JPS6324841U - - Google Patents

Info

Publication number
JPS6324841U
JPS6324841U JP1986117704U JP11770486U JPS6324841U JP S6324841 U JPS6324841 U JP S6324841U JP 1986117704 U JP1986117704 U JP 1986117704U JP 11770486 U JP11770486 U JP 11770486U JP S6324841 U JPS6324841 U JP S6324841U
Authority
JP
Japan
Prior art keywords
semiconductor device
metal frame
thickness
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986117704U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986117704U priority Critical patent/JPS6324841U/ja
Publication of JPS6324841U publication Critical patent/JPS6324841U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体装置の断面
図、第２図は本考案の他の実施例の半導体装置の
断面図、第３図は第２図のＡ―Ｂ線に沿つて切断
して見た断面図、第４図は本考案のさらに他の実
施例の半導体装置の断面図、第５図は従来技術の
大パワー用パツケージの斜視図である。 １……モールド樹脂、２……ボンデイング・ワ
イヤー、３……半導体チツプ、４……リード、５
……放熱板を兼ねた金属フレーム、６……リード
と櫛状になつている放熱板とを兼ねた金属フレー
ム、７……プリント基板、８……放熱板となるフ
レーム。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) デユアル・インライン・パツケージを有す
    る半導体装置において、前記パツケージの裏主面
    に半導体チツプが固着された金属フレームを露出
    させたことを特徴とする半導体装置。 (2) 金属フレームは、その厚さがリードの厚さ
    と略同一であることを特徴とする実用新案登録請
    求の範囲第(1)項記載の半導体装置。
JP1986117704U 1986-07-30 1986-07-30 Pending JPS6324841U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986117704U JPS6324841U (ja) 1986-07-30 1986-07-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986117704U JPS6324841U (ja) 1986-07-30 1986-07-30

Publications (1)

Publication Number Publication Date
JPS6324841U true JPS6324841U (ja) 1988-02-18

Family

ID=31003464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986117704U Pending JPS6324841U (ja) 1986-07-30 1986-07-30

Country Status (1)

Country Link
JP (1) JPS6324841U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996001524A1 (fr) * 1994-07-04 1996-01-18 Seiko Epson Corporation Oscillateur piezo-electrique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996001524A1 (fr) * 1994-07-04 1996-01-18 Seiko Epson Corporation Oscillateur piezo-electrique

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