JPS6322775U - - Google Patents
Info
- Publication number
- JPS6322775U JPS6322775U JP11462286U JP11462286U JPS6322775U JP S6322775 U JPS6322775 U JP S6322775U JP 11462286 U JP11462286 U JP 11462286U JP 11462286 U JP11462286 U JP 11462286U JP S6322775 U JPS6322775 U JP S6322775U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- printed circuit
- component mounting
- resistance layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
第１図の部品取付側より見た説明図、第３図は本
考案の一実施例でプリント回路板の最終組立時の
断面図である。
１……プリント回路板、２……はんだ付けラン
ド、３……部品取付穴（先付部品用）、４……は
んだ付抵抗層、５……はんだ付抵抗層、６……部
品取付穴、７……空気抜き用穴、８……はんだ付
抵抗層、９……はんだ、１０……先付部品、１１
……部品リード、１２……後付部品。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an explanatory diagram as seen from the component mounting side of Fig. 1, and Fig. 3 is an embodiment of the present invention during final assembly of the printed circuit board. FIG. 1... Printed circuit board, 2... Soldering land, 3... Component mounting hole (for pre-attached parts), 4... Soldering resistance layer, 5... Soldering resistance layer, 6... Component mounting hole, 7...Air vent hole, 8...Soldered resistance layer, 9...Solder, 10...Pre-attached parts, 11
...Parts lead, 12...Retrofitted parts.
Claims (1)
品取付穴において、部品取付側の部品穴にはんだ
揚り防止およびはんだ付け時の浮き防止をするは
んだ付抵抗層を形成し、かつ、はんだ付け時の空
気抜き用穴を形成したことを特徴とするプリント
回路板。 In component mounting holes with soldering lands on printed circuit boards, a soldering resistance layer is formed in the component hole on the component mounting side to prevent solder from rising and floating during soldering, and to vent air during soldering. A printed circuit board characterized by having holes formed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11462286U JPS6322775U (en) | 1986-07-28 | 1986-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11462286U JPS6322775U (en) | 1986-07-28 | 1986-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322775U true JPS6322775U (en) | 1988-02-15 |
Family
ID=30997536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11462286U Pending JPS6322775U (en) | 1986-07-28 | 1986-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322775U (en) |
-
1986
- 1986-07-28 JP JP11462286U patent/JPS6322775U/ja active Pending
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