JPS63167766U - - Google Patents

Info

Publication number
JPS63167766U
JPS63167766U JP1987060273U JP6027387U JPS63167766U JP S63167766 U JPS63167766 U JP S63167766U JP 1987060273 U JP1987060273 U JP 1987060273U JP 6027387 U JP6027387 U JP 6027387U JP S63167766 U JPS63167766 U JP S63167766U
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting device
lead
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987060273U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987060273U priority Critical patent/JPS63167766U/ja
Publication of JPS63167766U publication Critical patent/JPS63167766U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第1図乃至第3図は本考案発光装置の一つの実
施例を説明するためのもので、第1図は発光装置
の断面図、第2図は発光装置の分解斜視図、第3
図は発光装置の製造に用いる平面図、第4図は従
来例を示す分解斜視図である。 符号の説明、1……第1のヒートシンク、4…
…発光素子を支持しないリード、4a……発光素
子支持リード、6……発光素子、10……キヤツ
プ、13……第2のヒートシンク。

Claims (1)

  1. 【実用新案登録請求の範囲】 発光素子を支持しないリードが貫設された樹脂
    と発光素子を支持するリードとが貫通状に固定さ
    れた第1のヒートシンクの周縁部に、透明樹脂か
    らなるキヤツプが一体に形成されたリング状の第
    2のヒートシンクを固定してなる ことを特徴とする発光装置。
JP1987060273U 1987-04-21 1987-04-21 Pending JPS63167766U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987060273U JPS63167766U (ja) 1987-04-21 1987-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987060273U JPS63167766U (ja) 1987-04-21 1987-04-21

Publications (1)

Publication Number Publication Date
JPS63167766U true JPS63167766U (ja) 1988-11-01

Family

ID=30892543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987060273U Pending JPS63167766U (ja) 1987-04-21 1987-04-21

Country Status (1)

Country Link
JP (1) JPS63167766U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04121767U (ja) * 1991-04-19 1992-10-30 ローム株式会社 半導体レーザ装置
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
JP2003133627A (ja) * 2001-10-19 2003-05-09 Sharp Corp 半導体レーザ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04121767U (ja) * 1991-04-19 1992-10-30 ローム株式会社 半導体レーザ装置
JP2002359403A (ja) * 2001-05-31 2002-12-13 Nichia Chem Ind Ltd 発光装置
JP2003133627A (ja) * 2001-10-19 2003-05-09 Sharp Corp 半導体レーザ装置

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