JPS63193802U - - Google Patents
Info
- Publication number
- JPS63193802U JPS63193802U JP1987083188U JP8318887U JPS63193802U JP S63193802 U JPS63193802 U JP S63193802U JP 1987083188 U JP1987083188 U JP 1987083188U JP 8318887 U JP8318887 U JP 8318887U JP S63193802 U JPS63193802 U JP S63193802U
- Authority
- JP
- Japan
- Prior art keywords
- terminal portion
- main body
- concave
- solder filling
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987083188U JPS63193802U (mo) | 1987-06-01 | 1987-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987083188U JPS63193802U (mo) | 1987-06-01 | 1987-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193802U true JPS63193802U (mo) | 1988-12-14 |
Family
ID=30936545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987083188U Pending JPS63193802U (mo) | 1987-06-01 | 1987-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193802U (mo) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127895A (ja) * | 1989-10-13 | 1991-05-30 | Hakugen:Kk | フラットパッケージ型ｉｃの実装方法 |
-
1987
- 1987-06-01 JP JP1987083188U patent/JPS63193802U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127895A (ja) * | 1989-10-13 | 1991-05-30 | Hakugen:Kk | フラットパッケージ型ｉｃの実装方法 |