JPS63149528U - - Google Patents

Info

Publication number
JPS63149528U
JPS63149528U JP1987041052U JP4105287U JPS63149528U JP S63149528 U JPS63149528 U JP S63149528U JP 1987041052 U JP1987041052 U JP 1987041052U JP 4105287 U JP4105287 U JP 4105287U JP S63149528 U JPS63149528 U JP S63149528U
Authority
JP
Japan
Prior art keywords
wire bonding
heater
bonding device
frame
heat block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987041052U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987041052U priority Critical patent/JPS63149528U/ja
Publication of JPS63149528U publication Critical patent/JPS63149528U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａおよびｂは本考案に係るワイヤボンデ
イング装置を示す平面図と正面図、第２図ａおよ
びｂは他の実施例を示す平面図と正面図、第３図
は従来のワイヤボンデイング装置を示す正面図、
第４図はその要部を示す斜視図である。 １……ワイヤボンデイング装置本体、２……ヒ
ータ、３……ベースブロツク、４……リードフレ
ーム、６……ワイヤ、７……ダイパツド、８……
半導体素子、９……インナーリード、２１……フ
レーム押さえ、２２……ヒータ。
補正 昭６２．１２．９ 実用新案登録請求の範囲を次のように補正する
。
【実用新案登録請求の範囲】 (1) ヒートブロツク上にリードフレームを押圧
固定するフレーム押さえを有しワイヤによつて前
記リードフレーム上の半導体素子とインナーリー
ドとを接続するワイヤボンデイング装置本体を備
えたワイヤボンデイング装置において、前記ワイ
ヤボンデイング装置本体に前記インナーリードを
加熱するヒータを取り付け、このヒータの加熱温
度を前記ヒートブロツクの加熱温度と別個に設定
し得る構成としたことを特徴とするワイヤボンデ
イング装置。 (2) ヒータの取付位置がヒートブロツク側であ
る実用新案登録請求の範囲第１項記載のワイヤボ
ンデイング装置。 (3) ヒータの取付位置がフレーム押さえ側であ
る実用新案登録請求の範囲第１項記載のワイヤボ
ンデイング装置。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ヒートブロツク上にリードフレームを押圧
    固定するフレーム押さえを有しワイヤによつて前
    記リードフレーム上の半導体素子とインナーリー
    ドとを接続するワイヤボンデイング装置本体を備
    えたワイヤボンデイング装置において、前記ワイ
    ヤボンデイング装置本体に前記インナーリードを
    加熱するヒータを取り付けたことを特徴とするワ
    イヤボンデイング装置。 (2) ヒータの取付位置がヒートブロツク側であ
    る実用新案登録請求の範囲第１項記載のワイヤボ
    ンデイング装置。 (3) ヒータの取付位置がフレーム押さえ側であ
    る実用新案登録請求の範囲第１項記載のワイヤボ
    ンデイング装置。
JP1987041052U 1987-03-20 1987-03-20 Pending JPS63149528U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987041052U JPS63149528U (ja) 1987-03-20 1987-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987041052U JPS63149528U (ja) 1987-03-20 1987-03-20

Publications (1)

Publication Number Publication Date
JPS63149528U true JPS63149528U (ja) 1988-10-03

Family

ID=30855694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987041052U Pending JPS63149528U (ja) 1987-03-20 1987-03-20

Country Status (1)

Country Link
JP (1) JPS63149528U (ja)

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