JPS632106B2 - - Google Patents

Info

Publication number
JPS632106B2
JPS632106B2 JP8375681A JP8375681A JPS632106B2 JP S632106 B2 JPS632106 B2 JP S632106B2 JP 8375681 A JP8375681 A JP 8375681A JP 8375681 A JP8375681 A JP 8375681A JP S632106 B2 JPS632106 B2 JP S632106B2
Authority
JP
Japan
Prior art keywords
diagram
pattern
film
component
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8375681A
Other languages
Japanese (ja)
Other versions
JPS57199293A (en
Inventor
Yukio Morya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8375681A priority Critical patent/JPS57199293A/en
Publication of JPS57199293A publication Critical patent/JPS57199293A/en
Publication of JPS632106B2 publication Critical patent/JPS632106B2/ja
Granted legal-status Critical Current

Links

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  • Preparing Plates And Mask In Photomechanical Process (AREA)

Description

【発明の詳細な説明】 本発明はプリント配線板の実装図作成方法の改
良に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for creating mounting diagrams for printed wiring boards.

従来プリント配線板を新たに設計製作した場合
には、そのプリント配線板の部品搭載面の配線パ
ターンと、搭載する部品の外形図及び記号などを
書き入れた第1図に示す如き実装図を作成して、
後の設計・製作の参考資料としている。従来この
実装図の作成方法は、第2図に示す如き自動作図
機を用い、そのX方向に摺動できるテーブル1上
に予め位置合わせ用基準孔をあけた生フイルムを
のせ、Y方向に摺動できるホトヘツド2と前記テ
ーブル1とを制御装置3によりX―Y方向に駆動
して部品図のマスク用(部品図と同形であるが描
線を太くしたもの)図面を画かせ、これを現像し
て第3図aの如き部品図マスク用ポジフイルム4
を作成する。次に同様の手順にて第3図bの如き
部品搭載面のパターンのポジフイルム5を作成
し、次に第3図cの如くこのポジフイルム5を焼
付機にて生フイルム6に焼付け第3図dの如き部
品搭載面のパターンのネガフイルム6aを作成す
る。次に自動作図機を用いて第3図eの如く部品
図の未現像ポジフイルム7を作成する。次いでこ
の未現像フイルム7に第3図fの如く前記部品図
マスク用ポジフイルム4を挾んで部品搭載面パタ
ーンのネガフイルム6aを重ね、焼付・現像すれ
ば第3図gに示す如くパターン8と部品図9を合
成した実装図10が得られる。なおこの場合部品
図マスク用ポジフイルム4はパターン8の線と部
品図9の線とが交差しないようにするためであ
る。
Conventionally, when a new printed wiring board is designed and manufactured, a mounting drawing as shown in Figure 1 is created, which includes the wiring pattern of the component mounting surface of the printed wiring board, and the outline drawing and symbols of the components to be mounted. hand,
It is used as reference material for later design and production. Conventionally, the method for creating this mounting diagram is to use an automatic drawing machine as shown in Fig. 2, place a raw film with reference holes for positioning in advance on a table 1 that can slide in the X direction, and slide it in the Y direction. The movable photohead 2 and the table 1 are driven in the X-Y direction by the control device 3 to draw a mask drawing for the parts drawing (one that has the same shape as the parts drawing but with thicker drawn lines), and this is developed. A positive film 4 for masking the parts diagram as shown in Fig. 3a.
Create. Next, a positive film 5 with the pattern of the component mounting surface as shown in FIG. A negative film 6a having a pattern of the component mounting surface as shown in FIG. d is prepared. Next, an undeveloped positive film 7 with a parts diagram as shown in FIG. 3e is created using an automatic drawing machine. Next, as shown in FIG. 3f, a negative film 6a with a component mounting surface pattern is placed on this undeveloped film 7, sandwiching the positive film 4 for the parts drawing mask, as shown in FIG. A mounting diagram 10 is obtained by combining the component diagrams 9. In this case, the positive film 4 for masking the parts diagram is used to prevent the lines of the pattern 8 and the lines of the parts diagram 9 from intersecting.

以上のような実装図の作成方法では、実装図作
成後、第3図aの部品マスク用ポジフイルム4と
第3図dの部品搭載面パターンのネガフイルム6
aとが不要になり、そのため資材及び工数の無駄
を生ずることになる。本発明はこの欠点を改良す
るために案出されたものである。
In the method for creating a mounting diagram as described above, after creating a mounting diagram, a positive film 4 for a component mask shown in FIG. 3a and a negative film 6 for a component mounting surface pattern shown in FIG.
(a) becomes unnecessary, resulting in a waste of materials and man-hours. The present invention has been devised to improve this drawback.

このため本発明においては、プリント配線板の
部品搭載面のパターンと部品図とを合成する実装
図作成方法において、自動作図機にて部品図マス
ク用の未現像ポジフイルムを作成し、これに予め
自動作図機にて作成したパターンのポジフイルム
を焼付・現像してネガフイルムとなし、次いで別
に自動作図機にて部品図の未現像ポジフイルムを
作成し、これに前記ネガフイルムを焼付・現像し
て実装図を得ることを特徴とするものである。
For this reason, in the present invention, in a mounting diagram creation method that combines the pattern of the component mounting surface of a printed wiring board and a component diagram, an undeveloped positive film for a component diagram mask is created using an automatic drawing machine, and A positive film of the pattern created with an automatic drawing machine is printed and developed to make a negative film, and then an undeveloped positive film of the parts diagram is separately created with an automatic drawing machine, and the negative film is printed and developed on this. This method is characterized in that an implementation drawing is obtained using the method.

以下、添付図に基づいて本発明の実施例につき
詳細に説明する。
Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.

第4図に実施例の作成手順を示す。図により説
明すると、先ず自動作図機を用いて予め位置合わ
せ用基準孔をあけた生フイルムにプリント配線板
の部品搭載面のパターンを画かせたのち現像して
第4図aに示す如くパターン11を有するポジフ
イルム12を作成する。次に同様の手順により第
4図bの如き部品図のマスク13を有する未現像
の部品図マスク用ポジフイルム14を作成する。
次に第4図cの如く、未現像の部品図マスク用ポ
ジフイルム14に前記のパターンのポジフイルム
12を焼付機にて焼付け、現像して第4図dの如
く部品図の線と交差する部分が切断されたパター
ン11′を有するネガフイルム15とする。次に
自動作図機にて予め位置合わせ用基準孔をあけた
生フイルムに第4図eの如く部品図16を画かせ
て部品図の未現像ポジフイルム17を作成する。
次いで第4図fの如く前記部品図の未現像フイル
ム17にパターンのネガフイルム15を焼付け、
現像すれば第4図gの如く部品図16の線とパタ
ーン11′とが交差しない実装図18を得ること
ができる。
FIG. 4 shows the preparation procedure of the embodiment. To explain with a diagram, first, the pattern of the component mounting surface of the printed wiring board is drawn on a raw film with pre-drilled reference holes for positioning using an automatic drawing machine, and then developed to form a pattern 11 as shown in FIG. 4a. A positive film 12 is prepared. Next, an undeveloped parts diagram masking positive film 14 having a parts diagram mask 13 as shown in FIG. 4B is prepared by the same procedure.
Next, as shown in FIG. 4c, the positive film 12 with the above-mentioned pattern is printed on the undeveloped parts drawing mask positive film 14 using a printing machine, and is developed to intersect the lines of the parts drawing as shown in FIG. 4d. A negative film 15 is provided which has a pattern 11' in which parts are cut. Next, an undeveloped positive film 17 of the part diagram is created by drawing a part diagram 16 as shown in FIG.
Next, as shown in FIG. 4f, a negative film 15 with a pattern is printed on the undeveloped film 17 of the part diagram.
When developed, it is possible to obtain a mounting diagram 18 as shown in FIG. 4g in which the lines of the component diagram 16 and the pattern 11' do not intersect.

以上説明した実施例においては使用した生フイ
ルムが、パターンのポジ12とパターンのネガ1
5と実装図18の3枚である。これに対し第3図
で説明した従来方法では部品図マスク用ポジ4と
パターンのポジ5とパターンのネガ6aと実装図
10の4枚である。従つて本発明方法では高価な
シートフイルムを1枚節約し、更にこれに対する
基準孔あけ、焼付・現像などの工数も節減するこ
とができる。
In the embodiment described above, the raw films used are pattern positive 12 and pattern negative 1.
5 and mounting diagram 18. On the other hand, in the conventional method explained with reference to FIG. 3, there are four sheets: a positive 4 for a component diagram mask, a positive 5 for a pattern, a negative 6a for a pattern, and a mounting diagram 10. Therefore, in the method of the present invention, one expensive sheet film can be saved, and the man-hours for drilling reference holes, printing, and developing can also be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はプリント配線板の実装図、第2図は自
動作図機の斜視図、第3図はプリント配線板の実
装図の従来の作成方法の作成手順の説明図、第4
図は本発明にかかる実施例のプリント配線板の実
装図の作成方法の作成手順説明図である。 11,11′……パターン、12……パターン
ポジフイルム、13……部品図マスク、14……
部品図マスク用ポジフイルム、15……パターン
のネガフイルム、16……部品図、17……部品
図未現像フイルム、18……実装図。
Figure 1 is an assembly diagram of a printed wiring board, Figure 2 is a perspective view of an automatic drawing machine, Figure 3 is an explanatory diagram of the procedure for creating a conventional method for creating an assembly diagram of a printed wiring board, and Figure 4
The figure is an explanatory diagram of the procedure for creating a mounting diagram of a printed wiring board according to an embodiment of the present invention. 11, 11'...Pattern, 12...Pattern positive film, 13...Parts drawing mask, 14...
Positive film for parts diagram mask, 15... Negative film of pattern, 16... Parts diagram, 17... Parts diagram undeveloped film, 18... Mounting diagram.

Claims (1)

【特許請求の範囲】[Claims] 1 プリント配線板の部品搭載面のパターンと部
品図とを合成する実装図作成方法において、自動
作図機にて部品図マスク用の未現像ポジフイルム
を作成し、これに予め自動作図機にて作成したパ
ターンのポジフイルムを焼付・現像してネガフイ
ルムとなし、次いで別に自動作図機にて部品図の
未現像ポジフイルムを作成し、これに前記ネガフ
イルムを焼付・現像して実装図を得ることを特徴
とするプリント配線板の実装図作成方法。
1 In a mounting diagram creation method that combines the pattern of the component mounting surface of a printed wiring board and a component diagram, an undeveloped positive film for a component diagram mask is created using an automatic drawing machine, and a A positive film of the pattern is printed and developed to make a negative film, and then an undeveloped positive film of a component diagram is separately created using an automatic drawing machine, and the negative film is printed and developed on this to obtain a mounting diagram. A method for creating an assembly diagram of a printed wiring board, which is characterized by:
JP8375681A 1981-06-02 1981-06-02 Method of forming mounting group of printed circuit board Granted JPS57199293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8375681A JPS57199293A (en) 1981-06-02 1981-06-02 Method of forming mounting group of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8375681A JPS57199293A (en) 1981-06-02 1981-06-02 Method of forming mounting group of printed circuit board

Publications (2)

Publication Number Publication Date
JPS57199293A JPS57199293A (en) 1982-12-07
JPS632106B2 true JPS632106B2 (en) 1988-01-16

Family

ID=13811389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8375681A Granted JPS57199293A (en) 1981-06-02 1981-06-02 Method of forming mounting group of printed circuit board

Country Status (1)

Country Link
JP (1) JPS57199293A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11505635B2 (en) 2011-12-30 2022-11-22 Bridgestone Corporation Nanoparticle fillers and methods of mixing into elastomers

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2633100B2 (en) * 1991-04-09 1997-07-23 株式会社クボタ Bucket on bucket conveyor
JP2633112B2 (en) * 1991-07-08 1997-07-23 株式会社クボタ Bucket on bucket conveyor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11505635B2 (en) 2011-12-30 2022-11-22 Bridgestone Corporation Nanoparticle fillers and methods of mixing into elastomers

Also Published As

Publication number Publication date
JPS57199293A (en) 1982-12-07

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