JPS6320448U - - Google Patents

Info

Publication number
JPS6320448U
JPS6320448U JP1986114964U JP11496486U JPS6320448U JP S6320448 U JPS6320448 U JP S6320448U JP 1986114964 U JP1986114964 U JP 1986114964U JP 11496486 U JP11496486 U JP 11496486U JP S6320448 U JPS6320448 U JP S6320448U
Authority
JP
Japan
Prior art keywords
thermal expansion
heat spreader
copper
coefficient
surrounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986114964U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986114964U priority Critical patent/JPS6320448U/ja
Publication of JPS6320448U publication Critical patent/JPS6320448U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members

Description

【図面の簡単な説明】
図面は本考案の実施例を示す断面図である。 １ａ……内部材、１ｂ……外部材。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 銅又は銅合金材料にてそれよりも熱膨張係数
    が小さい材料を囲繞してあることを特徴とするヒ
    ートスプレツダ。 ２ 前記熱膨張係数が小さい材料がインバー材で
    ある実用新案登録請求の範囲第１項記載のヒート
    スプレツダ。
JP1986114964U 1986-07-25 1986-07-25 Pending JPS6320448U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986114964U JPS6320448U (ja) 1986-07-25 1986-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986114964U JPS6320448U (ja) 1986-07-25 1986-07-25

Publications (1)

Publication Number Publication Date
JPS6320448U true JPS6320448U (ja) 1988-02-10

Family

ID=30998180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986114964U Pending JPS6320448U (ja) 1986-07-25 1986-07-25

Country Status (1)

Country Link
JP (1) JPS6320448U (ja)

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