JPS63172017U - - Google Patents
Info
- Publication number
- JPS63172017U JPS63172017U JP6541387U JP6541387U JPS63172017U JP S63172017 U JPS63172017 U JP S63172017U JP 6541387 U JP6541387 U JP 6541387U JP 6541387 U JP6541387 U JP 6541387U JP S63172017 U JPS63172017 U JP S63172017U
- Authority
- JP
- Japan
- Prior art keywords
- metal laminate
- conductive layer
- laminate tape
- overlaid
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
Description
第1図及び第2図は本考案に係る接合部の断面
図と平面図、第3図は従来の接合部の断面図であ
る。
10,10′……金属ラミネートテープ、10
A,10A′……端部、12,12′……導電層
、13,13′……半導電層、15……半田付部
、16……半導電性フイルム、17……ホツトメ
ルト系フイルム。
1 and 2 are a sectional view and a plan view of a joint according to the present invention, and FIG. 3 is a sectional view of a conventional joint. 10,10'...Metal laminate tape, 10
A, 10A'... end, 12, 12'... conductive layer, 13, 13'... semiconductive layer, 15... soldering part, 16... semiconductive film, 17... hot melt film.
Claims (1)
の金属ラミネートテープの接合部であつて、前記
半導電層が除去されて前記導電層が露出している
一方の金属ラミネートテープの端部と、該端部上
に重ね合わされる他方の金属ラミネートテープの
端部と、該重ね合わされる端部の導電層端面と前
記露出されている導電層との間に設けられる半田
付部とを含むことを特徴とする金属ラミネートテ
ープの接合部。 (2) 前記半導電層及び前記重ね合わされる端部
の各端面がテープの長手方向に対して20〜70
度の傾斜角度を有していることを特徴とする実用
新案登録請求の範囲第1項に記載の金属ラミネー
トテープの接合部。 (3) 上面に補強用フイルムが設けられているこ
とを特徴とする実用新案登録請求の範囲第1項に
記載の金属ラミネートテープの接合部。[Claims for Utility Model Registration] (1) A joint between a pair of metal laminate tapes in which a semiconductive layer is provided on a conductive layer, where the semiconductive layer is removed and the conductive layer is exposed. between the end of one metal laminate tape that is overlaid on the other end, the end of the other metal laminate tape that is overlaid on the end, and the conductive layer end face of the overlaid end and the exposed conductive layer. and a soldering part provided in the metal laminate tape. (2) Each end surface of the semiconductive layer and the overlapping end portion is 20 to 70 mm with respect to the longitudinal direction of the tape.
The joint portion of the metal laminate tape according to claim 1, which is characterized by having an inclination angle of .degree. (3) The joint portion of the metal laminate tape according to claim 1 of the utility model registration, characterized in that a reinforcing film is provided on the upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6541387U JPS63172017U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6541387U JPS63172017U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172017U true JPS63172017U (en) | 1988-11-09 |
Family
ID=30902461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6541387U Pending JPS63172017U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172017U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01143028U (en) * | 1988-03-28 | 1989-09-29 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61193306A (en) * | 1985-02-21 | 1986-08-27 | 古河電気工業株式会社 | Jointing of metal composite tape for cable |
-
1987
- 1987-04-30 JP JP6541387U patent/JPS63172017U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61193306A (en) * | 1985-02-21 | 1986-08-27 | 古河電気工業株式会社 | Jointing of metal composite tape for cable |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01143028U (en) * | 1988-03-28 | 1989-09-29 |
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