JPS63201717U - - Google Patents
Info
- Publication number
- JPS63201717U JPS63201717U JP9372987U JP9372987U JPS63201717U JP S63201717 U JPS63201717 U JP S63201717U JP 9372987 U JP9372987 U JP 9372987U JP 9372987 U JP9372987 U JP 9372987U JP S63201717 U JPS63201717 U JP S63201717U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tape
- exposed
- reinforcing layer
- metal tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Description
第１図は本考案に係る金属ラミネートテープの
接合部の断面図、第２図は従来の金属ラミネート
テープの接合部の断面図である。
１０，１０′…金属ラミネートテープ、１１，
１１′…金属テープ、１２，１２′…半導電層、
１３，１３′…補強層、１５…半田付部。
FIG. 1 is a sectional view of a joint of a metal laminate tape according to the present invention, and FIG. 2 is a sectional view of a joint of a conventional metal laminate tape. 10,10'...metal laminate tape, 11,
11'...Metal tape, 12,12'...Semiconductive layer,
13, 13'... Reinforcement layer, 15... Soldering part.
Claims (1)
に補強層が設けられている一対の金属ラミネート
テープの接合部であつて、前記半導電層が剥離さ
れて前記金属テープが露出している一方の金属ラ
ミネートテープの端部と、前記補強層の剥離によ
つて前記金属テープが露出している他方の金属ラ
ミネートテープの端部と、露出している金属テー
プどうしが重ね合わされ、一方の金属テープ端面
と他方の前記露出されている金属テープとの間に
設けられる半田付部とを含むことを特徴とする金
属ラミネートテープの接合部。 A joint between a pair of metal laminate tapes in which a semiconducting layer is provided on one side of the metal tape and a reinforcing layer is provided on the other side, and the semiconducting layer is peeled off and the metal tape is exposed. The end of one metal laminate tape where the metal tape is exposed by peeling off the reinforcing layer, and the end of the other metal laminate tape where the metal tape is exposed by peeling off the reinforcing layer, and the exposed metal tapes are overlapped and A joint section of a metal laminate tape, comprising a soldering section provided between an end surface of the metal tape and the other exposed metal tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372987U JPS63201717U (en) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9372987U JPS63201717U (en) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201717U true JPS63201717U (en) | 1988-12-26 |
Family
ID=30956551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9372987U Pending JPS63201717U (en) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201717U (en) |
-
1987
- 1987-06-18 JP JP9372987U patent/JPS63201717U/ja active Pending