JPS63167745U - - Google Patents

Info

Publication number
JPS63167745U
JPS63167745U JP1987061005U JP6100587U JPS63167745U JP S63167745 U JPS63167745 U JP S63167745U JP 1987061005 U JP1987061005 U JP 1987061005U JP 6100587 U JP6100587 U JP 6100587U JP S63167745 U JPS63167745 U JP S63167745U
Authority
JP
Japan
Prior art keywords
resin
lead frame
semiconductor device
influence
external force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987061005U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987061005U priority Critical patent/JPS63167745U/ja
Publication of JPS63167745U publication Critical patent/JPS63167745U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例を用いてリード付けを行つた
半導体装置の部分斜視図、第３図は従来のリード
フレームを用いた半導体装置の部分斜視図である
。 １，２……リードフレーム、１ａ，３……外部
リード部、３ａ，４……折曲げ部、５……半導体
素子、６……ボンデイングワイヤ、７……モール
ド樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂モールドタイプの半導体装置用のリードフ
    レームにおいて、前記樹脂にモールドされる部分
    の特定部に、樹脂部外のリードフレームに加えら
    れる外力が樹脂内部へ及ぼす影響を小さくするた
    めの折曲げ部が設けられていることを特徴とする
    半導体装置用リードフレーム。
JP1987061005U 1987-04-21 1987-04-21 Pending JPS63167745U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987061005U JPS63167745U (ja) 1987-04-21 1987-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987061005U JPS63167745U (ja) 1987-04-21 1987-04-21

Publications (1)

Publication Number Publication Date
JPS63167745U true JPS63167745U (ja) 1988-11-01

Family

ID=30893944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987061005U Pending JPS63167745U (ja) 1987-04-21 1987-04-21

Country Status (1)

Country Link
JP (1) JPS63167745U (ja)

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