JPS63162529U - - Google Patents

Info

Publication number
JPS63162529U
JPS63162529U JP5502687U JP5502687U JPS63162529U JP S63162529 U JPS63162529 U JP S63162529U JP 5502687 U JP5502687 U JP 5502687U JP 5502687 U JP5502687 U JP 5502687U JP S63162529 U JPS63162529 U JP S63162529U
Authority
JP
Japan
Prior art keywords
lead frame
resin sealing
disposed
mold
side edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5502687U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5502687U priority Critical patent/JPS63162529U/ja
Publication of JPS63162529U publication Critical patent/JPS63162529U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP5502687U 1987-04-11 1987-04-11 Pending JPS63162529U (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5502687U JPS63162529U (da) 1987-04-11 1987-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5502687U JPS63162529U (da) 1987-04-11 1987-04-11

Publications (1)

Publication Number Publication Date
JPS63162529U true JPS63162529U (da) 1988-10-24

Family

ID=30882558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5502687U Pending JPS63162529U (da) 1987-04-11 1987-04-11

Country Status (1)

Country Link
JP (1) JPS63162529U (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258495A (ja) * 2006-03-24 2007-10-04 Matsushita Electric Ind Co Ltd 半導体パッケージの製造方法および装置ならびに半導体パッケージ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111432A (ja) * 1983-11-22 1985-06-17 Toshiba Corp 半導体装置用樹脂封止金型
JPS6294312A (ja) * 1985-10-21 1987-04-30 Hitachi Ltd モ−ルド金型

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111432A (ja) * 1983-11-22 1985-06-17 Toshiba Corp 半導体装置用樹脂封止金型
JPS6294312A (ja) * 1985-10-21 1987-04-30 Hitachi Ltd モ−ルド金型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258495A (ja) * 2006-03-24 2007-10-04 Matsushita Electric Ind Co Ltd 半導体パッケージの製造方法および装置ならびに半導体パッケージ

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