JPS63186441A - Probe measurement - Google Patents

Abstract

PURPOSE:To contrive to be able to execute the measurement of a body to be measured at low cost and also, to make it possible to cope with immediately to trouble and so on as well to improve general-purpose properties by a method wherein the contact fingers of plural pieces of probe cards, which are distributed to circuit boards of more than two and are provided thereon, are brought into contact to the numerous measuring pads of the body to be measured to measure the electrical characteristics of the body to be measured. CONSTITUTION:Contact fingers 8 and 12 of plural pieces of probe cards 5 and 6, which are distributed to circuit boards of more than two for supporting the contact finger lines 8 and 12 of a tester and are provided thereon, are brought into contact to the numerous measuring pads of a body 2 to be measured and the electrical characteristics of the body 2 to be measured are measured by the tester in the contact state. For example, in case the electrical characteristics of the glass substrate 2 formed with a liquid crystal panel for image display are measured, the second probe card 6 is superposed on the first probe card 5 to install. First, a continuity measurement is executed in a state that the probes 8 of the probe card 5 are brought into contact to electrodes on the substrate 2. Then, a measuring stage 9 is moved upward in the vertical direction, the probes 12 of the probe card 6 are brought into contact to the electrodes on the substrate 2 and a continuity measurement is executed in a contact state.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe measurement method.

(Prior art) Recently, LCD televisions have become more popular, and there is a demand for the development of test automation in the mass production process of these televisions.
The present inventor has developed a probe device to meet this demand. In other words, a method for measuring the electrical characteristics of an object to be measured, such as a liquid crystal panel formed on a glass substrate, involves mounting a glass substrate on a measurement stage. After placing it and positioning it accurately,
A needle attached to a probe card is brought into contact with the electrodes of the panel formed on the glass substrate, and the electrical characteristics are measured with a tester connected to the probe card in this contact state. This probe card is, for example,
It is well known from Publication No. 530 and the like.

(Problems to be Solved by the Invention) In addition, the high integration of ICs has progressed significantly with technological innovation, and a technology for measuring ICs made using this technology is also required. Such high integration means an increase in the number of terminals constituting an IC, and an increase in the number of accommodated elements results in an increase in the number of electrode pads per chip. This increase in the number of electrode pads requires an increase in the number of probe needles.

However, in order to attach the probe needles to the printed circuit board, it takes a skilled person a long time to make each probe needle one by one. This task becomes more difficult as the number of probe needles increases. This makes it difficult to manufacture a probe device while maintaining an insulated state because the needle spacing becomes narrow. Therefore, a printed circuit board with a large number of probe needles becomes expensive.

In addition, this probe needle is easily broken, and once it breaks, even if other probe needles are normal, this printed circuit board becomes unusable.Repairs require a considerable amount of time and highly skilled techniques, and are not versatile. This would be extremely inconvenient to operate and would result in great damage.

The present invention has been made in order to improve the above-mentioned problems, and provides a method for measuring a measuring object using a probe at a low cost, and also capable of immediately responding to failures.

[Structure of the invention]

(Means for Solving the Problem) The present invention provides a tester with a plurality of probe cards having a circuit board that supports the stylus rows distributed over at least two circuit boards. A method for measuring a probe is provided, comprising means for bringing the probe into contact with the measurement pad portion, and means for measuring the electrical characteristics of the object to be measured with the tester in this contact state.

(Function) A stylus array for measuring the object to be measured is combined and electrically connected by probes distributed by at least two circuit boards, and measurement of the object to be measured is performed in this connected state. This method has the effect of improving the versatility of measuring the object to be measured at low cost and being able to immediately respond to failures.

(Example) Next, an example of the probe measuring method of the present invention will be described with reference to the drawings. This example is an example of a measurement method in which a glass substrate (2) on which a liquid crystal panel (2) for displaying images, such as a liquid crystal television, is formed as an object to be measured is measured using a prober for large square substrates.

This liquid crystal panel ■ has an x-y matrix wiring circuit and T
A liquid crystal display drive circuit is formed using PT technology. Approximately 300 electrodes are formed on each side of the panel.

A device for measuring the electrical characteristics of this panel (2) is, for example, a probe device shown in FIG. 4(A).

A probe card is attached to this probe device in the measurement section. This probe card.

It consists of a first probe card (2) and a second probe card (0). The first probe card ■ is shown in Figure 1 (A
), it is an insulating substrate with a length of 100 mm, a width of 150 + n + a thickness of 3 ffI11, and a circular hole (2) with a diameter of 40 + nm, for example, is cut out in the center of the substrate. A probe needle (c) is attached to the periphery of this hole obliquely toward the measurement stage (9) in accordance with the Y direction of the prober, and has a height of, for example, about 10 mm.

The printed circuit is wired from the probe needle attachment part to the board (
10) It has been done. The second probe card 0 is shown in Figure 1 (
As shown in B), for example, the length is 150 mm, the width is 100 mm, and the thickness is 3+.
A circular hole (11) having a diameter of 40 mm, for example, is hollowed out in the center of the n insulating substrate. A probe needle (12) is attached to the periphery of the hole (11) obliquely toward the measuring stage 0) corresponding to the X direction of the prober, and has a height of, for example, about 15+ nm. This probe needle (12)
A printed circuit is wired (13) from the mounting part. This probe card (!151 (fED) is set by overlapping the second probe card ■ on the first probe card ■ as shown in Figure 1 (C). The probe card socket (16) held by the ring (15) is screwed to fix it.The probe card socket (16) has a pin (17) connected to the tester planted therein. (
17) is in contact with the wiring (13) of the second probe card 0. Further, the first probe card 0 is held by a protrusion (18) provided on the insert ring (15) and fixed there by screws. This protrusion (18) is connected to the motor (
It is attached to a rotating shaft provided in an insert ring (15) connected to a motor (19), and can be moved up and down by rotating a motor (19). That is, the first probe card 0 can be moved up and down. Further, the pin (17) of the probe card socket (16) and the wiring (10) of the first probe card 0 are connected by a shield wire (21). This shield wire (21) has a sufficient length.

This prober also has a cassette (2
3) is placed on a cassette mounting table (24). This cassette (23) is capable of holding 20 glass substrates (2) in parallel at predetermined intervals.

The cassette mounting table (24) is connected to a motor (26) via a rotating shaft (25), and can be moved up and down by rotation of the motor (26). Two cassettes (23) can be stored, and two cassette mounting stands (24) are also provided. The glass substrate (2) is placed from the storage section of the cassette (23) onto the measurement stage 0 shown in FIG. 4(B) by a transport mechanism provided on the measurement stage (2). This conveyance mechanism has a structure in which it slides on one axis, and a plate-shaped arm (27) moves along a guide formed by a plate-shaped body (28). The plate-shaped arm (27) rotates the belt (3o) engaged with the rotating shaft by the rotation of the electric motor (29), and this belt (3o)
The screw (31) is actuated by the rotation of the screw (31), and the screw (31) is engaged and slid by a threading action.

In addition, the plate-shaped body (28) can be moved up and down, as shown in Figure 4 (C).
) As shown in ), the slide mechanism is set in the lower position to prevent damage to the glass substrate ■ during operation, and when the slide mechanism slides back to its original position, a uniform plane is formed by the surface that forms the measurement stage ■. are doing. Further, a vacuum suction mechanism is constructed between the plate-like arm (27) and the plate-like body (28). This measurement stage (9) is provided with drive systems in the X direction, Y direction, Z direction, and θ direction, and is movable in these directions. At the measurement position, the measurement stage (
Probe card (2) 0 is set relatively to the opposite surface of (9).

Next, this measurement method will be explained using this device.

First, the glass substrate (2) is taken out of the cassette (23) and placed on the measurement stage 0. This is done by moving the plate-shaped body (28) of the measurement stage (9) downward, and using the sliding mechanism of the measurement stage (9), the plate-shaped arm (27) ) is inserted, and then the cassette mounting table (24) is moved down by a predetermined distance, and the glass substrate (2) is placed on the plate-shaped arm (27). The placed glass substrate (2) is picked up by the vacuum suction mechanism and the slide is carried out. After unloading, the plate-shaped body (28) is moved upward to accurately place the glass substrate (2) on the measurement stage (9) with the measurement stage (9) as a uniform plane. Next, the glass substrate (2) placed on the measurement stage 0 is positioned. This is done by using a laser recognition mechanism or a pattern recognition mechanism to recognize the deviations in the X and Y directions of measurement stage 0 and a part of the corner of the glass substrate ■, and move the measurement stage (9) in the θ direction by the amount of deviation. Rotate and correct.

The measurement stage 0 on which the positioned glass substrate (2) is placed is moved to a position facing the probe card 00 setting. At this point, conductivity measurements of (A-8) and (C-O) between electrodes 0 of panel 3 shown in FIG. 3 are carried out.

First, the first probe card (2) is set in the down position as shown in FIG. 2(A). Next, move the measurement stage (9) up in the vertical direction and move the probe needle (8) of the first probe card ■.
and the electrodes A and B are brought into contact with each other. In this contact state (A
-8) Perform the continuity measurement. Thereafter, the first probe card (3) is set in the down position as shown in FIG. 2(B).

Next, move the measurement stage (9) upward in the vertical direction and connect the probe needles (12) of the second probe card 0 and the electrodes C and D.
contact. In this contact state, (C-O) continuity measurement is performed. After the measurement, the measurement stage (9) is vertically moved down and moved relative to the probe card (2) in the X and Y directions to set the measurement position for the next panel (2). During this time, the first probe card (2) is set to the lower state again. Repeat this operation to measure all panels α).

After the measurement is completed, this glass substrate (■) is returned to its original position in the cassette (23) by the slide mechanism of the measurement stage (9), and then the measurement of the other glass substrate (■) is carried out, and the cassette (
23) Execute the measurement of all the glass substrates (2) stored in .

In the above embodiment, by making the first probe card ■ vertically movable, the first probe card ■ and the second probe card
The probe needles (8) and (12) of the probe card 0 were brought into contact with the electrode (1) of the object to be measured alternately to carry out the measurement. However, they do not necessarily have to be brought into contact alternately. For example, as shown in FIG. 5, the probe needles (c) (12) of the first probe card 0 and the second probe card 0 can be brought into contact with the electrodes (1) of the object to be measured at the same time. At this time, the second probe card 0 is connected to the probe card socket (
16). Further, since the first probe card (2) does not need to be moved up and down, it is only necessary to attach it to the insert ring (15). As a result, the shield wire (21) connecting the wiring (10) of the first probe card (■) and the pin (17) of the probe card socket (16) is
It doesn't have to be something with a lot of leeway.

In another embodiment, four probe cards of the same type (3
An example using 5) will be explained.

As a probe card, a printed circuit board 1, e.g. 50m long
A probe needle (36) is attached to one side of a field measuring 50 mm in width and 3 in thickness, and a circuit is wired from the probe needle (36) attaching part. The four sides of this probe card (35) are formed by the sides to which the probe needles (36) of the four probe cards (35) are attached, as shown in FIG. This probe card (35) is attached to each probe card socket with one screw, and the pins implanted in the probe card socket are connected to the wiring of the probe card.

When measuring the object to be measured using these four probe cards (35), the electrodes of the object to be measured and the probe needles (35)
6) must be aligned.

Since each probe card (35) is attached to the probe card socket with a single screw, the position of the probe card (35) can be easily corrected. After this accurate positioning, measurement of the object to be measured is performed.

In this way, four probe cards of the same type were installed to measure the object under test, so even if one probe card were to break for some reason, the measurement could be continued by simply replacing the broken probe card, which would reduce the risk of damage. can also be kept to a minimum. Also, it is not necessary to use the same type of probe cards for all four probe cards; for example, the same type of probe cards can be used on opposite sides, and various combinations are possible, resulting in considerable versatility.

Furthermore, in the above embodiment, if the electrode spacing of different types of objects to be measured is made uniform, it is possible to measure many types of objects to be measured with the same probe card.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to measure the object to be measured by providing the stylus attached to each of at least two circuit boards, thereby making it possible to measure the object to be measured at low cost and with versatility. It also has the effect of improving

[Brief explanation of the drawing]

Fig. 1 is a diagram of a probe card for explaining one embodiment of the present invention, Fig. 2 is an explanatory diagram of the measurement of Fig. 1, and Fig. 3 is a diagram of the
FIG. 4 is a diagram of the probe device of FIG. 1, and FIGS. 5 and 6 are diagrams for explaining other embodiments of FIG. 1. 5 First probe card 6 Second probe card 8.12 Probe needle 16 Probe card socket 21 Shield wire 01 (A) (13) (C) Figure 2 (A) (B) Figure 3 Figure 4 (A) 4th mouth (B) (C) Fig. 5

Claims (2)

[Claims] (1) A means for bringing the probes of a plurality of probe cards, which are provided by distributing the circuit board supporting the probe array of the tester onto at least two circuit boards, into contact with a large number of measurement pads of the object to be measured; and means for measuring the electrical characteristics of the object to be measured with the tester in a contact state. (2) After measuring the electrical characteristics by touching the stylus attached to the first circuit board to the measurement part of the object to be measured, touch the stylus attached to the second circuit board to the measurement part of the object to be measured. Claim 1 characterized in that the electrical characteristics are measured by
Probe measurement method described in section.