JPS6315510U - - Google Patents
Info
- Publication number
- JPS6315510U JPS6315510U JP10964986U JP10964986U JPS6315510U JP S6315510 U JPS6315510 U JP S6315510U JP 10964986 U JP10964986 U JP 10964986U JP 10964986 U JP10964986 U JP 10964986U JP S6315510 U JPS6315510 U JP S6315510U
- Authority
- JP
- Japan
- Prior art keywords
- copel
- plates
- integrating
- center line
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
Description
第１図Ａは本考案一実施例の要部の分解斜視図
、第１図Ｂはその要部の縦断面図、第２図Ａ，Ｂ
，Ｃは従来のコーペル導体３種の概略側面図、第
３図は第２図Ａに示したコーペル導体においてコ
ーペル板間の剥離が生じ易いことを説明するため
の側面図である。
１……斜線部、２……コーペル板、３……半田
付け、４……銅板、５……網目、６……コーペル
板、６ａ……矩形波状凹凸、７……コーペル板、
８……凹入部。
Figure 1A is an exploded perspective view of the main parts of an embodiment of the present invention, Figure 1B is a vertical sectional view of the main parts, and Figures 2A and B.
, C are schematic side views of three types of conventional Copel conductors, and FIG. 3 is a side view for explaining that peeling between Copel plates is likely to occur in the Copel conductor shown in FIG. 2A. 1... Shaded area, 2... Copel plate, 3... Soldering, 4... Copper plate, 5... Mesh, 6... Copel plate, 6a... Rectangular wavy unevenness, 7... Copel plate,
8...Recessed part.
Claims (1)
部においてコーペル板間を一体化させて端子部を
構成するものにおいて、上下両面のコーペル板の
中間に配置される複数のコーペル板の先端縁には
、長手方向中心線に１つの山の立ち上がり線を合
致させて前記中心線に関し非対称に矩形波状の凹
凸を設け、前記複数のコーペル板は表裏交互にし
て積層し、前記先端縁において半田付けを施して
コーペル板間を一体化させて端子部を構成したこ
とを特徴とするコーペル導体。 In a device in which a terminal section is constructed by laminating a plurality of copel plates and integrating the copel plates at both ends of this laminate, a tip edge of the plural copel plates placed between the top and bottom copel plates is The rising line of one mountain coincides with the longitudinal center line, and rectangular wave-like unevenness is provided asymmetrically with respect to the center line, the plurality of copel plates are stacked with the front and back sides alternately, and the tip edges are soldered. A Copel conductor characterized in that a terminal portion is formed by integrating Copel plates by applying the same process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10964986U JPS6315510U (en) | 1986-07-17 | 1986-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10964986U JPS6315510U (en) | 1986-07-17 | 1986-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315510U true JPS6315510U (en) | 1988-02-01 |
Family
ID=30987935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10964986U Pending JPS6315510U (en) | 1986-07-17 | 1986-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315510U (en) |
-
1986
- 1986-07-17 JP JP10964986U patent/JPS6315510U/ja active Pending
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