JPS63167745U - - Google Patents
Info
- Publication number
- JPS63167745U JPS63167745U JP1987061005U JP6100587U JPS63167745U JP S63167745 U JPS63167745 U JP S63167745U JP 1987061005 U JP1987061005 U JP 1987061005U JP 6100587 U JP6100587 U JP 6100587U JP S63167745 U JPS63167745 U JP S63167745U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- influence
- external force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987061005U JPS63167745U (mo) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987061005U JPS63167745U (mo) | 1987-04-21 | 1987-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167745U true JPS63167745U (mo) | 1988-11-01 |
Family
ID=30893944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987061005U Pending JPS63167745U (mo) | 1987-04-21 | 1987-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167745U (mo) |
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1987
- 1987-04-21 JP JP1987061005U patent/JPS63167745U/ja active Pending