JPS63200370U - - Google Patents
Info
- Publication number
- JPS63200370U JPS63200370U JP9050687U JP9050687U JPS63200370U JP S63200370 U JPS63200370 U JP S63200370U JP 9050687 U JP9050687 U JP 9050687U JP 9050687 U JP9050687 U JP 9050687U JP S63200370 U JPS63200370 U JP S63200370U
- Authority
- JP
- Japan
- Prior art keywords
- modification
- component mounting
- wiring pattern
- mounting section
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の多層プリント配線板の一実施
例の表面の配線構造を示す平面図、第２図はその
１層下側の内層の配線構造を示す平面図、第３図
は実施例の多層プリント配線板における第１の改
造用配線構造を示す断面図、第４図は同じく第２
の改造用配線構造を示す断面図である。
１……リード接続用パツド、２……スルーホー
ル、３……改造用パツド、４……ＬＳＩパツケー
ジ、５，１２……リード端子、６，１３……表面
配線パターン、８，１４，１６……微小スルーホ
ール、９，１７……改造時切断用表面配線パター
ン、１０，１５……内層配線パターン。
Fig. 1 is a plan view showing the wiring structure on the surface of an embodiment of the multilayer printed wiring board of the present invention, Fig. 2 is a plan view showing the wiring structure of the inner layer one layer below the board, and Fig. 3 is an embodiment. FIG. 4 is a sectional view showing the first modified wiring structure in the multilayer printed wiring board.
FIG. 3 is a cross-sectional view showing a wiring structure for modification. 1... Pad for lead connection, 2... Through hole, 3... Pad for modification, 4... LSI package, 5, 12... Lead terminal, 6, 13... Surface wiring pattern, 8, 14, 16... ...Minute through hole, 9, 17... Surface wiring pattern for cutting during modification, 10, 15... Inner layer wiring pattern.
Claims (1)
続用パツドを設けるとともに、前記部品実装部の
内側および外側に、配線パターンと接続された複
数のスルーホールを配設し、前記リード接続用パ
ツドと対応するスルーホールとを、前記部品実装
部の外側のリード接続用パツドの近傍に設けられ
た改造用パツドを介してそれぞれ接続してなる多
層プリント配線板において、前記リード接続用パ
ツドと改造用パツドとを表面配線パターンでそれ
ぞれ接続するとともに、前記改造用パツドと、こ
の近傍に設けられた内層の一部を貫通する微小ス
ルーホールとを、改造時切断用表面配線パターン
によりそれぞれ接続し、かつ前記微小スルーホー
ルと部品実装部内側のスルーホールとを、内層配
線パターンによつて接続してなる第１の改造用配
線構造と、前記部品実装部の内側および前記改造
用パツドの配設部に、互いに内層配線パターンに
よつて接続された内層の一部を貫通する微小スル
ーホールをそれぞれ設けるとともに、前記部品実
装部内側の微小スルーホールと前記リード接続用
パツドとを表面配線パターンで接続し、かつ前記
改造用パツドと部品実装部外側のスルーホールと
を、改造時切断用表面配線パターンによつてそれ
ぞれ接続してなる第２の改造用配線構造とを備え
てなることを特徴とする多層プリント配線板。 A plurality of lead connection pads are provided on the outside of the mounting section on the component mounting surface, and a plurality of through holes connected to wiring patterns are provided inside and outside of the component mounting section. and corresponding through-holes are respectively connected via modification pads provided near the lead connection pads on the outside of the component mounting section, wherein the lead connection pads and the modification pads are connected to The pad for modification is connected to each other by a surface wiring pattern, and the modification pad and a minute through hole that penetrates a part of the inner layer provided in the vicinity thereof are respectively connected by a surface wiring pattern for cutting during modification, and a first modification wiring structure in which the minute through hole and a through hole inside the component mounting section are connected by an inner layer wiring pattern; , providing minute through-holes penetrating a part of the inner layer that are connected to each other by an inner layer wiring pattern, and connecting the minute through-hole inside the component mounting part and the lead connection pad with a surface wiring pattern; and a second modification wiring structure in which the modification pad and the through-hole outside the component mounting section are respectively connected by a surface wiring pattern for cutting during modification. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9050687U JPS63200370U (en) | 1987-06-12 | 1987-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9050687U JPS63200370U (en) | 1987-06-12 | 1987-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200370U true JPS63200370U (en) | 1988-12-23 |
Family
ID=30950437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9050687U Pending JPS63200370U (en) | 1987-06-12 | 1987-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200370U (en) |
-
1987
- 1987-06-12 JP JP9050687U patent/JPS63200370U/ja active Pending
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