JPS6320155A - Soldering method and its device - Google Patents

Abstract

PURPOSE:To exactly and quickly solder the parts to be soldered, in a prescribed state, by facing the lower end face of a solder holding body to a part to be soldered in non-contacting state, molten solder which is made to adhere to the lower end face bringing into contact with the part to be soldered, and executing its soldering by heating. CONSTITUTION:The lower end face 5'a of a solder holding body 5' is heated and held to a temperature at which solder is melted, and by a supplying means 6, the tip of a wire-shaped solder 7 is brought into contact opposingly with the lower end face 5'a, and molten solder 7' is made to adhere to its lower end face 5'a and held. Subsequently, the solder holding body 5' is moved to a table 8 side on which a circuit board 10 is placed. In such a case, when the movement is controlled so that the lower end face 5'a of the holding body 5' does not bring into contact with a part to be soldered 10a, heat of the holding body 5' is transmitted to the part to be soldered 10a through the molten solder 7', the part to be soldered 10a rises a necessary soldering temperature, and soldering is executed quickly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a soldering method and an apparatus therefor, and the present invention relates to a soldering method and an apparatus for soldering, and the present invention relates to a soldering method and an apparatus for the same, and the present invention relates to a soldering method and an apparatus for soldering, and the present invention relates to a soldering method and an apparatus for the soldering method, and the present invention relates to a soldering method and an apparatus for soldering, and the present invention relates to a soldering method and an apparatus therefor.

The present invention relates to a method and device for soldering that allows soldering without causing positional displacement.

(Prior Art) When manufacturing and assembling printed circuit boards, that is, mounting electronic components such as resistors and flat package integrated circuit elements on printed circuit boards, lead hems of the electronic components are soldered. However, when it comes to soldering in the mounting of electronic components of this type, it is desired to have soldering threads, leads, and reliable soldering when automating manufacturing and assembly processes. By the way, a soldering device as shown in FIG. 3, for example, is used to solder electronic components to the printed circuit board. That is, for example, a cylinder (not shown) is built into the support (2) installed on the base (1), and the first drive body (3), which can move forward and backward in the direction of arrow (A), is attached by this cylinder. The first drive body (3) has a built-in cylinder (not shown), for example, and the heater (4) is driven through a second drive body (4) that can move forward and backward in the direction of the arrow ←. The basic configuration includes a soldering iron (5) with a built-in soldering iron (not shown). A solder feeding mechanism (6) is disposed along the soldering iron (5), and the solder feeding mechanism (6) moves the wire-shaped solder (7).
It is supplied facing the tip of the soldering iron (5). Further, during soldering, the soldering iron (5) is used to mount and solder a part to be soldered (10a), for example, a circuit board (10), which is placed on a table (8) via a mounting base (9). The lead wire of the electronic component (10b) is set so as to be in contact with the lead wire of the electronic component (10b). That is, when soldering,
By driving the second driving body (4), the soldering iron tip of the soldering iron (5) comes into contact with the soldering part (ioa) and melting the solder (force) while melting the soldering part (ioa). The soldering iron (5) is configured to also heat the soldering iron (5).

However, the above soldering operation or work is performed on the first driving body (
3) and driving the second driving body (4), and driving the solder feeding mechanism (6) in conjunction with the second driving body (4).

Furthermore, movement of the soldered part (II (movement of the soldered part))
By appropriately repeating the process, for example, the mounting and soldering of electronic components (IOB) on the printed circuit board θQ progresses on an automated line.

However, the above soldering apparatus has the following practical disadvantages. In other words, since the tip of the soldering iron (5) comes into direct contact with the wave soldering part (10M), oxidized and blackened 7 lux adheres to it and becomes dirty, and the lead wire ( Soldering part) (10) The soldering part may be misaligned.

Not only is the soldering reliability likely to be impaired due to bending, but also the soldering speed is disadvantageous.

(Problems to be Solved by the Invention) Accordingly, the present invention provides a soldering method and a soldering method that are capable of reliably and quickly soldering components to a predetermined state and are suitable for mounting electronic components on a printed circuit board. The purpose is to provide a device suitable for carrying out the following.

[Structure of the invention]

(Means for Solving the Problems) According to the present invention, the solder supply means is provided, and the lower end surface of the heating element for soldering is set so as not to come into contact with the part to be soldered (non-contact).

The gist of soldering is to attach and hold molten solder to the lower end surface of the heating body (solder holder) and heat the part to be soldered through the molten solder.

(Function) According to the soldering method and apparatus thereof of the present invention having the above-mentioned configuration, during soldering, the solder holder does not come into direct contact with the part to be soldered. That is, the solder is adhered and held in a molten state to the lower end surface of the solder holder and transferred to the part to be soldered, and the part to be soldered is heated by the heat of the molten solder to perform soldering. Since the solder holder, which serves as a solder, never comes into direct contact with the part to be soldered, there is no risk of contamination with solder flux or misalignment of the lead wire to be soldered.

(Embodiment) The present invention will be described below with reference to FIG. 1, which shows a side view of an embodiment of an apparatus suitable for carrying out the soldering method according to the present invention. In FIG. 1, (1) is a base, (2) is a support, (3) is a first driver, (4) is a second driver,
(5f is a solder holder with a built-in heating means, and the basic structure can be said to be almost the same as that of the conventional example (FIG. 3).

However, in the present invention.

The solder holder (
The lower end surface (5a) of 5) is disposed in a non-contact and relatively movable manner. That is, the solder holder (5) is movable by the first driver (3) and the second driver (4), but the lower end surface (5a') of the solder holder (a)
is set so that it does not always come into contact with the part to be soldered (10a) (non-contact). Further, in the present invention, the lower end surface (5) of the solder holder (5) that faces the wave soldering portion (101) without contact is provided with molten solder (5).
7a) For example, wire-shaped solder (
7) to the lower end surface (5a) of the solder holder (5). Therefore, the solder supplying means (6) supplies a predetermined amount of solder intermittently as appropriate in conjunction with the soldering operation to the soldering target portion (10).

Next, the operation of the soldering apparatus having the above configuration will be explained. First, a heating means (not shown) is operated on the solder holder (5) to heat and maintain at least the lower end surface (5 m) of the solder holder (5) at a temperature at which the solder melts.

In this state, the solder supply means (6) is operated to feed the wire-shaped solder (7) in the direction of the arrow (c).
The tip of the solder holder (5) is heated and held.
) is brought into contact with the lower end surface (5a) of the The solder (force) thus supplied is applied to the lower end surface (5a') of the solder holder (5).
Melt the solder (7) on the lower end surface (51').
) is adhered and held by its own surface tension. Next, the first driving body (3) and the second driving body (4) are operated to move the electronic components (10b) to be soldered onto the table (8) on which the circuit board (11) is placed. The solder holder (5) is moved (indicated by dotted lines in Figure 1). When soldering the solder target (10) by the movement of the solder holder (5), the solder holder (5) to which the molten solder (7) is attached and held is controls the movement of the solder holder (5) so that the lower end surface (5a) of the solder holder (5) does not come into contact with the soldered part (10). 1011), the lower end surface (5a
) is only in contact with the molten solder (7) adhered to the
The lower end surface (5a) of the solder holder (5) is controlled and set to be separated from (non-contact with) the soldered portion (101). In this way, the heat of the solder holder (5) is transferred to the part to be soldered (10a) through the force of the molten solder, and the part to be soldered (10a) rises to the required soldering temperature and quickly Soldering is performed.In the above soldering, solder flux is appropriately applied to the soldered part (10a) in advance.After performing the required soldering operation in this way, the first soldering operation is performed. Drive body (3
) and the second driver (4) to return the solder holder surface to its original position (solid line in Figure 1) melt the solder (7) again.
By repeating a series of operations such as adhering and holding the solder to the lower end surface (5a) of the solder holder (5), the required soldering is performed in sequence.

In the above embodiment, the solder supply means (6) is attached to the base (1), and the solder (7) is transferred to the solder holder (5).
However, the structure is such that the material is supplied facing the lower end surface (5a) of the material.

For example, as shown in the cross-sectional view of the main part in FIG. 2, a hole (5b) passing through the solder holder (5) in the axial direction is formed, and the inside of this hole (5b') is filled with molten solder (7'). Flow the bottom end surface (
5a') A vine structure may be used in which K molten solder is adhered and held. In FIG. 2, (5C) shows a coil as a resistance heating element.

Further, in the above configuration example, the solder holder (5) is moved by the operation of the first driving body (3), etc. Of course, a configuration in which I/(81 or the like) is moved may also be used.

〔Effect of the invention〕

As described above, one aspect of the present invention is to position the lower end surface of a solder holder corresponding to a soldering iron so as not to contact (separate from) the part to be soldered during soldering, and to apply molten solder to the solder holder. The main idea is to keep the molten solder adhered to the lower end surface of the solder, and to bring only the molten solder that has been adhered and held in contact with the soldered part. Therefore, the required soldering is carried out using the molten solder adhered to and held by the surface tension of the lower end surface of the solder holder as a medium to heat and raise the temperature of the part to be soldered which is required for soldering. That is, in the above-mentioned soldering, the solder holder, which has a role similar to a soldering iron, does not come into pressure contact with the part to be soldered at all in a non-contact manner. Therefore, in the above-mentioned soldering, there is no possibility of displacement or bending deformation of the lead wires of the electronic components to be soldered, and reliable and highly reliable soldering can be achieved.

Furthermore, the fact that the soldering portion does not undergo positional displacement or bending deformation reduces troubles during the soldering operation and contributes to speeding up the soldering process. Moreover, the fact that the lower end surface of the solder holder, which functions as the soldering iron, does not come into contact with the part to be soldered (non-contact) means that contamination caused by oxidized solder flux is reduced, and the required soldering is reduced. This leads to the advantage of maintaining and exerting the attachment function.

[Brief explanation of drawings]

FIG. 1 is a side view showing an embodiment of the soldering device according to the present invention, FIG. 2 is a sectional view showing another example of the structure of the solder holder of the soldering device of the present invention, and FIG. 3 is a conventional soldering device. FIG. 3 is a side view showing the attachment device. (5): Solder holder. (5a): Lower end surface of the solder holder. (5C): Heating means. (6): Solder supply means. (7): Solder. (7): Molten solder. (ioa): Soldering part. Agent Patent Attorney Nori Ken Yudo Takehana Kikuo Procedural Amendment (Voluntary) 1. Display of the case Japanese Patent Application No. 161963/1982 2, Name of the invention Soldering method and device 3, Person making the amendment Relationship to the case Patent applicant (307) Toshiba Corporation 4, Agent Address: Minato-ku, Tokyo 105 Shibaura-chome 1-1-6 Contents of amendment (1) The scope of claims in the specification is amended as shown in the attached sheet. (2) [Solder component (IQIJ) stated in line 5 of page 4 of the specification is corrected to ``circuit component wire.'' Dry concavity of buttock #pI (1) At least the lower end surface is soldered The molten solder is adhered and held on the lower end surface of the solder holder, which is heated and held at a temperature that melts the solder holder, and then the lower end surface of the solder holder is faced without contact with the part to be soldered, and the solder is adhered to the lower end surface. A soldering method characterized by bringing the held molten solder into contact with the soldered part and heating and soldering the soldered part through the contacted molten solder. (2) For the soldered part a solder holder whose lower end surface is movably disposed without contacting the part to be soldered;
heating means for heating and maintaining at least the lower end surface of the solder holder at a temperature at which the solder melts; and supplying a predetermined amount of solder to the lower end surface of the solder holder in order to adhere and hold the molten solder to the lower end surface of the solder holder. 1. A soldering device comprising: a soldering device for supplying solder.

Claims (2)

[Claims] (1) At least the lower end surface of the solder holder is heated and maintained at a temperature that melts the solder, and the molten solder is adhered and held on the lower end surface of the solder holder, and then the lower end surface of the solder holder is held in place with respect to the part to be soldered. A soldering method characterized by bringing the molten solder which is brought into contact and adhered and held on the lower end surface into contact with the part to be soldered, and heating and soldering the part to be soldered via the molten solder in contact. (2) a solder holder whose lower end surface is movably disposed with respect to the soldered part without contacting the soldered part;
heating means for heating and maintaining at least the lower end surface of the solder holder at a temperature at which the solder melts; and supplying a predetermined amount of solder to the lower end surface of the solder holder in order to adhere and hold the molten solder to the lower end surface of the solder holder. 1. A soldering device comprising: a soldering device for supplying solder.