JPS63201340U - - Google Patents

Info

Publication number
JPS63201340U
JPS63201340U JP1987092686U JP9268687U JPS63201340U JP S63201340 U JPS63201340 U JP S63201340U JP 1987092686 U JP1987092686 U JP 1987092686U JP 9268687 U JP9268687 U JP 9268687U JP S63201340 U JPS63201340 U JP S63201340U
Authority
JP
Japan
Prior art keywords
utility
model registration
cooling fan
bent
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987092686U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987092686U priority Critical patent/JPS63201340U/ja
Publication of JPS63201340U publication Critical patent/JPS63201340U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP1987092686U 1987-06-16 1987-06-16 Pending JPS63201340U (lt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987092686U JPS63201340U (lt) 1987-06-16 1987-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987092686U JPS63201340U (lt) 1987-06-16 1987-06-16

Publications (1)

Publication Number Publication Date
JPS63201340U true JPS63201340U (lt) 1988-12-26

Family

ID=30954614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987092686U Pending JPS63201340U (lt) 1987-06-16 1987-06-16

Country Status (1)

Country Link
JP (1) JPS63201340U (lt)

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