)
フイーダーを介し更にめつき液溢液装置を上部に
具えた投入筒を経て粉末状の塩基性化合物を溶解
槽に切出し該溶解槽中のめつき液に溶解させる不
溶性陽極を有する電気めつき装置の循環するめつ
き液への金属イオン補給装置において、前記めつ
き液溢流装置の下方に前記投入筒を取り囲んでも
うけられためつき液静圧室と、前記めつき液静圧
室の内壁に設けられた複数段のめつき液噴射口と
、を有して成ることを特徴とするめつき液への金
属イオン補給装置。 The powdered basic compound is cut out from the hopper through a conveyor, a measuring tank, a screw feeder, and an input cylinder equipped with a plating liquid overflow device on the top into a dissolving tank, and is dissolved in the plating solution in the dissolving tank. In the metal ion replenishment device for a circulating plating solution of an electroplating device having an insoluble anode, a plating solution static pressure chamber is provided below the plating solution overflow device surrounding the input cylinder; 1. A metal ion replenishing device for a plating solution, comprising a plurality of stages of plating solution injection ports provided on an inner wall of a static pressure chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10908286U JPH033579Y2 (en) | 1986-07-16 | 1986-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10908286U JPH033579Y2 (en) | 1986-07-16 | 1986-07-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6314574U true JPS6314574U (en) | 1988-01-30 |
| JPH033579Y2 JPH033579Y2 (en) | 1991-01-30 |
Family
ID=30986863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10908286U Expired JPH033579Y2 (en) | 1986-07-16 | 1986-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033579Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021120484A (en) * | 2017-12-28 | 2021-08-19 | 株式会社荏原製作所 | Powder feeding device and plating system |
-
1986
- 1986-07-16 JP JP10908286U patent/JPH033579Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021120484A (en) * | 2017-12-28 | 2021-08-19 | 株式会社荏原製作所 | Powder feeding device and plating system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH033579Y2 (en) | 1991-01-30 |
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