JPS63234591A - Case - Google Patents
CaseInfo
- Publication number
- JPS63234591A JPS63234591A JP6798987A JP6798987A JPS63234591A JP S63234591 A JPS63234591 A JP S63234591A JP 6798987 A JP6798987 A JP 6798987A JP 6798987 A JP6798987 A JP 6798987A JP S63234591 A JPS63234591 A JP S63234591A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- built
- case
- temperature
- thermal shock
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、例えば航空機等に搭載され温度変化が急激
となる環境下で使用する電子回路ユニットを、熱衝撃か
ら保護する場合に使用して好適なケースに関する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) This invention protects an electronic circuit unit mounted on an aircraft or the like and used in an environment where temperature changes rapidly from thermal shock. Concerning suitable cases for use.
（従来の技術）
従来、電子回路ユニットなどの被内蔵物を保温又は冷却
するために、夫々独自の対策が講じられている。しかし
、周囲温度が高温から低温へ、又はその逆となる環境が
繰返されるいわゆる熱衝撃が与えられるものでは、充分
でなかった。例えば、航空機搭載機器においては熱衝撃
が加わり、保温又は冷却対策では充分ではない。(Prior Art) Conventionally, unique measures have been taken to insulate or cool built-in objects such as electronic circuit units. However, it was not sufficient to apply a so-called thermal shock in which the ambient temperature repeatedly changes from a high temperature to a low temperature or vice versa. For example, thermal shock is applied to aircraft-mounted equipment, and heat insulation or cooling measures are not sufficient.
（発明が解決しようとする問題点）
以上述べたように、従来のケースでは、被内蔵物を熱衝
撃と高温から同時に保護することが出来ない。(Problems to be Solved by the Invention) As described above, in the conventional case, it is not possible to protect the built-in object from thermal shock and high temperature at the same time.
この発明は、上記問題点を解消するためになされたもの
で、被内蔵物を熱衝撃と同時に高温による破損から保護
することが出来るケースを提供することを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a case that can protect built-in objects from thermal shock and damage due to high temperatures.
［発明の構成］
（問題点を解決するための手段）
上記目的を達成するためにこの発明では、容器の内面に
低熱伝導物質からなる第１層を形成し、更にこの第１層
の内面に大熱容量物質からなる第２層を形成したもので
ある。[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, in this invention, a first layer made of a low thermal conductive material is formed on the inner surface of the container, and further, a A second layer made of a large heat capacity material is formed.
（作用）
この発明のケースでは、被内蔵物を大熱容量物質からな
る第２層で囲むと共に、更に低熱伝導物質からなる第１
層で囲んでいるので、被内蔵物の湿度の急激な変化を抑
えると同時に、湿度上昇を抑えることが出来る。この結
果、被内蔵物を熱衝撃と同時に高温による破損から保護
することが出来る。(Function) In the case of this invention, the built-in object is surrounded by the second layer made of a high heat capacity material, and the first layer made of a low thermal conductivity material.
Since it is surrounded by a layer, it is possible to suppress sudden changes in the humidity of the built-in object and at the same time suppress increases in humidity. As a result, the built-in object can be protected from thermal shock and damage due to high temperatures.
（実施例）
以下、図面を参照して、この発明の一実施例を詳細に説
明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
この発明のケースは、第１図に示すように構成され、例
えば金属や樹脂などからなる容器１の内面には、例えば
セラミックファイバや多孔質セラミックなどの低熱伝導
物質からなる第１層２が形成されている。この第１層２
の内面には、例えばシリコンなどの大熱容量物質からな
る第２層３が形成されている。尚、使用に当たっては、
電子回路ユニットなどの被内蔵物４が、第２層３の内側
に収容され、蓋５が閉められる。The case of the present invention is constructed as shown in FIG. 1, and a first layer 2 made of a low heat conductive material such as ceramic fiber or porous ceramic is formed on the inner surface of a container 1 made of metal, resin, etc. has been done. This first layer 2
A second layer 3 made of a high heat capacity material such as silicon is formed on the inner surface of the second layer 3 . In addition, when using
A built-in object 4 such as an electronic circuit unit is housed inside the second layer 3, and the lid 5 is closed.
［発明の効果コ
以上述べたようにこの発明によれば、被内蔵物４を大熱
容量物質からなる第２層３で囲むと共に、更に低熱伝導
物質からなる第１層２で囲んでいるので、被内蔵物４の
温度の急激な変化を抑えると同時に、温度上昇を抑える
ことが出来る。この結果、被内蔵物４を熱衝撃と同時に
高温による破損から保護することが出来る。[Effects of the Invention] As described above, according to the present invention, the built-in object 4 is surrounded by the second layer 3 made of a high heat capacity material and further surrounded by the first layer 2 made of a low thermal conductivity material. Rapid changes in the temperature of the built-in object 4 can be suppressed, and at the same time, temperature rise can be suppressed. As a result, the built-in object 4 can be protected from thermal shock and damage due to high temperatures.
即ち、発明者の実験によれば、電子回路ユニットをこの
発明のケースに収容して、２００℃の炉内に投入した場
合、電子回路ユニットの温度は、２時間後に１６０℃〜
１７０℃までしか上昇しなかった。That is, according to the inventor's experiments, when an electronic circuit unit is housed in the case of the present invention and placed in a 200°C furnace, the temperature of the electronic circuit unit decreases from 160°C to 160°C after 2 hours.
The temperature only rose to 170°C.
第１図及び第２図はこの発明の一実施例に係るケースを
示す横断面図と縦断面図である。
１・・・容器、２・・・第１層、３・・・第２Ｈ１４・
・・被内蔵物。1 and 2 are a cross-sectional view and a vertical cross-sectional view showing a case according to an embodiment of the present invention. 1... Container, 2... First layer, 3... Second H14.
・Internal objects.
Claims (1)
と、この第１層の内面に形成された大熱容量物質からな
る第２層とを具備することを特徴とするケース。A case comprising: a first layer made of a low thermal conductivity material formed on the inner surface of the container; and a second layer made of a high heat capacity material formed on the inner surface of the first layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6798987A JPS63234591A (en) | 1987-03-24 | 1987-03-24 | Case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6798987A JPS63234591A (en) | 1987-03-24 | 1987-03-24 | Case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63234591A true JPS63234591A (en) | 1988-09-29 |
Family
ID=13360890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6798987A Pending JPS63234591A (en) | 1987-03-24 | 1987-03-24 | Case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63234591A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008217A (en) * | 1990-06-08 | 1991-04-16 | At&T Bell Laboratories | Process for fabricating integrated circuits having shallow junctions |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933224B2 (en) * | 1976-04-30 | 1984-08-14 | 株式会社東芝 | Diaphragm electrode cleaning device |
-
1987
- 1987-03-24 JP JP6798987A patent/JPS63234591A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933224B2 (en) * | 1976-04-30 | 1984-08-14 | 株式会社東芝 | Diaphragm electrode cleaning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5008217A (en) * | 1990-06-08 | 1991-04-16 | At&T Bell Laboratories | Process for fabricating integrated circuits having shallow junctions |
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