JPS6314A - Method of repairing carrier taping - Google Patents
Method of repairing carrier tapingInfo
- Publication number
- JPS6314A JPS6314A JP14213086A JP14213086A JPS6314A JP S6314 A JPS6314 A JP S6314A JP 14213086 A JP14213086 A JP 14213086A JP 14213086 A JP14213086 A JP 14213086A JP S6314 A JPS6314 A JP S6314A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- recess
- carrier
- product
- abnormal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 19
- 230000002159 abnormal effect Effects 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 8
- 230000002950 deficient Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002271 resection Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上■肌里分立
この発明は電子部品のキャリアテーピング修理方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field] This invention relates to a carrier taping repair method for electronic components.
従来二荻避
コンデンサ等のチップ状電子部品の自動包装には、プレ
スで長手方向に等間隔に凹所（１）を設けたベーステー
プ（２）の上記各凹所に電子部品（３）を収容し、上面
を透明なトップテープ（４）で封着するキャリアテーピ
ング工程が採用されている〔第８図参照〕。Conventionally, in automatic packaging of chip-shaped electronic components such as double-sided capacitors, electronic components (3) are placed in each of the recesses of a base tape (2) in which recesses (1) are formed at equal intervals in the longitudinal direction using a press. A carrier taping process is adopted in which the carrier is housed and the upper surface is sealed with a transparent top tape (4) [see Figure 8].
（７゛シよ゛と るロ 占
上記キャリアテーピング工程でトップテープ（４）の封
着後に不良品又は異常品か発見される場合がある。(7゛゛゛゛) Defective or abnormal products may be discovered after sealing the top tape (4) in the above carrier taping process.
上記対策の１つとして、キャリアテープのうちベースま
たはトップテープの一部に不良品マークを付してユーザ
ーに使用しないように表示する方法があるが、キャリア
テープに不良品が良品とともに混入したままとなるため
、全部を自動的に使う場合に問題となっていた。One of the above countermeasures is to mark part of the base or top carrier tape with a defective product mark to inform the user not to use it, but defective products may remain mixed with non-defective products in the carrier tape. This caused a problem when using all of them automatically.
そこで、凹所（１）の−側を切開して不良品を取り出し
、良品を収容して上記切開個所を粘着テープで補修する
方法が考えられる〔第８図参照〕。Therefore, a method can be considered in which the minus side of the recess (1) is cut, the defective products are taken out, the good products are stored, and the cut is repaired with adhesive tape (see FIG. 8).
しかし、上記補修方法は、凹所の一側の切開に当って、
凹所の他の部分を損傷しないように注意深く作業する必
要があり、部品の取り出し及び収容にも不便であり、多
大な工数を要するのみならず、見映えが悪（、粘着テー
プの劣化等で補修部が開いて凹所内の電子部品が脱落す
る等の問題点がある。However, the above repair method involves making an incision on one side of the recess.
It is necessary to work carefully so as not to damage other parts of the recess, and it is inconvenient to take out and store parts. Not only does it require a lot of man-hours, but it also looks bad (due to deterioration of the adhesive tape, etc.) There are problems such as the repair part opening and electronic components inside the recess falling out.
′ るための
この発明のキャリアテープは長手方向に等間隔に凹所を
設けたベーステープと上記各凹所に収容した電子部品を
封着するトップテープから成り、少なくとも一方のテー
プ部材を透明にした電子部品のキャリアテーピング工程
において、トップテープ封着後に外観検査を行ない、そ
こで発見された異常品を、キャリアテープの一部を開放
して取り除き、正常晶を収容して上記開放個所を修復さ
せるようになしたものである。The carrier tape of the present invention is made up of a base tape in which recesses are provided at equal intervals in the longitudinal direction, and a top tape for sealing the electronic components housed in each of the recesses, and at least one tape member is made transparent. In the carrier taping process for electronic components, an external appearance inspection is performed after sealing the top tape, and abnormal products found there are removed by opening a part of the carrier tape, and normal crystals are accommodated to repair the open area. This is how it was done.
上記実施態様として、１つは、異常品の収容凹所をキャ
リアテープから切除して上記収容凹所より一回り大きい
ケースに正常晶を収容して該ケースの開口部周辺ののフ
ランジ部をキャリアテープの上記切除個所にかぶせて熱
圧着する方法である。One of the above embodiments is to remove the storage recess for the abnormal product from the carrier tape, store the normal crystal in a case that is slightly larger than the storage recess, and use the flange part around the opening of the case as a carrier. This is a method in which the tape is placed over the cut portion and bonded under heat.
また、別の具体例は、異常品の収容凹所の前記トップテ
ープの一部をを該凹所の内周に沿って打抜き、異常品と
共に除去し、正常晶を収容した後、上記凹所の開口部を
別のトップテープで封着する方法である。In another specific example, a part of the top tape of the recess for storing the abnormal product is punched out along the inner periphery of the recess, removed together with the abnormal product, and after accommodating the normal crystal, the top tape is inserted into the recess. This is a method of sealing the opening with another top tape.
さらにもう１つの実施例では、キャリアテープの各凹所
に予め切込みを入れておき、この切込み部を弾性変形さ
せて異常品を取り出し、正常晶を収容して切込み部を弾
性復元させるようにしたものである。In yet another embodiment, notches are made in advance in each recess of the carrier tape, the notches are elastically deformed to take out abnormal products, and normal crystals are accommodated to elastically restore the notches. It is something.
皿
この発明は、その実施態様のように、異常品の凹所を大
きく切除して部品及び凹所を除去し、別のケースに正常
晶を入れて切除個所の凹所にかぶせて熱圧着することに
より工数を削減し、見映えを向上させ、中の製品の脱落
を防止し、また、修理部分を専用治具にセットし、凹所
上面のトップテープを凹所の内周面に沿ってプレス方式
で打抜いて除去し、異常品と正常晶との交換後、別のト
ップテープを、凹所上面の開口部にベーステープの側縁
の送り駒用パンチ穴を基準にして封着するようにし、或
いは、予め設けられた切込み部を押し広げて異常品と正
常晶との交換を行うようにするものである。In this invention, as in the embodiment of the present invention, the recess of the defective product is largely cut out, the parts and the recess are removed, and the normal crystal is placed in another case and placed over the recess of the excised part and bonded by thermocompression. This reduces man-hours, improves appearance, and prevents the product inside from falling out.In addition, set the repaired part in a special jig and apply the top tape on the top of the recess along the inner circumference of the recess. After removing the defective product by punching it out using a press and replacing it with a normal crystal, seal another top tape to the opening on the top surface of the recess using the punched hole for the feeding piece on the side edge of the base tape as a reference. Alternatively, the abnormal product can be exchanged with a normal crystal by expanding a pre-provided notch.
災旌■
第１図〜第３図は、本発明の第１の実施例の説明図であ
って、予め、第１図のようにベーステープ（２）の凹所
（１）より一回り大きいケース（５）を準備しておき、
キャリアテーピング工程で異常品が発見されたとき、第
２図のように凹所（１）を基部周辺の位置（Ａ）から大
き（切除し、異常品を取り除く。そして、正常晶（３）
を収容したケース（５）を切除個所の凹所（１）にかぶ
せてベーステープ（２）に熱圧着する。Disaster ■ Figures 1 to 3 are explanatory diagrams of the first embodiment of the present invention, and as shown in Figure 1, the base tape (2) has a recess (1) that is one size larger than the recess (1). Prepare case (5),
When an abnormal product is found in the carrier taping process, the recess (1) is cut out from the position (A) around the base as shown in Figure 2, and the abnormal product is removed.Then, the normal crystal (3) is removed.
The case (5) containing the material is placed over the recess (1) at the resection site and bonded to the base tape (2) by thermocompression.
上記ケース（５）はベーステープ（２）と同一材料で構
成するのが好ましいが、別材料であっても支障はなく、
その形状が凹所（１）より一回り大きい容器形状でその
上部開口部周辺にはフランジ（５ａ）を形成し、熱圧着
する。It is preferable that the case (5) is made of the same material as the base tape (2), but there is no problem if it is made of a different material.
The shape is a container that is one size larger than the recess (1), and a flange (5a) is formed around the upper opening of the container and is bonded by thermocompression.
上記凹所（１）の切除は、手作業による他、例えば切除
すべき凹所（１）を丁度収容できる形状のキャップ状治
具を使用し、この治具で凹所（１）を拘束しておき、治
具の上面開口に沿って切断刃をベーステープ（２）の長
手方向と直交する方向から水平移動させてスライスする
ようにカットさせるもので、切断刃は刃物による切断の
他、熱線による溶断でもよい。The above-mentioned recess (1) can be removed manually or, for example, by using a cap-shaped jig with a shape that can exactly accommodate the recess (1) to be removed, and by restraining the recess (1) with this jig. The cutting blade is then moved horizontally along the top opening of the jig from a direction perpendicular to the longitudinal direction of the base tape (2) to make a slice. It may also be cut by fusing.
ケース（５）の熱圧着には、キャンプ状の圧着治具を使
用して行うもので、上記切除及び熱圧着作業は、ベース
テープの側縁の送り駒用バンチ穴を利用して夫々の治具
に位置決めして行うことにより自動化が図れる。The thermocompression bonding of the case (5) is carried out using a camp-shaped crimping jig, and the above-mentioned cutting and thermocompression bonding operations are performed using the bunch holes for the feeding pieces on the side edges of the base tape. Automation can be achieved by positioning the tool.
第４図及び第５図は、本発明の第２の実施例の説明図で
あって、異常品の収容凹所（１）の上面のトップテープ
（４）のみを上記凹所（１）を修理治具（６）に位置決
めして、プレス方式のカッタ（７）により上記凹所（１
）の内周に沿って打抜き除去し、異常品を取り出して正
常品を収容した後、上記凹所（１）の上面開口部を別の
トップテープ（８）で封着するものである。4 and 5 are explanatory diagrams of a second embodiment of the present invention, in which only the top tape (4) on the upper surface of the abnormal product storage recess (1) is inserted into the recess (1). Position it on the repair jig (6) and use the press-type cutter (7) to cut out the recess (1).
) is punched out along the inner periphery of the recess (1), the defective product is taken out, and the normal product is housed. After that, the upper opening of the recess (1) is sealed with another top tape (8).
上記修理治具（６）には、凹所（１）を嵌合させる凹溝
（６ａ）が形成してあり、かつ、ベーステープ（２）の
側縁の送り駒用パンチ大（２ａ）に対応させて位置決め
ピン（６ｂ） （６ｂ）が設けてあり、この位置決め
ピン（６ｂ） （６ｂ）で修理すべき凹所（１）の位
置決めをして上記カッタ（７）による切除及び別のトッ
プテープ（８）の封着を行わせるものである。The repair jig (6) has a concave groove (6a) into which the concave part (1) fits, and a large punch (2a) for the feeding piece on the side edge of the base tape (2). Corresponding positioning pins (6b) (6b) are provided, and with these positioning pins (6b) (6b), the recess (1) to be repaired is positioned and cut out with the cutter (7) and another top is removed. This is to seal the tape (8).
第６図及び第７図は、本発明の第３の実施例であって、
第６図の場合は、凹所（１）の底壁部（１ａ）及び両側
壁部（ｌｂ） （ｌｂ）の中央に切込み（ＩＣ）を入
れておき、上記部分を両側に弾性変形させて拡開し、異
常品と正常品との交換後、弾性復元させて閉合させ、念
のため、シール（９）を貼着させるようにしたものであ
り、第７図の場合は、凹所（１）の底壁部（１ａ）の中
央部に切込み（ｌｃ’）を入れておき、この切込み（ｌ
ｃ’）を両側に拡開させて異常品と正常品との交換を行
うようにしたものである。6 and 7 show a third embodiment of the present invention,
In the case of Fig. 6, an incision (IC) is made in the center of the bottom wall (1a) and both side walls (lb) of the recess (1), and the above parts are elastically deformed on both sides. After the product is expanded and the abnormal product is replaced with a normal product, it is elastically restored and closed, and a seal (9) is attached just in case. A notch (lc') is made in the center of the bottom wall part (1a) of 1), and this notch (lc')
c') is expanded to both sides so that abnormal products can be exchanged with normal products.
上記第６図の場合、電子部品は通常では、両側から保持
されているため脱落しない。In the case of FIG. 6 above, the electronic component is normally held from both sides, so it does not fall off.
また、第７図の場合は、凹所（１）をゴム等の伸縮材料
で構成しておくものである。In the case of FIG. 7, the recess (1) is made of an elastic material such as rubber.
主皿二処果
この発明によれば、キャリアテープの修理作業を容易か
つ迅速に行うことができ、修理個所の見映えを悪化させ
ず、しかも、修理個所からの電子部品の脱落を防止する
ことができるものである。According to the present invention, carrier tape repair work can be performed easily and quickly, the appearance of the repaired area is not deteriorated, and electronic components are prevented from falling off from the repaired area. It is something that can be done.
第１図〜第３図は本発明の第１の実施例の説明図であっ
て、そのうち、第１図はケースの斜視図、第２図は修理
必要個所の凹所切除要領説明図、第３図は修理完了状態
の説明図、第４図は第２の実施例の修理要領説明図、第
５図はその斜視図、第６図〜第７図は第３の実施例であ
って、第６図（ａ）はキャリアテープの凹所形状を示す
斜視図、第６図（ｂ）は修理要領説明図、第７図（ａ）
はキャリアテープの凹所形状を示す斜視図、第７図（ｂ
）は修理要領説明図、第８図は本発明の前提となる修理
方法の説明図である。
（１）−・・−凹所、 （２）−ベーステープ、
（３）−・−電子部品、 （４）−・−トップテープ
、（５）−一一別のケース、（６）・−・修理治具、（
７） −カッタ、
（８）・−・別のトップテープ、
（９） −シール、 （ｌｃ）（ｌｃ“）−・・切
込み。1 to 3 are explanatory diagrams of the first embodiment of the present invention, in which FIG. 1 is a perspective view of the case, FIG. 3 is an explanatory diagram of the repair completed state, FIG. 4 is an explanatory diagram of the repair procedure of the second embodiment, FIG. 5 is a perspective view thereof, and FIGS. 6 to 7 are the third embodiment, Fig. 6(a) is a perspective view showing the shape of the recess in the carrier tape, Fig. 6(b) is a diagram explaining the repair procedure, and Fig. 7(a)
is a perspective view showing the shape of the recess in the carrier tape, and FIG.
) is an explanatory diagram of the repair procedure, and FIG. 8 is an explanatory diagram of the repair method that is the premise of the present invention. (1)--concavity, (2)-base tape,
(3)--Electronic parts, (4)--Top tape, (5)--Another case, (6)--Repair jig, (
7) -cutter, (8)...another top tape, (9) -sticker, (lc)(lc")...notch.
Claims (4)
上記各凹所に電子部品を収容後、封着するトップテープ
から成り、少なくとも一方のテープを透明部材としたキ
ャリアテーピング工程において、前記トップテープの封
着後に部品検査を行ない、そこで発見された異常品を、
テープ部材の一部を開放して取り除き、正常品を収容し
て上記開放個所を修復させることを特徴とするキャリア
テーピング修理方法。(1) In the carrier taping process, which consists of a base tape with recesses provided at equal intervals in the longitudinal direction and a top tape that seals electronic components after housing them in the recesses, and at least one of the tapes is a transparent member. After sealing the top tape, parts are inspected, and abnormal products found there are inspected.
A carrier taping repair method characterized by opening and removing a part of the tape member, storing a normal product and repairing the opened part.
上記収容凹所より一回り大きいケースに正常品を収容し
て該ケースの開口部周辺のフランジ部をキャリアテープ
の上記切除個所にかぶせて熱圧着することを特徴とする
特許請求の範囲第１項に記載のキャリアテーピング修理
方法。(2) Cut out the storage recess for the abnormal product from the carrier tape, store the normal product in a case that is one size larger than the storage recess, and cover the flange around the opening of the case over the cut out part of the carrier tape. The carrier taping repair method according to claim 1, characterized in that the carrier taping is bonded by heat and compression.
凹所の内周に沿って打抜き、異常品と共に除去し、正常
品を収容した後、上記凹所の開口部を別のトップテープ
で封着することを特徴とする特許請求の範囲第１項に記
載のキャリアテーピング修理方法。(3) After punching out a part of the top tape of the recess for storing the abnormal product along the inner circumference of the recess, removing it together with the abnormal product, and storing the normal product, open the opening of the recess into another The carrier taping repair method according to claim 1, characterized in that sealing is performed with a top tape.
き、この切込み部を弾性変形させて異常品を取り出し、
正常品を収容して切込み部を弾性復元させるようにした
ことを特徴とする特許請求の範囲第１項に記載のキャリ
アテーピング修理方法。(4) Make a notch in each concave part of the carrier tape in advance, elastically deform the notch to remove the abnormal product,
2. The carrier taping repair method according to claim 1, wherein the notched portion is elastically restored by accommodating a normal product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14213086A JPS6314A (en) | 1986-06-17 | 1986-06-17 | Method of repairing carrier taping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14213086A JPS6314A (en) | 1986-06-17 | 1986-06-17 | Method of repairing carrier taping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6314A true JPS6314A (en) | 1988-01-05 |
Family
ID=15308070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14213086A Pending JPS6314A (en) | 1986-06-17 | 1986-06-17 | Method of repairing carrier taping |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6314A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04154509A (en) * | 1990-10-11 | 1992-05-27 | Koa Corp | Carrier taping correction method of surface mounted part |
| JP2016069037A (en) * | 2014-09-30 | 2016-05-09 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package and take-out method of electronic component |
-
1986
- 1986-06-17 JP JP14213086A patent/JPS6314A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04154509A (en) * | 1990-10-11 | 1992-05-27 | Koa Corp | Carrier taping correction method of surface mounted part |
| JP2016069037A (en) * | 2014-09-30 | 2016-05-09 | 住友ベークライト株式会社 | Electronic component packaging material, electronic component package, manufacturing method of electronic component package and take-out method of electronic component |
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