JPS6322733U - - Google Patents

Info

Publication number
JPS6322733U
JPS6322733U JP11629686U JP11629686U JPS6322733U JP S6322733 U JPS6322733 U JP S6322733U JP 11629686 U JP11629686 U JP 11629686U JP 11629686 U JP11629686 U JP 11629686U JP S6322733 U JPS6322733 U JP S6322733U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
turntable
heating means
semiconductor
raising
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11629686U
Other languages
Japanese (ja)
Other versions
JPH0410689Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11629686U priority Critical patent/JPH0410689Y2/ja
Publication of JPS6322733U publication Critical patent/JPS6322733U/ja
Application granted granted Critical
Publication of JPH0410689Y2 publication Critical patent/JPH0410689Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体製造装置の一実施
例を示す概略側面図、第２図は第１図の装置の変
形例を示す概略側面図、第３図は本考案に係る半
導体製造装置の他の実施例を示す概略斜視図、第
４図は在来の半導体製造装置を示す概略側面図で
ある。 １……ターンテーブル、２……薬液、１０……
加熱用光源〔加熱用手段〕、１０′……レーザ発
生器〔加熱用手段〕、Ｗ……半導体ウエーハ。 FIG. 1 is a schematic side view showing an embodiment of a semiconductor manufacturing device according to the present invention, FIG. 2 is a schematic side view showing a modification of the device in FIG. 1, and FIG. 3 is a semiconductor manufacturing device according to the present invention. FIG. 4 is a schematic perspective view showing another embodiment of the present invention, and FIG. 4 is a schematic side view showing a conventional semiconductor manufacturing apparatus. 1... Turntable, 2... Chemical solution, 10...
Heating light source [heating means], 10'... laser generator [heating means], W... semiconductor wafer.

Claims (1)

【実用新案登録請求の範囲】 ターンテーブルによつて半導体ウエーハを水平
に支持し、この半導体ウエーハ表面に所定の液を
供給して薬液処理を行なう装置において、 上記ターンテーブルの上方に半導体ウエーハ表
面に供給された薬液を昇温するための加熱用手段
を備えたことを特徴とする半導体製造装置。[Claims for Utility Model Registration] In an apparatus for performing chemical treatment by horizontally supporting a semiconductor wafer with a turntable and supplying a predetermined liquid to the surface of the semiconductor wafer, a device is placed above the turntable on the surface of the semiconductor wafer. A semiconductor manufacturing apparatus comprising a heating means for raising the temperature of a supplied chemical solution.
JP11629686U 1986-07-29 1986-07-29 Expired JPH0410689Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11629686U JPH0410689Y2 (en) 1986-07-29 1986-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11629686U JPH0410689Y2 (en) 1986-07-29 1986-07-29

Publications (2)

Publication Number Publication Date
JPS6322733U true JPS6322733U (en) 1988-02-15
JPH0410689Y2 JPH0410689Y2 (en) 1992-03-17

Family

ID=31000752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11629686U Expired JPH0410689Y2 (en) 1986-07-29 1986-07-29

Country Status (1)

Country Link
JP (1) JPH0410689Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223394A (en) * 1999-01-29 2000-08-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
US7237561B2 (en) 2001-01-13 2007-07-03 Samsung Electronics Co., Ltd. Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same
JP2010245575A (en) * 2002-05-28 2010-10-28 Shibaura Mechatronics Corp Spin processing apparatus and spin processing method
JP2023099359A (en) * 2021-12-30 2023-07-12 セメス株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6008384B2 (en) * 2012-03-15 2016-10-19 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
US12399064B2 (en) * 2018-08-22 2025-08-26 Beijing E-town Semiconductor Technology Co., Ltd. Systems and methods for thermal processing and temperature measurement of a workpiece at low temperatures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223394A (en) * 1999-01-29 2000-08-11 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
US7237561B2 (en) 2001-01-13 2007-07-03 Samsung Electronics Co., Ltd. Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same
JP2010245575A (en) * 2002-05-28 2010-10-28 Shibaura Mechatronics Corp Spin processing apparatus and spin processing method
JP2023099359A (en) * 2021-12-30 2023-07-12 セメス株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Also Published As

Publication number Publication date
JPH0410689Y2 (en) 1992-03-17

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