JPS6316449U - - Google Patents
Info
- Publication number
- JPS6316449U JPS6316449U JP1986110841U JP11084186U JPS6316449U JP S6316449 U JPS6316449 U JP S6316449U JP 1986110841 U JP1986110841 U JP 1986110841U JP 11084186 U JP11084186 U JP 11084186U JP S6316449 U JPS6316449 U JP S6316449U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- external leads
- circuit boards
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は本実施例を示す断面図、第３図及び第４図は従
来例を示す断面図である。 １，２…第１及び第２の混成集積回路基板、３
…回路素子、４，５…第１及び第２の外部リード
、６…補強部材、７…枠体、８…突起部、９…支
持板、１０，１１，１２…第１、第２及び第３の
切り欠き部。
は本実施例を示す断面図、第３図及び第４図は従
来例を示す断面図である。 １，２…第１及び第２の混成集積回路基板、３
…回路素子、４，５…第１及び第２の外部リード
、６…補強部材、７…枠体、８…突起部、９…支
持板、１０，１１，１２…第１、第２及び第３の
切り欠き部。
Claims (1)
- 回路素子が設けられた第１及び第２の混成集積
回路基板と、該第１及び第２の混成集積回路基板
の同一側辺から同一方向に曲折された第１及び第
２の外部リードと、前記第１及び第２の混成集積
回路基板を対向して離間配置する枠体とからなる
混成集積回路において、垂直方向に形成された突
起部と水平方向に形成された支持板とが一体化さ
れた補強部材を前記第１及び第２の外部リード間
に配し、前記第１の外部リードは前記突起部に当
接保持され、前記第１及び第２の外部リードの端
部は前記支持板に設けられた第１及び第２の切り
欠き部内に配置し位置規制することを特徴とする
混成集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110841U JPH0442936Y2 (ja) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986110841U JPH0442936Y2 (ja) | 1986-07-18 | 1986-07-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6316449U true JPS6316449U (ja) | 1988-02-03 |
| JPH0442936Y2 JPH0442936Y2 (ja) | 1992-10-12 |
Family
ID=30990216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986110841U Expired JPH0442936Y2 (ja) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442936Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013135000A (ja) * | 2011-12-23 | 2013-07-08 | Denso Corp | 電力変換装置 |
-
1986
- 1986-07-18 JP JP1986110841U patent/JPH0442936Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013135000A (ja) * | 2011-12-23 | 2013-07-08 | Denso Corp | 電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442936Y2 (ja) | 1992-10-12 |