JPS6282734U - - Google Patents

Info

Publication number
JPS6282734U
JPS6282734U JP1985173609U JP17360985U JPS6282734U JP S6282734 U JPS6282734 U JP S6282734U JP 1985173609 U JP1985173609 U JP 1985173609U JP 17360985 U JP17360985 U JP 17360985U JP S6282734 U JPS6282734 U JP S6282734U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding surface
capillary
reference plane
respect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985173609U
Other languages
Japanese (ja)
Other versions
JPH0419797Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173609U priority Critical patent/JPH0419797Y2/ja
Publication of JPS6282734U publication Critical patent/JPS6282734U/ja
Application granted granted Critical
Publication of JPH0419797Y2 publication Critical patent/JPH0419797Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の半導体装置の要部拡大断面図
、第２図は本考案の半導体装置の一例を示す斜視
図、第３図及び第４図は本考案の半導体装置にか
かるワイヤボンデイング面と基準面の関係を示す
それぞれ模式図、第５図は従来の半導体装置を示
す要部拡大断面図である。 １……チツプ、２……基準面、３……ワイヤ、
４……基台、６……キヤピラリーの先端部、６ｃ
……キヤピラリーの先端部のチツプ側、７……ワ
イヤボンデイング部、８……ワイヤボンデイング
面、８ｃ……ワイヤボンデイング面のチツプ側。 FIG. 1 is an enlarged cross-sectional view of essential parts of the semiconductor device of the present invention, FIG. 2 is a perspective view showing an example of the semiconductor device of the present invention, and FIGS. 3 and 4 are wire bonding surfaces of the semiconductor device of the present invention. FIG. 5 is an enlarged sectional view of a main part of a conventional semiconductor device. 1... Chip, 2... Reference plane, 3... Wire,
4...Base, 6...Capillary tip, 6c
...Tip side of the tip of the capillary, 7...Wire bonding part, 8...Wire bonding surface, 8c... Chip side of the wire bonding surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプの基準面に対して所定角度のばら
つきを有するリードのワイヤボンデイング面が、
キヤピラリーの先端部のチツプ側が該ワイヤボン
デイング面と接触するように上記基準面に対して
上記ばらつきの角度以上の傾斜をもつて配設され
てなる半導体装置。 The wire bonding surface of the lead, which has a predetermined angle variation with respect to the reference plane of the semiconductor chip,
A semiconductor device, wherein a tip side of a capillary is disposed at an angle greater than the variation angle with respect to the reference plane so that the tip side of the capillary comes into contact with the wire bonding surface.
JP1985173609U 1985-11-13 1985-11-13 Expired JPH0419797Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173609U JPH0419797Y2 (en) 1985-11-13 1985-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173609U JPH0419797Y2 (en) 1985-11-13 1985-11-13

Publications (2)

Publication Number Publication Date
JPS6282734U true JPS6282734U (en) 1987-05-27
JPH0419797Y2 JPH0419797Y2 (en) 1992-05-06

Family

ID=31111228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173609U Expired JPH0419797Y2 (en) 1985-11-13 1985-11-13

Country Status (1)

Country Link
JP (1) JPH0419797Y2 (en)

Also Published As

Publication number Publication date
JPH0419797Y2 (en) 1992-05-06

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