JPS6324840U - - Google Patents

Info

Publication number
JPS6324840U
JPS6324840U JP1986119109U JP11910986U JPS6324840U JP S6324840 U JPS6324840 U JP S6324840U JP 1986119109 U JP1986119109 U JP 1986119109U JP 11910986 U JP11910986 U JP 11910986U JP S6324840 U JPS6324840 U JP S6324840U
Authority
JP
Japan
Prior art keywords
film carrier
ics
mounting
finger leads
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986119109U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0631723Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986119109U priority Critical patent/JPH0631723Y2/ja
Publication of JPS6324840U publication Critical patent/JPS6324840U/ja
Application granted granted Critical
Publication of JPH0631723Y2 publication Critical patent/JPH0631723Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1986119109U 1986-08-01 1986-08-01 半導体装置 Expired - Lifetime JPH0631723Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986119109U JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986119109U JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Publications (2)

Publication Number Publication Date
JPS6324840U true JPS6324840U (mo) 1988-02-18
JPH0631723Y2 JPH0631723Y2 (ja) 1994-08-22

Family

ID=31006180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986119109U Expired - Lifetime JPH0631723Y2 (ja) 1986-08-01 1986-08-01 半導体装置

Country Status (1)

Country Link
JP (1) JPH0631723Y2 (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030057184A (ko) * 2001-12-28 2003-07-04 동부전자 주식회사 반도체패키지 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58106951U (ja) * 1982-01-13 1983-07-21 セイコーエプソン株式会社 半導体集積回路実装構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58106951U (ja) * 1982-01-13 1983-07-21 セイコーエプソン株式会社 半導体集積回路実装構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030057184A (ko) * 2001-12-28 2003-07-04 동부전자 주식회사 반도체패키지 및 그 제조 방법

Also Published As

Publication number Publication date
JPH0631723Y2 (ja) 1994-08-22

Similar Documents

Publication Publication Date Title
JPS6324840U (mo)
JPS63114001U (mo)
JPS62168677U (mo)
JPS61206281U (mo)
JPS5818775U (ja) シ−トブツクの構造
JPS63182160U (mo)
JPH01100449U (mo)
JPS647569U (mo)
JPS60146657U (ja) ピンセツト
JPH0243264U (mo)
JPH01165603U (mo)
JPS61186243U (mo)
JPS61156243U (mo)
JPH0227800U (mo)
JPS6324822U (mo)
JPH01130546U (mo)
JPS6365266U (mo)
JPS6170948U (mo)
JPS63111463U (mo)
JPS6186973U (mo)
JPH0467321U (mo)
JPS6420965U (mo)
JPS6349252U (mo)
JPS611850U (ja) 半導体素子
JPH0385630U (mo)