JPS6316458B2 - - Google Patents

Info

Publication number
JPS6316458B2
JPS6316458B2 JP59208471A JP20847184A JPS6316458B2 JP S6316458 B2 JPS6316458 B2 JP S6316458B2 JP 59208471 A JP59208471 A JP 59208471A JP 20847184 A JP20847184 A JP 20847184A JP S6316458 B2 JPS6316458 B2 JP S6316458B2
Authority
JP
Japan
Prior art keywords
alloy
substrate material
semiconductor device
powder
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59208471A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6187843A (ja
Inventor
Atsushi Kuroishi
Kyoaki Akechi
Yoshiaki Ito
Jusuke Kotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP59208471A priority Critical patent/JPS6187843A/ja
Priority to EP85112553A priority patent/EP0183016B1/en
Priority to DE8585112553T priority patent/DE3573137D1/de
Publication of JPS6187843A publication Critical patent/JPS6187843A/ja
Priority to US07/039,713 priority patent/US4830820A/en
Priority to US07/039,714 priority patent/US4926242A/en
Publication of JPS6316458B2 publication Critical patent/JPS6316458B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Powder Metallurgy (AREA)
  • Die Bonding (AREA)
JP59208471A 1984-10-03 1984-10-03 半導体装置用基板材料およびその製造方法 Granted JPS6187843A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP59208471A JPS6187843A (ja) 1984-10-03 1984-10-03 半導体装置用基板材料およびその製造方法
EP85112553A EP0183016B1 (en) 1984-10-03 1985-10-03 Material for a semiconductor device and process for its manufacture
DE8585112553T DE3573137D1 (en) 1984-10-03 1985-10-03 Material for a semiconductor device and process for its manufacture
US07/039,713 US4830820A (en) 1984-10-03 1987-04-20 Method for producing material for semiconductor device
US07/039,714 US4926242A (en) 1984-10-03 1987-04-20 Aluminum-silicon alloy heatsink for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59208471A JPS6187843A (ja) 1984-10-03 1984-10-03 半導体装置用基板材料およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6187843A JPS6187843A (ja) 1986-05-06
JPS6316458B2 true JPS6316458B2 (2) 1988-04-08

Family

ID=16556722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59208471A Granted JPS6187843A (ja) 1984-10-03 1984-10-03 半導体装置用基板材料およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6187843A (2)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634630A (ja) * 1986-06-24 1988-01-09 Mitsubishi Electric Corp 半導体装置の製造方法
JPH01205055A (ja) * 1988-02-12 1989-08-17 Sumitomo Electric Ind Ltd 半導体装置用基板材料
JP4906206B2 (ja) * 2001-09-27 2012-03-28 東洋アルミニウム株式会社 Ａｌ−Ｓｉ系粉末合金材料及びその製造方法

Also Published As

Publication number Publication date
JPS6187843A (ja) 1986-05-06

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